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Surface PCB Ukwelashwa Process

 

Injongo eziyisisekelo PCB ukwelashwa surface wukuqinisekisa weldability ezinhle noma performance.Because kagesi ithusi zemvelo emoyeni ivame ukuba ngesimo oxides, akunakwenzeka ukuba ahlale zethusi isikhathi eside, ngakho zethusi luyadingeka yingaba yini engakusiza .

1.Hot Air yokululama (HAL / HASL)
Zezıhlabane emoyeni yokululama, eyaziwa nangokuthi umoya oshisayo solder yokululama (eyaziwa HAL / HASL), okuyinto camera phezu PCB ebusweni amalahle oncibilikisiwe tin solder (phambili) bese usebenzisa onomfutho emoyeni kuya lonke (buhlungu) ubuchwepheshe flat, wenze njengoba injalo ungqimba zethusi namachibi ukumelana, anganikeza weldability ezinhle solder enamathela layer.The nethusi akhiwa joint ukwakha PCB compound.The kufanele bacwiliswa solder oncibilikisiwe ngesikhathi hot air conditioning.The umoya ummese Ukufikelwa ukushisa le solder ketshezi ngaphambi solder solidifies.The umoya ummese kunganciphisa ukugoba we solder phezu yethusi ukuvimbela Welding ibhuloho.

HASL Surface Ukwelashwa PCB

2.Organic Weldable Avikelayo Agent (osp)
osp libhalwe wesifunda ibhodi (PCB) zethusi ucwecwe ukwelashwa surface uhlobo ubuchwepheshe nezidingo RoHS directive.OSP kuyinto segama Organic Solderability uyalondoloza. It is yaziwa nangokuthi Organic nokunamathisela ngomthofu ifilimu, eyaziwa nangokuthi i-umvikeli ithusi, futhi yaziwa nangokuthi Preflux e English.In Kafushane, osp wembozwe Ushintshe amakhemikhali zesikhumba organic phezu ahlanzekile, copper.This angenalutho ifilimu ine anti-namachibi, ukushaqeka ezishisayo futhi umswakama ukumelana, okungase ukuvikela ebusweni ithusi nokugqwala (namachibi noma iqine) e environment.But evamile okwalandela Welding ukushisa, ifilimu zokuzivikela futhi kufanele ngokushesha isuswe ngu ecucuza kalula, ngakho nje ukwenza ehlwengekileko ithusi show esikhathini esifushane kakhulu isikhathi solder oncibilikisiwe ngokushesha abe okuqinile solder amalunga omzimba.

Osp Surface Ukwelashwa PCB

3.Full ipuleti Nickel / Gold
Plate Nickel / Gold is kuhlinzwa phezu PCB bese ezinamekwe ungqimba igolide. I Plating nickel ngokuyinhloko ukuvimbela ukwanda okusheshayo zegolide copper.Now kukhona izinhlobo ezimbili Electroplating nickel igolide: soft igolide Plating (igolide, ebusweni igolide kubukeka kodwa ayikhanyi kakhulu) futhi kanzima igolide Plating (amaqabunga abushelelezi futhi kanzima, ukugqoka-ekumelaneni , ziqukethe ezinye izici eziningana ezinjengolwazi ayibe, igolide ubukeka ukukhanya okuningi) .Soft igolide ikakhulukazi esetshenziselwa chip emaphaketheni igolide wire; igolide onzima ikakhulukazi esetshenziselwa interconnection kagesi non-Welding izindawo.

Plate Okugcwele Nickel Igolide PCB

4.Immersion Igolide
Babecwiliswa igolide camera nge aminyene, kagesi ezinhle nickel-igolide ingxubevange phezu ithusi, okungase ukuvikela PCB okwesikhathi time.In eside kwalokho, it has nokubekezelela abanye ukwelashwa surface technologies.In kwalokho, ocwilayo igolide futhi ungagwema kuqedwa yethusi, okuyinto kuyoba okunenzuzo ukuhola-ezamahala inhlangano.

Babecwiliswa Igolide Surface Ukwelashwa PCB

5.Immersion Tin
Njengoba zonke solders zisekelwe ithini ungqimba tin ingafanisa yiluphi uhlobo inqubo solder.Tin phakathi zethusi flat tin compounds zingase zimiswe, lesi sici kwenza tin esindayo has efana hot air kwakuzosuswa weldability ezinhle futhi akukho umoya oshisayo yokululama flatness yenkinga ikhanda; ukucwiliswa tin kungagcineki isikhathi eside kakhulu futhi kufanele wabutha ngokusho oda sokulungisa ithini.

Babecwiliswa Tin Surface Ukwelashwa PCB

6.Immersion Isiliva
Inqubo zesiliva phakathi enamathela organic electroless nickel Plating. Inqubo ilula futhi fast.Even lapho zihlatshwa nokushisa, umswakama kanye nekungcola, esiliva singalondoloza weldability ezinhle kodwa uzolahlekelwa luster.The yayo esiliva akanawo amandla ezinhle ezingokwenyama nickel chemical Plating / kucwila igolide ngoba akukho nickel ngaphansi ungqimba esiliva.

7.ENEPIG (Electroless Nickel Electroless Palladium Babecwiliswa Gold)
Uma beqhathaniswa nezinkulungwane ENEPIG futhi ENIG, kukhona isendlalelo palladium phakathi nickel negolide. Palladium kungavimbela lomkhuba ukugqwala kubangelwa ukusabela esikhundleni, ulungiselele egcwele ukucwiliswa gold.Gold eduze embozwe palladium, ukuhlinzeka esibonakalayo ezinhle.

8.Plating Hard Igolide
Ukuze uthuthukise impahla bafake-ekumelaneni komkhiqizo, ukwandisa isibalo Ukufakwa kanye Plating igolide kanzima.

Plating Hard Igolide Surface Ukwelashwa PCB

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