1. Kungani imfuneko wesifunda ibhodi flat kakhulu
Esikhathini othomathikhi Ukufakwa umugqa, uma ibhodi ukuphrinta wesifunda akasona isicaba, kuzobangela indawo zingalungi, yezingxenye ayikwazi ufakwa imbobo kanye ebusweni ipuleti, ngisho ipulaki othomathikhi loader.When ibhodi PCB okuyinto ababebuthene ingxenye is eziphothene ngemva nokunamathisela ngomthofu, unyawo element kunzima ukuba ahlukaniswe neatly.The PCB ibhodi futhi azikwazi ukufakwa ebhokisini umshini noma isokhethi ku umshini, kunjalo, PCB inhlangano ifektri umhlangano ipuleti esontekile kubuye kakhulu troublesome.At Njengamanje, ibhodi ukuphrinta wesifunda uye bengena enkathini ka ukufakwa kwamanzi futhi ukufakwa chip, futhi ephrintiwe wesifunda ibhodi inhlangano isitshalo kufanele kube ngaphezulu futhi esiqinile ngaphezulu imfuneko plate asesonte.
2. esezingeni test Izindlela eziqondileyo
Ngokwe-United States IPC-6012 (edition 1996) << eqinile nakho ngeke kusize ephrintiwe wesifunda ibhodi ukuhlonza kanye nokusebenza Ukucaciswa >>, le ovumelekile warping esiphezulu futhi ukuhlanekezela ebusweni obandayo ipuleti kuyinto 0.75%, futhi zonke amabhodi PCB avunyelwe 1.5% .Le kwakhulisa izimfuneko ebusweni obandayo ipuleti ibhodi IPC-RB-276 (1992 version) .Okwamanje, emicwini eqondile degree yelayisensi ngayinye electronic PCB inhlangano isitshalo, kungakhathaliseki double noma multi-ungqimba PCB, 1.6mm ukujiya, ngokuvamile 0.70 ~ 0.75%, abaningi SMT, BGA ipuleti, lokudzingekako 0.5% .Abanye electronics izimboni kuthiwa umoya wokuba nabo banda ngamaphesenti angu 0.3 ezindinganisweni warping, kanye izinyathelo test warping ulandele gb4677. 5-84 noma IPC-tm-650.2.4.22b.Put PCB ibhodi on a yesikhulumi iqinisekisiwe, isivivinyo inaliti wafiphaza degree wendawo ngobukhulu, ukuhlola ubukhulu yenaliti, kuhlukaniswa ngobude ejikeni PCB ibhodi, asonte degree of the ephrintiwe wesifunda ibhodi ingabalwa.
3. Warping ngesikhathi yokukhiqiza inqubo
1. Engineering design: Umklamo ibhodi ukuphrinta wesifunda kufanele kuqashelwe:
A. ilungiselelo prepreg phakathi laphakathi kufanele kube ziyalingana, ezifana laminates eziyisithupha PCB IBhodi , ukushuba 1 ~ 2 futhi 5 ~ 6 izingqimba kufanele uhambisane nenani izingcezu semi eqina, kungenjalo ingcindezi ungqimba kuyoba lula wafiphaza.
B. Multi-laminated PCB core kanye amaphilisi semi belashwa kufanele lisetshenziswe imikhiqizo umphakeli esifanayo sika.
C. endaweni yangaphandle A no B imigqa kufanele kube abantu abahlobene eduze njengamadodana possible.If Ubuso kuyinto A zethusi enkulu, no-B kuphela A imigqa embalwa, plate Kulula wafiphaza ngemva etching.If izinhlangothi ezimbili we umugqa endaweni umehluko mkhulu kakhulu, ungakwazi ukwengeza igridi ezinye ngabandayo ohlangothini mafutha, ukuze ulinganisele.
2, Baking ibhodi ngaphambi ukusika:
CCL baking PCB ibhodi ngaphambi ukusika (degrees 150, 8 ± 2 amahora) ngenjongo kuyinto ukususa umswakama ngaphakathi ebhodini, futhi wenze resin belashwa ngaphakathi ipuleti, eminye ekuqedeni ukucindezeleka asalile plate, okuyinto kuyasiza ukuvimbela ibhodi warping.At bekhona, abaningi PCB double emaceleni, multi-ungqimba PCB amabhodi namanje abanamathela pre-iyathula noma post-baking step.But kukhona eminye PCB ibhodi yokukhiqiza yenkampani, manje ibhodi PCB wesifunda ifektri baking ibhodi imithetho isikhathi futhi esingalingani, ezisukela amahora 4 kuya ku-10, basikisela ukuthi le ekilasini ngokuvumelana ukukhiqizwa ephrintiwe wesifunda ibhodifuthi ikhasimende ukufunwa asonte degrees decide.Cut zibe izicucu noma ngemva wonke ucezu Bhaka amakhekhe kuhhavini usike impahla, izindlela ezimbili kukhona nokwenzeka, kunconywa ukusika ibhodi emva ukusika. Ibhodi kwangaphakathi kufanele futhi iphele ebhodini.
3. emicwini eqondile futhi weft ka prepreg:
Emva yokuvikela ngocwazi prepreg, le ukuncipha emicwini eqondile futhi weft izinkomba ihlukile, futhi emicwini eqondile futhi weft izinkomba kumele ahlukaniswe lapho iyathula futhi stacking.Otherwise, kulula wafiphaza plate esiphelele emva laminating, ngisho noma kunzima ukulungisa. Multi-ungqimba PCB warping izizathu, eziningi yokuvikela ngocwazi we prepreg lapho emicwini eqondile futhi weft akazange ukuhlukanisa phakathi, ukuphindwa ngokungakhethi kubangelwa.
Indlela ukuhlukanisa phakathi nobude? Roll prepreg usongwa isiqondiso iyona eziqondileyo kanye isiqondiso ububanzi iyona weft; ithusi ucwecwe ibhodi Ngasohlangothini eside latitudinal, ohlangothini emfushane eziqondileyo uma ungenaso isiqiniseko ukuthi thintana nomenzi noma umphakeli.
4. Ukucindezeleka ngemva laminating:
multilayer PCB ibhodi ngasemuva gcina hot-ngokucindezela abandayo cindezela cut noma Milling burrs ke flat bayobhaka kuhhavini 150 degrees Celsius 4 amahora, ukuze ukucindezeleka intraplate kancane kancane ukukhulula futhi wenze resin belashwa , lesi sinyathelo ivinjelwe.
5. Isidingo ukuze uqondise ipuleti ezondile ngenkathi Plating:
0.4 ~ 0.6mm mncane multi-ungqimba PCB ibhodi ngenxa Plating wesifunda ebhodi kanye Plating ingcaca kumele eyenziwe ekhethekile awunqunte roll, othomathikhi Plating umugqa phezu isiqeshana Feiba eshidini, nge round ibha sonke isiqeshana kwi Fiba Izintambo azixhunywe ndawonye ukuze uqondise yonke wesifunda amabhodi ephrintiwe roller ukuze amapuleti Plated ngeke deform. Ngaphandle Ngale ndinganiso, ngemva Plating microns amabili noma amathathu ethusi ungqimba, ishidi uzobe agobile, futhi kunzima ikhambi.
6. Ibhodi lwaluyophola emva hot air yokululama:
Emoyeni esishisayo ephrintiwe wesifunda ibhodi kuthintwa izinga lokushisa eliphezulu emkhombeni solder (mayelana 250 degrees Celsius). Ngemva isuswe, kufanele ayifake flat zemabula noma steel plate kuphole ngokwemvelo, bese okuthunyelwe ukucubungula mshini cleaned.This muhle warping ka boards.Some ifektri ukuthuthukisa ukukhanya kobuso phambili , ithini ibhodi emanzini abandayo, ngokushesha ngemva hot air yokululama ngemva imizuzwana embalwa kuleli reprocessing, ngumkhuhlane enjalo shock abandayo, yezinhlobo ezithile amabhodi kungahle kukhiqize warping, egqinsiwe noma blister.In kwalokho, umoya embhedeni elintantayo kungenziwa wanezela kuphole imishini.
7. warping ibhodi ukucutshungulwa:
Embonini kahle ephethwe, ibhodi uzoba 100% flatness isheke phezu Ukuhlolwa kokugcina. Zonke amabhodi engamukeleki PCB uzobe wakhethelwa, ibekwe kuhhavini, wabhaka at degrees 150 ingcindezi Celsius futhi elisindayo amahora 3 kuya ku-6, futhi ngaphansi ukucindezela Ukupholisa zemvelo. Khona-ke ethula ipuleti bese ususa ibhodi PCB, isheke flatness, ukuze ingxenye ebhodini kungaba basindiswe, futhi abanye wesifunda amabhodi ephrintiwe kudingeka kube izikhathi ezimbili kuya kwemithathu le Bhaka ukuze level.If anti oshiwo ngenhla -warping inqubo izinyathelo kungukuthi ukusebenza, abanye baking ibhodi kuyize, zilahlwe kuphela.