1. Njengoko i isinxibelelanisi ebalulekileyo elektroniki, PCB isetyenziswa iimveliso phantse yonke elektroniki, uthathwa "unina iimveliso inkqubo yekhompyutha," utshintsho beteknoloji iintsingiselo zolu rhwebo baba kwagxilwa kwamashishini amaninzi.
Okwangoku, kukho iindlela ezimbini ezicaceleyo iimveliso zombane: omnye ibhityile, elifutshane, enye rhoqo, ngesantya esiphezulu drive PCB avela ngokufanelekileyo ukuze ezixineneyo, ukuhlanganiswa phezulu, encapsulation, ezifihlakeleyo, kwaye ulwalathiso ezithile ngokwezinga ezininzi, ukukhula kwemfuno i PCB layer phezulu kunye HDI .
Top pcb board wiring length is short, low impedance circuit, high-frequency high-speed work, stable performance, can take on more complex function, is to the high frequency electronic technology, multi-function large capacity development inevitable trend.In particular, the in-depth application of large-scale integrated circuits will further drive PCB to high precision and high level.
2. Okwangoku, PCB esisetyenziselwa izinto zasendlini, PC, desktop kunye nezinye iimveliso ze-elektroniki, ngelixa izicelo isiphelo ophezulu ezifana namaziko asebenza kwizinga eliphezulu iiseva multi-ndlela kunye aerospace kufuneka ukuba ngaphezu kwe-10 iimaleko PCB.Take umncedisi umzekelo, ibhodi PCB kwi oononye ndlela mbini iseva ngokubanzi phakathi 4-8 maleko , lo gama ibhodi iphambili isiphelo ophezulu-server, iindlela ezifana-4 no-8, kufuna ngaphezu maleko-16 , kwaye backplate mfuneko ngaphezu ngomaleko-20.
HDI kweentambo mninzi kuthelekiswa eziqhelekileyo ibhodi multilayer pcb zinezibonelelo ezicacileyo, nto leyo ke ukhetho engundoqo mainboard umsebenzi smartphone.Smartphone yangoku letiya kunye nomthamo kuphuhliso elula, isithuba kancinci kancinci ngenxa ibhodi ephambili, zifuna ayimininzanga xa ethwele ngakumbi kumacandelo ebhodini engundoqo, ibhodi multi-maleko eziqhelekileyo nzima ukukhawulelana nemfuno.
Lwetshiphu emsebenzi-mninzi ibhodi zokuqhagamshelwa yesekethe (HDI), iyayamkela indlela ibhodi inkqubo yezomthetho elaminethiweyo, ibhodi multilayer eziqhelekileyo undoqo ibhodi ukufumba, ukusetyenziswa zokomba, kunye nenkqubo metallization umngxuma, ukwenza zonke iimaleko komgca phakathi umsebenzi uqhagamshelo lwangaphakathi. Ethelekiswa kulimo nge-umngxuma kuphela iibhodi multilayer pcb, HDI umisela ngokuchanekileyo inani vias abaziimfama vias wangcwatyelwa ukunciphisa inani vias, igcina indawo ubeko PCB, kwaye kuphula candelo uxinano, kanjalo ephetha ngokukhawuleza umsebenzi multilayer kwi Smartphones iindlela wokulaminetha. 
The technical difference of HDI is reflected in the increment stacked number, the more layer quantity, the more difficult the technology.HDI can be divided into single stacked HDI, doule stacked HDI, triple stacked HDI,or high stacked HDI, etc., the number of layers is expressed as C+N+ C, where N is the number of normal core laminar, and C is the number of added layers, namely the stacked number of HDI..High stacked HDI cabling has higher density, but at the same time, it has more pressure, such as position, punch hole and copper plating, etc., which has higher requirements on the technical process and process capability of the manufacturer.
Popular kwiminyaka yakutshanje kwi HDI ekupheleni eliphezulu-smart layer olithandayo na enyangweni elibhalwe ngokuqhelekileyo ka-HDI, zifuna nayiphi na zinemingxuma abangaboniyo uqhagamshelwano phakathi maleko ezikufutshane, ngokusekelwe HDI eqhelekileyo asisindise phantse isiqingatha umthamo, ukuze ukwenza igumbi ngaphezulu ibhetri nezinye iindawo.
Nayiphi inwebu HDI ifuna ukusetyenziswa kobugcisa eziphambili ezifana laser ukubhola kunye umngxuma iiplagi electroplated, nto leyo eyaba nzima kunye nohlobo liphezulu HDI-value added, nto leyo kakhulu ukubonakalisa izinga yobugcisa ka-HDI. 
Two important trends of the automobile industry are intelligent and electric.ADAS (Advanced Driver Assistance System) as the transition of complete intelligent driving before, has become a major automakers and crossover of Internet giant rushed to the layout of the new strategic highland, it involves the electronic device cover nearly all of the whole vehicle driving and safety related System, with the rapid penetration of ADAS, comprehensive automobile electronic level will be raised.
3. Kwaye izithuthi ezintsha eneji emele ulwalathiso imoto yombane, xa kuthelekiswa ne imoto yemveli, isicelo eliphezulu kwinqanaba elektroniki, izixhobo ze-elektroniki iindleko yokuthuthwa zemveli accounted for malunga-25%, 45% kwi-45% kwi kwizithuthi ezintsha amandla , inkqubo yolawulo samandla awodwa (BMS, VCU kunye MCU), yenza ukusetyenziswa kwesithuthi PCB mkhulu imoto yemveli, ulawulo emithathu amandla inkqubo PCB ukusetyenziswa avareji malunga 3-5 square metres, isixa isithuthi PCB Phakathi 5-8 yezikwere.
4. Ukukhula ADAS kunye nezithuthi amatsha amandla, eqhutywa amavili amabini, uye wagcina bombane imarike izithuthi likhula ngesantya esingaphezulu kwama-15 ekhulwini ngonyaka kutshanje years.Accordingly, yokurhweba PCB liya kuqhubeka phezulu, kwaye kwangaphambili ukuba imveliso PCB uya kudlula $ 4 billion ngo-2018, yaye oku kukhula kucacile kakhulu, injecting isantya entsha kwishishini PCB kulo.
5. Smartphones ukuba umqhubi enkulu zoshishino PCB kweli xesha past.Mobile Internet, abasebenzisi ngakumbi nangakumbi ukusuka PC terminal izixhobo ezithwalwayo, kananjalo ubume umgangatho wecomputing PC ngokukhawuleza indawo yi ukuphela mobile, ukusukela ngo-2008, abathengi jikelele nezombane lwamashishini uphuhliso fast, ngokukodwa 2012 ~ 2014, smart zibe infiltration.Therefore ngokukhawuleza, ukukhula ngokukhawuleza PCB iqhutywa emazantsi kwiitheminali mobile bafanekiselwa phones.Between smart 2010 no-2014, imarike smart kwi emazantsi PCB lafikelela avareji yezinga lokukhula compound ngonyaka ka-24%, kude ngaphezulu namanye amashishini omlambo, ngokubonelela abaqhubi ukukhula ezingundoqo kushishino PCB le.
Ekupheleni eliphezulu-PCB, HDI, umzekelo, ifowuni ephathwayo Iyindawo HDI yemveli, ngo-2015, umzekelo, iifowuni zala accounted for ngaphezu kwesiqingatha inani, kwaye ngokwembono phones smart, imisebenzi emitsha langoku phantse zonke iimveliso usebenzisa HDI njenge motherboard.
Bobabini ngokwembono PCB kunye nesiphelo ophezulu-HDI, kuba isantya esiphezulu sokukhula smartphone ekhokelela imfuno ukuchuma ehlayo, ngaloo ndlela ixhasa ukukhula kwamashishini PCB inzuzo jikelele.
Kodwa akukho angalufumani imarike smart ophele- ukususela 2014, emva kwexesha afunxwe olukhawulezayo ungeno ngokuthe ngcembe Smartphones waya era.On eninzi kurhwebo lwehlabathi, uqikelelo zakutshanje ukusuka IDC2016 esiyikhuphe ngoNovemba 2016, le mithwalo smart jikelele ngo-2016 kulindeleke ukuba babe 1.45 bhiliyoni, kunye jump ebalulekileyo ekukhuleni ngokwemiqathango nje 0.6 percent.In ze data ukukhula, nangona isiqingatha izicelo nomfula PCB likaThixo nangoku ixhaswa mobile phones, uninzi iindidi PCB, kuquka HDI, baye behlisa kwi indawo mobile terminal.
Nangona ngokwemeko kuqoqosho oludodobalayo, ishishini smartphone ibe kwisiqingatha sesibini kukupheliswa elahlekayo, kodwa ngenxa kwestokhwe enkulu, ngenxa isiphumo umboniso abanye abathengisi ukuba ukulandela phezulu, imfuno kwabathengi ziya kuqhuba i replacement.The stock enkulu market of smart phones usenalo amandla omkhulu, kwaye abathengisi ze iiclamps liya kwenza konke okusemandleni ukuphucula amanqaku iintlungu zabaxumi ukuze ukuvuselela imfuno kunye nemarike mbambe share.As yoko, ifowuni smart, njengoko isicelo engundoqo emazantsi PCB ngaphambili, iye kunethuba elikhulu ekukhuleni PCB kwi umda omkhulu stock.
Kule minyaka mibini okanye mithathu idlulileyo smart trend yophuhliso yefowuni, ukuqondwa weminwe, 3D Touch, big screen, ikhamera ezimbini kunye nezinye ezintsha okuqhubekayo sele asakhulayo, kodwa qhubeka ukukhuthaza nokuphuculwa replacement.
Kwimeko Kwiiselula nghena ubudala imfuyo, isiseko umthamo omkhulu umisela ukuba ukukhula isihlobo ebangelwe ezintsha ukuthengisa amanqaku baya kukhokelela ekwandeni kakhulu inani olungagungqiyo demand.Stock of ezintsha nazo kuchaphazela PCB jikelele, ukuba elizayo smart ezintsha uphuculo PCB, kuqwalaselwa ifowuni ephathwayo umenzi ubungakanani ngolwandle engxamisekileyo ekhoyo kunye nezinye olulandelayo-up kuya, ezintsha uphuculo ukukhawulezisa umnwe, ngaloo wabonakala ezifana woqondo, yiacoustic, njl
6. Ukujolisa phezu PCB kushishino, ukugqabhuka FPC kunye naluphi inwebu zokuqhagamshelwa HDI kutsala abanye abenzi ukuba ukulandela phezulu, nencopho obubonakala kumphezulu ukwenza imodeli sokungena rapid:
FPC yaziwa ngokuba "pcb bhetyebhetye", into nebonelela izinto polyimide okanye ipholiyesta ifilim isiseko eyenziwe ibhodi yesiphaluka bhetyebhetye eziprintiweyo, kunye ezixineneyo ingcingo, ubunzima ukukhanya, babulingana nesandla zingcakacile, bhetyebhetye, bhetyebhetye phezulu, abasamenzeli Umkhuba imveliso electronic elula, utyekelo bhetyebhetye.
Used in iPhone ayo zaziingceba 16 FPC, ukuthengwa yeyona inkulu FPC, top ezintandathu behlabathi ehlabathini FPC lomenzi abathengi eziphambili zezi abenzi ezifana apile, Style, huawei, Na phantsi apile umboniso liqaqambise FPC sosebenziso Smartphones.
Smartphones kwakungamandla awayeqhuba zaseprayimari, ekukhuleni FPC inzuzo evela apile kunye nefuthe layo umboniso, FPC ngokukhawuleza lubonakala, 09 uyakwazi ukugcina ukukhula eziphakamileyo, nyaka ngamnye ukususela kwiminyaka eli-15 njengoko itshatshazi kuphela kushishino PCB, waba udidi kokukhula kuphela .
7. zeendawana-Like PCB (obizwa ngokuba SLP) kwi-technology HDI, esekelwe kwinkqubo M-SAP, Ungalungisa ngokusa phambili umgca, kukho isizukulwana esitsha kumgca ocoliweyo eshicilelweyo ibhodi wesekethe.
Ibhodi yeklasi (SLP) yeyona PCB hardboard isizukulwana esizayo, leyo kunqanyulelwa ukususela 40/40 microns ka-HDI ukuba inkqubo 30/30 microns.From ngengcamango, ibhodi udidi iyalayisha kufutshane kusetyenziswa semiconductor ukupakisha ibhodi IC, kodwa luseza ukufikelela IC kweenkcukacha beplanga lomthwalo, kwaye injongo yayo nangoku sithwele zonke iintlobo zamacandelo zezenzi, isiphumo eziphambili nangoku bobabo kudidi lwe PCB.For lo mgca entle udidi olutsha ipleyiti yoshicilelo, siya ukutolika imilinganiso ezintathu imvelaphi yokungenisa, inkqubo yayo yokuvelisa kunye suppliers.Why ezinokubakho ufuna ukuyingenisa kwibhodi umthwalo yeklasi: iimfuno ukuphakheja line superposition SIP esulungekisiweyo kakhulu, ezixineneyo iseyeyona umgca engundoqo, smart phones, tablets, kunye nezixhobo wearable kunye ezinye izinto ze-elektroniki ukuba ukuphuhlisa bejonge miniaturization kunye notshintsho muti_function, ukuze baphumeze inani inyuswe kakhulu ukuba isithuba kwibhodi wesekethe amacandelo, Noko ke, ngakumbi kunomda nangakumbi.
Kule meko, ucingo PCB ububanzi, izithuba, ubukhulu be kwiphaneli micro kunye nomgama iziko umngxuma, kwaye umaleko umqhubi nezinyuko zokwambathisa maleko abawayo, nto leyo yenza i-PCB ukunciphisa isayizi, ubunzima kunye nomthamo kwamatyala, oko inokuthatha components.As ngaphezulu umthetho Moore kukuba semiconductors, ezixineneyo yinto yokufuna ezingisileyo iibhodi yesekethe eprintiweyo:
Kakhulu iimfuno beesekethe eneenkcukacha ziphakamile ngaphezu mninzi HDI.High ziliqhubela PCB ukulungisa umgca, kwaye incochoyi ibhola (BGA) bufinyeziwe.
Kwiminyaka embalwa edlulileyo, i-0,6 mm ukuya 0.8 mm pitch iteknoloji iye yasetyenziswa kwi imishini ephathwayo, esi sizukulwana smart phones, ngenxa yobuninzi / O candelo I kunye miniaturization imveliso, PCB ngokubanzi USEBENZISA netheknoloji 0.4 mm pitch. lo mkhuba ukuphuhlisa ekubeni 0.3mm. Enyanisweni, uphuhliso 0.3mm technology gap ukuze ezinjengeetheminali mobile sele begun.At xesha, ubungakanani micropore kunye ububanzi we disc ukudibanisa ziye zancitshiswa ku-75 mm ne-200 mm ngokulandelelana.
Injongo Ishishini kukuba ukuze ulahle micropores kunye disc ku 50mm yaye 150mm ngokulandelelana kwi embalwa years.The 0.3mm uyilo izithuba imigaqo elandelayo kufuna ukuba umgca ububanzi umgca yi-30 / 30μm.
yena ibhodi eklasini ukuxuma SIP nokupakishwa iinkcukacha more.SIP kwinqanaba inkqubo ukupakisha technology, ngokusekelwe kwinkcazelo lombutho umgca semiconductor international (ITRS): SIP ngokuba izakhi ezininzi esebenzayo elektroniki kunye nemisebenzi eyahlukeneyo kunye namacandelo zezenzi ungayikhetha, kunye nezinye izixhobo ezifana MEMS okanye kuqala isixhobo okubonakalayo kunye, ukuphumeza umsebenzi ethile eyodwa zokubopha eqhelekileyo, ubuchwepheshe ukuphakheja ukwenza inkqubo okanye indlela esezantsi.
Kukho idla iindlela ezimbini ukuqonda umsebenzi kwinkqubo yekhompyutha, omnye SOC, kwaye inkqubo yekhompyutha iqaphelwa kwi chip enye integration.Another eliphezulu SIP, yona ethi inxulumanise iCMOs kunye nezinye iziphaluka ezihlangeneyo kunye nezombane ibe impahla usebenzisa oqolileyo esidibeneyo okanye indibaniselwano iteknoloji, nto leyo ukuphumeza umsebenzi umatshini yonke ngokusebenzisa okubekwe engumzekelo yeetships ezahlukeneyo ezisebenzayo.
Ibhodi iklasi bobabo PCB hardboard, kunye nenkqubo yayo ephakathi ukuze eliphezulu HDI ne IC nembasa, kwaye isiphelo-eziphakamileyo abenzi HDI kunye nabenzi ibhodi IC unalo ithuba lokuthabatha inxaxheba.
abenzi HDI ukuba onamandla angaphezu, hoxa uya key.Compared IC ipleyiti, HDI iye zisebenze kakhulu kwaye iye yaba imarike ulwandle ebomvu, elinephepha ngeniso declining.Face nebhodi udidi iyalayisha, ithuba labavelisi HDI ukuze ufumane ezintsha odolo, kwelinye icala, kwelinye icala kuba nako ukuyiqonda nokuphuculwa imveliso, ukukhulisa umxube imveliso kunye neqondo imivuzo, ngoko sijonge ngokomelela, ezinamandla ngakumbi yobeko lokuqala.
Ngenxa yenkqubo eliphezulu ibhodi udidi iyalayisha, abenzi HDI ukuba utyalo okanye izixhobo zokuvelisa ezintsha kokulungiswa, kunye nenkqubo MSAP nobuchwepheshe kubavelisi HDI kufuna ixesha lokufunda, ukusuka indlela nokukhupha benze MSAP, isivuno imveliso iya kuba ngundoqo.
8. LED Uphuhliso olukhawulezileyo ophezulu thermal conductivity CCL abe shushu spot.The LED izithuba anabo iingenelo unspelt, isiphumo ukubonisa elungileyo nobomi inkonzo ende. Kwiminyaka yakutshanje, kuye iqalile kuye kuqatshelwa, kwaye iye ikhula ngokukhawuleza. Ngako oko, le efunekayo phezulu wobushushu conductivity CCL kuye kwaba litshatshazi ashushu.
Vehicle PCB kwiimfuno umgangatho imveliso kunye nokuthembeka ungqongqo kakhulu, kunye nokusetyenziswa kakhulu elektroniki ezizodwa izixhobo zokusebenza CCL.Automotive yinto PCB izicelo ezibalulekileyo kwindawo engezantsi. Iimveliso Automotive electronic kufuneka kuqala bahlangabezane izithuthi njengendlela zezithuthi kufuneka abe neempawu lobushushu, imozulu, ukuhla ombane, ukuphazamiseka magnetic, ukungcangcazela kunye nezinye lolwamkelo neemfuno eziphezulu ukuba izinto PCB izithuthi wabeka iimfuno phambili ephakamileyo, ukusetyenziswa ngakumbi Special ngezinto zokusebenza (ezifana nezinto aphezulu Tg, izinto anti-CAF (zixinaniswe asbestos ifayibha), izixhobo ubhedu eshinyeneyo kunye nezinto yodongwe, njl) CCL.