Nibẹ ni o wa ni ọpọlọpọ awọn ilana lori dada ti awọn tejede Circuit ọkọ : ihoho PCB ọkọ (ko si dada itọju), OSP, Hot Air ni ipele (asiwaju tin, yorisi-free tin), bar wura, immersion wura ati be be wọnyi ni o wa siwaju sii han.
Awọn iyato laarin awọn immersion wura ati bar wura
Immersion goolu ni a ọna ti kemikali iwadi oro. A kemikali Layer ti wa ni akoso nipa a kemikali ifoyina-idinku lenu. Gbogbo, awọn sisanra jẹ jo nipọn. O ti wa ni kan irú ti kemikali nickel-goolu-goolu Layer iwadi oro ọna, ati ki o le se aseyori kan nipọn wura Layer.
Gold bar nlo awọn opo ti electrolysis, tun npe ni electroplating. Julọ miiran irin dada itọju ti wa ni tun electroplated. 
In the actual product application, 90% of the gold pcb board is the immersed gold pcb board,because the poor solderability of the plated circuit board is his fatal flaw, and it is also the direct cause of many companies to give up the gold plating process!
Immersion goolu ilana nile lori dada ti awọn ti tejede Circuit lọọgan pẹlu idurosinsin awọ, ti o dara imọlẹ, dan bar, ati awọn ti o dara solderability ti nickel goolu bar. Besikale o le ti wa ni pin si mẹrin ni asiko: ami-itọju (epo yiyọ, bulọọgi-etching, ibere ise, ranse si-fibọ), nickel ojoriro, eru wura, ranse si-itọju (egbin omi fifọ, DI omi fifọ, gbigbe). Immersion goolu sisanra ni laarin 0.025-0.1um.
Gold ti wa ni loo si awọn dada itọju ti tejede Circuit lọọgan nitori ti awọn oniwe ina elekitiriki, ti o dara ifoyina resistance, ki o si gun ọgọrin. O ti wa ni gbogbo lo bi bọtini lọọgan, goolu ika PCB lọọgan, etc. Awọn yeke iyato laarin wura-palara lọọgan ati wura-immersed lọọgan ni wipe goolu bar jẹ lile. Gold (abrasion sooro), goolu jẹ asọ ti wura (ko wọ sooro). 
1. The crystal structure formed by Immersion Gold and Gold Plating is different. Immersion Gold is much thicker than Gold Plating. Immersion Gold will be golden yellow and yellower than Gold Plating (this is the method of distinguishing between gold plating and heavy gold plating.) a) Gold plating will be slightly white (nickel color).
2. Awọn gara be akoso nipa immersion wura ati wura bar ti o yatọ si. Immersion goolu jẹ rọrun lati weld jù wura bar ati ki o yoo ko fa buburu alurinmorin. Ni wahala ti awọn immerison goolu ọkọ jẹ rọrun lati Iṣakoso, ati awọn ti o jẹ diẹ conducive si awọn imora ilana fun iwe adehun awọn ọja. Ni akoko kanna, nitori goolu jẹ diẹ wura-palara ju wura, wura-fingered goolu ika ni ko wearable (shortcomings ti wura awo).
3. Nibẹ ni o wa nikan nickel-goolu lori pad ni wura-immersed PCB ọkọ .Awọn ifihan agbara gbigbe ninu ara ipa ko ni ipa awọn ifihan agbara ninu awọn Ejò Layer.
4. immersion goolu jẹ diẹ ipon ju wura bar gara be, ko rorun lati gbe awọn ifoyina ṣe.
5. Pẹlu awọn npo eletan fun tejede Circuit ọkọprocessing yiye, laini iwọn, aye ti ami 0.1mm ni isalẹ. Gold bar ni prone si wura kukuru Circuit. Awọn wura awo nikan ni o ni nickel ati wura lori pad, ki o jẹ ko rorun lati gbe awọn kan wura kukuru Circuit.
6. Awọn immersion wura nikan ni o ni nickel wura lori pad, ki awọn solder koju lori ila ti wa ni siwaju sii ìdúróṣinṣin iwe adehun si awọn Ejò Layer. Ise agbese yoo ko ni ipa ni aye nigba ti biinu.
7. Fun awọn ti o ga ibeere ti PCB ọkọ, flatness ibeere ni o wa dara, gbogbo lilo ti immersion wura , immersion wura ni gbogbo ko ni han lẹhin ti awọn ijọ awọn dudu akete lasan. Awọn flatness ati iṣẹ aye ti wura awo ni o wa dara ju ti o ti wura awo.
Ki Ni bayi julọ factories lo immersion goolu ilana lati gbe awọn goolu PCB ọkọ .However, wúrà-immersed ilana jẹ diẹ gbowolori ju wura-bar ilana (diẹ wura akoonu), ki nibẹ ni o wa si tun kan ti o tobi nọmba ti kekere-owole awọn ọja lilo wura-plating lakọkọ (bi isakoṣo latọna jijin paneli, isere lọọgan).