Njengamanje, izinto eziphilayo ikakhulukazi epoxy resin izinto ngamanani aphansi futhi art ovuthiwe ingxenye enkulu namanje ukukhiqizwa PCB, futhi ezivamile eziphilayo ephrintiwe wesifunda ibhodi kusukela ngezici ezimbili zokusebenzisa ukushabalalisa ukushisa futhi ezishisayo ukunwetshwa Coefficient afanayo ubulili, ayikwazi ukuhlangabezana nezidingo Semiconductor wesifunda ukuhlanganiswa ithuthukisa impahla unceasingly.Ceramic has ezinhle imvamisa high ukusebenza kanye nokusebenza ngogesi, futhi high conductivity ezishisayo, amakhemikhali ukuzinza nokusimama ezishisayo of substrates organic ezifana akudingeki ukusebenza okuhle, isizukulwane esisha ngezinga elikhulu wesifunda okuhlangene namandla module electronic ekahle emaphaketheni material.Therefore, eminyakeni yamuva, Bobumba PCB Boardithole ukunakwa okukhulu ukuthuthukiswa ngokushesha.
Bobumba wesifunda ibhodi metallized Ceramic ezisekelwe substrate nge izakhiwo ezinhle ezishisayo kukagesi, uhlobo amandla encapsulation LED, impahla kakhulu, ukukhanya onsomi, ultraviolet (MCM) futhi ikakhulukazi abaningi chip amaphakheji substrates ezifana kunenze nisondelane oqondile (COB) chip encapsulation isakhiwo; ngesikhathi esifanayo, it lungasetshenziswa njengoba ukushabalalisa ukushisa wesifunda ibhodi ezinye amandla high-amandla Semiconductor amamojuli, inkinobho enkulu wamanje, edluliselwe, ezokuxhumana umkhakha antenna, ukuhlunga, inverter solar, njll
Njengamanje, ukuthuthukiswa ukusebenza kahle eliphezulu, high density, namandla okusezingeni eliphezulu embonini LED ekhaya aphesheya, kungabonwa kusuka 2017 kuya 2018, ilinganiselwa yasekhaya LED a wathuthuka ngokushesha, ukhula amandla, ukuthuthukiswa Yizinga eliphakeme ka ukushabalalisa ukushisa impahla isibe esiphuthumayo ukuxazulula inkinga ye LED dissipation.In jikelele ukushisa, LED kahle elikhanyayo futhi inkonzo nokuphila enqaba nokwanda lokushisa okuhlangana kuyo, lapho izinga lokushisa kwalapho kuhlangana 125 ℃ ngenhla, LED can avele oda ngisho failure.In ukugcina lokushisa LED ezingeni lokushisa ongaphakeme, high conductivity ezishisayo, ongaphakeme ukushisa ukumelana futhi inqubo emaphaketheni ezinengqondo kumele yokutholwa ukunciphisa jikelele ukumelana ezishisayo of LED.
Epoxy zethusi substrates abagqoke kukhona esetshenziswa kakhulu substrates yendabuko packaging.It electronic unezinhlobo ezintathu: ukwesekwa, conduction nezici insulation.Its eziyinhloko: eziphansi, okusezingeni eliphezulu umswakama ukumelana, ukuminyana ongaphakeme, kulula inqubo, kulula bona micrographics wesifunda , efanelekayo mass production.But ngenxa FR - 4 base okokusebenza epoxy resin, izinto eziphilayo of ongaphakeme conductivity ezishisayo, izinga lokushisa eliphakeme ukumelana ayiyinhle, ngakho FR - 4 abakwazi ukuzivumelanisa high density, amandla LED okusezingeni eliphezulu izidingo emabhokisini ngokuvamile isetshenziswa kuphela ku amandla amancane emaphaketheni LED.
Bobumba substrate izinto ngokuyinhloko Alumina, Aluminium nitride, Sapphire, High Borosilicate Glass, njll Uma kuqhathaniswa nezinye izinto substrate, substrate Ceramic ine izici ezilandelayo zokuhlola mechanical, izakhiwo kagesi kanye izakhiwo ezishisayo:
(1) Izakhiwo Mechanical: amandla Mechanical kungaba esetshenziswa njengoba asekelayo izingxenye; ukucubungula Good, ukunemba okuphezulu ntathu; Smooth ebusweni, akukho microcracks, eguqa, njll
(2) izakhiwo Thermal: i conductivity ezishisayo likhulu, lo ezishisayo ukunwetshwa Coefficient is ifaniswe ne Si futhi Gaas nezinye izinto chip, kanye ukumelana ukushisa muhle.
(3) Izakhiwo agesi: I njalo Kwe-dielectric Heating uphansi, ukulahlekelwa Kwe-dielectric Heating incane, ukumelana ukwahlukanisa kanye ukwehluleka ukwahlukanisa ziphezulu, ukusebenza uzinzile ngaphansi lokushisa eliphezulu kanye nomswakama high, futhi nokwethenjelwa kuphezulu.
(4) Ezinye izimpahla: Good chemical ukuzinza, akukho ukumuncwa umswakama; Oil ukumelana namakhemikhali ukumelana; Non-anobuthi, ukungcola-free, i-alpha ray ekushayweni incane; Isakhiwo crystal uqinile, futhi akulula ukushintsha lokushisa range.Abundant izinsiza impahla eluhlaza.
Kwaphela isikhathi eside, Al2O3 main substrate impahla kwamandla okusezingeni eliphezulu packaging.But le conductivity ezishisayo of Al2O3 liphansi, kanye ezishisayo ukunwetshwa Coefficient ayifani material.Therefore chip, ngokuya ukusebenza, izindleko kanye nokuvikelwa kwemvelo, le substrate impahla alikwazi impahla ekahle kakhulu ukuthuthukiswa ephezulu amandla amadivayisi LED esikhathini esizayo. Aluminium nitride zobumba nge high ukushisa conductivity, namandla high, okusezingeni eliphezulu ukumelana izinga, ukuminyana encane, ongaphakeme njalo Kwe-dielectric Heating, non-enobuthi, kanye izakhiwo kakhulu ezifana ezishisayo ukunwetshwa Coefficient oluhambisana ne Si, kancane kancane uyokwazi ukukhuluma esikhundleni bendabuko ephezulu amandla LED substrate impahla, ziye zaba ngomunye wemikhakha ethembisayo esizayo Ceramic substrate izinto, ukuhlinzeka mkhulu kunezinhliziyo 180W ~ 220w / Mk, KingSong inikeza Ceramic wesifunda amabhodi ephrintiwe izidingo zakho PCB.