Wilujeng sumping di KingSong PCB Téhnologi
Gambar: Adat 8 lapisan High Density fabrikasi Board PCB pc
Circuit Board dicitak Ieu Adat 8 lapisan High Density fabrikasi Board PCB pc, dipaké dina Electronics Consumer, sababaraha kawas drive kaayaan padet, A PCB Circuit Board kalawan immersion Emas Surface pagawean mangrupakeun palapis antara komponén sarta dewan pcb circuit bulistir, urang profésional pCB Produsén teu ukur nawiskeun 8 lapisan dewan pcb, tapi ogé 10 lapisan pcb, 12 lapisan pcb atanapi 14 lapisan pcb jsb
Sorangan 1.Detail PCB Manufaktur:
| No |
barang |
Produksi masal |
prototipe |
| 1 |
lapisan |
1-8 Lapisan |
1-20 Lapisan |
| 2 |
Max. Ukuran panel |
600 * 770mm (23.62 "* 30,31") |
600 * 770mm (23.62 "* 30,31") 500 * 1200mm (19.69 "* 47,24") |
| 3 |
Max.Board ketebalan |
8.5mm |
8.5mm |
| 4 |
Mnt. dewan ketebalan |
2L: 0.3mm,
4L: 0.4mm,
6L: 0.8mm |
2L: 0.2mm,
4L: 0.4mm.
6L: 0.6mm |
| 5 |
Mnt Batin Lapisan clearance |
0.1mm (4mil) |
0.1mm (4mil) |
| 6 |
lebar mnt Line |
0.075mm (3/3 Mil) |
0.075mm (3/3 Mil) |
| 7 |
spasi mnt Line |
0.075mm (3/3 Mil) |
0.075mm (3/3 Mil) |
| 8 |
Ukuran Min.Hole |
0.15mm (6mil) |
0.15mm (6mil) |
| 9 |
Mnt plated ketebalan liang |
20um (0.8mil) |
20um (0.8mil) |
| 10 |
Mnt Buta / ukuran liang Dikubur |
0.1mm (4mil) |
0.1mm (1-8layers) (4mil) |
| 11 |
Mean ka-p Omod. kasabaran |
± 0.076mm (± 3mil) |
± 0.076mm (± 3mil) |
| 12 |
Mean ka-p Omod non. kasabaran |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 13 |
Liang Posisi simpangan |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 14 |
beurat Coppe |
4oz / 140μm |
6oz / 175μm |
| 15 |
Mnt S / M pitch |
0.1mm (4mil) |
0.1mm (4mil) |
| 16 |
warna Soldermask |
Héjo, hideung, Bulao, bodas, Yellow, Beureum |
Héjo, hideung, Bulao, bodas, Yellow, Beureum |
| 17 |
warna Silkscreen |
Bodas, Yellow, Beureum, Hideung |
Bodas, Yellow, Beureum, Hideung |
| 18 |
Outline |
Routing, V-legok, Beveling punch |
Routing, V-legok, Beveling punch |
| 19 |
Outline kasabaran |
± 0.15mm ± 6mil |
± 0.15mm (± 6mil) |
| 20 |
topeng Peelable |
Top, handap, ganda sided |
Top, handap, ganda sided |
| 21 |
dikawasa impedansi |
+/- 10% |
+/- 7% |
| 22 |
insulasi Résistansi |
1 × 1012Ω (Normal) |
1 × 1012Ω (Normal) |
| 23 |
Ngaliwatan Résistansi Hole |
<300Ω (Normal) |
<300Ω (Normal) |
| 24 |
Manten termal |
3 × 10sec @ 288 ℃ |
3 × 10sec @ 288 ℃ |
| 25 |
Lungsi jeung pulas |
≤0.7% |
≤0.7% |
| 26 |
Kakuatan listrik |
> 1.3KV / mm |
> 1.4KV / mm |
| 27 |
Kakuatan mesek |
1.4N / mm |
1.4N / mm |
| 28 |
Solder Topeng Abrasion |
> 6H |
> 6H |
| 29 |
Flammability |
94V-0 |
94V-0 |
| 30 |
test tegangan |
50-330V |
50-330V |
2.PCB waktos kalungguhan: (lamun perlu layanan urgent, urang ogé bisa papanggih)
| gambaran |
ganda Lapisan |
4 Lapisan |
6 Lapisan |
8 Lapisan |
10 Lapisan atawa luhur |
| Sampel (WD) |
4 |
7 |
8 |
10 |
12 |
| Produksi masal (WD) |
7-9 |
10-12 |
13-15 |
16 |
20 |
3.Package: packing vakum Batin, Outer standar kotak karton packing.
4.Shipping:
A: Ku DHL, UPS, Fedex, TNT jeung sajabana
B: Ku laut pikeun kuantitas massa nurutkeun sarat customer urang.
5.If kedah petik pikeun proyék-proyék PCB anjeun, PLS nyadiakeun inpo di handap:
A: Quote kuantitas,
B: file Gerber dina 274-x format,
C: sarat Téknis atanapi parameter (bahan, lapisan, ketebalan tambaga,
ketebalan dewan, pagawean beungeut cai, solder topeng / warna silkscreen ...)
Mun sagala panalungtikan atanapi hoyong diajar, mangga ngirim email ka kami kalawan bébas atawa ngobrol ku sistem online, hatur nuhun kanggo pangrojong Anjeun sateuacanna!
