Siyakwamukela KingSong PCB Technology
Image: 4 Izinhla High Density PCB Isakhiwo Nge Babecwiliswa Igolide pads
Lokhu Elanyatheliswa Circuit iBhodi 4 Izinhla High Density PCB Isakhiwo Nge Babecwiliswa Igolide pads, elisetshenziswa Consumer Electronics, abanye like MID Tablet PC IBhodi, A PCB Circuit iBhodi Babecwiliswa Igolide Surface Finishing kuyinto enamathela phakathi isakhi kanye angenalutho PCB wesifunda ibhodi , PCB Umkhiqizi professional zethu hhayi kuphela ukunikeza 4 izingqimba ibhodi PCB, kodwa futhi 6 ungqimba PCB, 8 ungqimba PCB noma 10 ungqimba PCB njll
1.Detail PCB Ukukhiqiza amakhono:
| Cha |
Into |
IMisa Production |
prototype |
| 1 |
Izinhla |
1-8 Izinhla |
1-20 Izinhla |
| 2 |
Max. Panel Usayizi |
600 * 770mm (23.62 "* 30,31") |
600 * 770mm (23.62 "* 30,31") 500 * 1200mm (19.69 "* 47,24") |
| 3 |
Max.Board wugqinsi |
8.5mm |
8.5mm |
| 4 |
Min. iBhodi wugqinsi |
2l: 0.3mm,
4L: 0.4mm,
6L: 0.8mm |
2l: 0.2mm,
4L: 0.4mm.
6L: 0.6mm |
| 5 |
Min Inner Layer Clearance |
0.1mm (4mil) |
0.1mm (4mil) |
| 6 |
ububanzi min Line |
0.075mm (3/3 mil) |
0.075mm (3/3 mil) |
| 7 |
isikhala min Line |
0.075mm (3/3 mil) |
0.075mm (3/3 mil) |
| 8 |
Min.Hole Usayizi |
0.15mm (6mil) |
0.15mm (6mil) |
| 9 |
Min kuhlinzwa imbobo ukujiya |
20um (0.8mil) |
20um (0.8mil) |
| 10 |
Min Blind / Buried usayizi imbobo |
0.1mm (4mil) |
0.1mm (1-8layers) (4mil) |
| 11 |
PTH Dia. ukubekezelelana |
0.076mm ± (± 3mil) |
0.076mm ± (± 3mil) |
| 12 |
Non PTH Dia. ukubekezelelana |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 13 |
Hole Isikhundla ukuphambuka |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 14 |
Heavy Coppe |
4oz / 140μm |
6oz / 175μm |
| 15 |
Min S / M Pitch |
0.1mm (4mil) |
0.1mm (4mil) |
| 16 |
Soldermask umbala |
Green, omnyama, Blue, Mhlophe, Yellow, Red |
Green, omnyama, Blue, Mhlophe, Yellow, Red |
| 17 |
umbala Silkscreen |
White, Yellow, Red, Black |
White, Yellow, Red, Black |
| 18 |
Uhlaka |
Yomgudu, V-Groove, Beveling Punch |
Yomgudu, V-Groove, Beveling Punch |
| 19 |
Uhlaka Tolerance |
± 0.15mm ± 6mil |
± 0.15mm (± 6mil) |
| 20 |
imaski Peelable |
Top, phansi, kabili emaceleni |
Top, phansi, kabili emaceleni |
| 21 |
impedance elawulwa |
+/- 10% |
+/- 7% |
| 22 |
Izinto zokuvala umoya Ukumelana |
1 × 1012Ω (Okuvamile) |
1 × 1012Ω (Okuvamile) |
| 23 |
Ngokusebenzisa Hole Ukumelana |
<300Ω (Okuvamile) |
<300Ω (Okuvamile) |
| 24 |
Shock Thermal |
3 × 10sec @ 288 ℃ |
3 × 10sec @ 288 ℃ |
| 25 |
Warp futhi Twist |
≤0.7% |
≤0.7% |
| 26 |
Amandla kagesi |
> 1.3KV / mm |
> 1.4KV / mm |
| 27 |
Amandla ikhasi |
1.4N / mm |
1.4N / mm |
| 28 |
Solder imaski nemihuzuko |
> 6H |
> 6H |
| 29 |
Flammability |
94V-0 |
94V-0 |
| 30 |
Test Voltage |
50-330V |
50-330V |
2.PCB phambili isikhathi: (uma udinga isevisi esiphuthumayo, nathi singaqiniseka ukuhlangabezana)
| incazelo |
Layer double |
4 Layer |
6 Layer |
8 Layer |
10 Layer noma ngaphezulu |
| Sample (WD) |
3-5 |
7 |
8 |
10 |
12 |
| ekukhiqizweni (WD) |
7-9 |
10-12 |
13-15 |
16 |
20 |
3.Package: Inner cleaner emasakeni, engaphandle ejwayelekile ibhokisi ibhokisi nokupakisha.
4.Shipping:
A: ngu-DHL, UPS, Fedex, TNT njll
B: ngu ulwandle ayemaningi mass ngokuvumelana nemfuneko yekhasimende.
5.If isidingo ikhotheshini yamaphrojekthi wakho PCB, pls ukunikeza ulwazi olulandelayo:
A: Quote ubuningi,
B: ifayela Gerber e 274-x format,
C: imfuneko Technical noma imingcele (impahla, ungqimba, ithusi ukujiya,
ibhodi ukushuba, ebusweni yokuqedela, solder imaski / silkscreen umbala ...)
Uma kukhona uphenyo noma ufuna ukufunda okwengeziwe, sicela uthumele i-imeyili kithi ngokukhululekile noma uxoxe uhlelo inthanethi, sibonga ukwesekwa yakho kusengaphambili!
