Irin mojuto PCB

With the increase of the LED chip size and polycrystalline LED the development of packaging design, LED the heat load are also redouble,in addition to this the heat dissipation capacity of plate material, its thermal stability of materials are also affect the LED products’ life.In short, high power LED products loading board material needs to have at the same time the characteristics of high heat dissipation and high heat resistance, so the packaging substrate material becomes the key factor, on the application of traditional LED heat dissipation substrate,Irin mojuto PCB be widely used.

Metal core printed circuit board PCB (you aslo can call it MCPCB , Gbona PCB, Heavy Ejò PCB) ni irú ti PCB ọkọ pẹlu irin mimọ awọn ohun elo ti dipo ti hun gilasi FR4, FR3 tabi others.There jẹ nikan apa, ė apa, ati multilayer ọkọ. Awọn julọ ti Metal Core PCB manufacturers are commonly used metal core material is aluminum, copper and alloy. Aluminum is the most frequently used among them due to its good heat transfer ability,dissipation ability and relatively cheaper costs than copper,even which may has a better performance,so it widely was accepted.copper although have better performance,but its cost more expensive,steel is more rigid than both aluminum and copper,it has normal steel and stainless steel,but its thermal conductivity is lower than others,simple speaking,aluminum material is the best choice,even considering from cost,rigidness and thermal conductivity.

There are single sided,two layer and multi-layer mcpcb,the Single sided metal core printed circuit board consists of a metal base (aluminum or copper alloy), dielectric layer, and copper conductor layer. The single layer MCPCB can be used with surface mount and chip & wire components. It provides much lower thermal resistance than FR4 PCB. And the metal core provides lower cost and allows much larger areas than ceramic substrates.

Irin mojuto PCB ti lo lati ropo ibile FR4 tabi CEM3 PCBs nitori ti awọn agbara lati daradara dissipate ooru kuro lati irinše. Eleyi ti ni waye nipa lilo a thermally conductive aisi-itanna Layer.

Awọn prepreg aisi-itanna pese o tayọ ooru gbigbe lati awọn bankanje ati irinše si mimọ awo, nigba ti mimu tayọ itanna ipinya. Awọn mimọ aluminiomu tabi Ejò awo yoo fun awọn nikan-apa sobusitireti darí iyege, o si sepin ati Gbigbe awọn ooru to a ooru ifọwọ, iṣagbesori dada tabi taara si awọn ibaramu air.

Irin mojuto PCB ẹya-ara:

• Doko itọju ti gbona tan kaakiri ni PCB Circuit design
• Din ọna otutu, mu agbara ati iwuwo dede, fa awọn aye ti ọja
• Kere ifẹsẹtẹ, kekere hardware ati ijọ owo
• Rọpo awọn ẹlẹgẹ seramiki sobsitireti PCB pẹlu dara darí agbara

Irin mojuto PCB ohun elo:

• Ina: LED Light ni tobi olumulo ti Aluminium PCB
• Power module: Power converters, Inverters, ri to ipinle relays, agbara rectifier afara
• Ipese agbara: yi pada eleto, DC / AC converter, SW eleto
• Communication ẹrọ itanna: ga-igbohunsafẹfẹ ampilifaya, àlẹmọ onkan, Atagba iyika
• Audio itanna: input, o wu amplifiers, iwontunwonsi amplifiers, awọn iwe amplifiers, preamplifiers, agbara amplifiers
• Kọmputa: Sipiyu lọọgan, floppy disk drives, ipese agbara awọn ẹrọ
• Office adaṣiṣẹ itanna: motor drives ...
• Power module: Inverters, ri to ipinle relays, agbara rectifier afara
• Car: Itanna eleto, iginisonu, agbara olutona ...

agbara: