Kaabo si KingSong PCB Technology
Aworan: 4 fẹlẹfẹlẹ High iwuwo PCB Layout Pẹlu immersion Gold paadi
Eleyi tejede Circuit Board ni a 4 fẹlẹfẹlẹ High iwuwo PCB Layout Pẹlu immersion Gold paadi, lo ninu onibara Electronics, diẹ ninu awọn bi aarin Tablet PC Board, A PCB Circuit Board pẹlu immersion Gold dada Finishing ni a bo laarin a paati ati ki o kan si igboro PCB Circuit ọkọ , wa ọjọgbọn PCB olupese ko ba wa ni nikan nse 4 fẹlẹfẹlẹ PCB ọkọ, sugbon o tun 6 Layer PCB, 8 Layer PCB tabi 10 Layer PCB ati be be lo
1.Detail PCB Manufacturing Agbara:
No. |
ohun kan |
ibi Production |
Afọwọkọ |
1 |
fẹlẹfẹlẹ |
1-8 fẹlẹfẹlẹ |
1-20 fẹlẹfẹlẹ |
2 |
Max. Panel Iwon |
600 * 770mm (23.62 "* 30,31") |
600 * 770mm (23.62 "* 30,31") 500 * 1200mm (19.69 "* 47,24") |
3 |
Max.Board Sisanra |
8.5mm |
8.5mm |
4 |
Min. Board Sisanra |
2L: 0.3mm, 4L: 0.4mm, 6L: 0.8mm |
2L: 0.2mm, 4L: 0.4mm. 6L: 0.6mm |
5 |
Min Inner Layer Kiliaransi |
0.1mm (4mil) |
0.1mm (4mil) |
6 |
Min Line iwọn |
0.075mm (3/3 mil) |
0.075mm (3/3 mil) |
7 |
Min Line aaye |
0.075mm (3/3 mil) |
0.075mm (3/3 mil) |
8 |
Min.Hole Iwon |
0.15mm (6mil) |
0.15mm (6mil) |
9 |
Min palara iho sisanra |
20um (0.8mil) |
20um (0.8mil) |
10 |
Min Blind / sin iho iwọn |
0.1mm (4mil) |
0.1mm (1-8layers) (4mil) |
11 |
PTH Dia. ifarada |
± 0.076mm (± 3mil) |
± 0.076mm (± 3mil) |
12 |
Non PTH Dia. ifarada |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
13 |
Iho Ipo iyapa |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
14 |
eru Coppe |
4oz / 140μm |
6oz / 175μm |
15 |
Min S / M ipolowo |
0.1mm (4mil) |
0.1mm (4mil) |
16 |
Soldermask awọ |
Alawọ ewe, dudu, Blue, White, Yellow, Red |
Alawọ ewe, dudu, Blue, White, Yellow, Red |
17 |
Silkscreen awọ |
White, Yellow, Red, Black |
White, Yellow, Red, Black |
18 |
ìla |
Afisona, V-yara, Beveling Punch |
Afisona, V-yara, Beveling Punch |
19 |
ìla ifarada |
± 0.15mm ± 6mil |
± 0.15mm (± 6mil) |
20 |
Peelable boju |
Top, isalẹ, ė apa |
Top, isalẹ, ė apa |
21 |
dari ikọjujasi |
+/- 10% |
+/- 7% |
22 |
idabobo resistance |
1 x 1012Ω (Deede) |
1 x 1012Ω (Deede) |
23 |
Nipasẹ iho Resistance |
<300Ω (Deede) |
<300Ω (Deede) |
24 |
gbona mọnamọna |
3 x 10sec @ 288 ℃ |
3 x 10sec @ 288 ℃ |
25 |
Ike ati titanic |
≤0.7% |
≤0.7% |
26 |
ina Okun |
> 1.3KV / mm |
> 1.4KV / mm |
27 |
Peel Okun |
1.4N / mm |
1.4N / mm |
28 |
Solder boju abrasion |
> 6H |
> 6H |
29 |
Flammability |
94V-0 |
94V-0 |
30 |
igbeyewo Foliteji |
50-330V |
50-330V |
2.PCB asiwaju akoko: (ti o ba nilo amojuto ni iṣẹ, a tun le pade)
Apejuwe |
Double Layer |
4 Layer |
6 Layer |
8 Layer |
10 Layer tabi loke |
Ayẹwo (WD) |
3-5 |
7 |
8 |
10 |
12 |
Ibi-gbóògì (WD) |
7-9 |
10-12 |
13-15 |
16 |
20 |
3.Package: Inner igbale packing, Lode boṣewa paali apoti packing.
4.Shipping:
A: Nipa DHL, Soke, FedEx, TNT ati be be
B: Nipa okun fun ibi-opoiye gẹgẹ bi onibara ká ibeere.
5.If nilo finnifinni fun nyin PCB ise agbese, pls pese wọnyi info:
A: Quote opoiye,
B: Gerber faili ni 274-x kika,
C: Technical ibeere tabi sile (awọn ohun elo ti, Layer, Ejò sisanra,
ọkọ sisanra, dada finishing, solder boju / silkscreen awọ ...)
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