Welcome to KingSong PCB Technology
Setšoantšo: Single lera Advanced FR4 LED Khatiso Potoloho Boards
Sena LED PCB Board is a Single Layer Advanced FR4 LED Printing Circuit Boards,used for Lighting industry,A LED PCB Circuit Board with OSP Surface Finishing is a coating between a component and a bare led pcb circuit board,KingSong Tehnology as a professional LED PCB Manufacturer with excellent manufacturing and assemblying work tenology,experienced workers and advanced equipment,are not only offer LED 1-layer PCB board service,but also provide ODM LED Printed Circuit Board or FR4 LED PCB etc.
1.Detail PCB Manufacturing bokgoni:
| Che |
ntho |
Misa Production |
mochine |
| 1 |
dikarolo |
1-8 le dikarolo |
1-36 dikarolo |
| 2 |
Max. Panel size |
600 * 770mm (23.62 "* 30,31") |
600 * 770mm (23.62 "* 30,31") 500 * 1200mm (19.69 "* 47,24") |
| 3 |
Max.Board botenya |
8.5mm |
8.5mm |
| 4 |
Mets. boto botenya |
2L: 0.3mm,
4L: 0.4mm,
6L: 0.8mm |
2L: 0.2mm,
4L: 0.4mm.
6L: 0.6mm |
| 5 |
Mets Inner lera Clearance |
0.1mm (4mil) |
0.1mm (4mil) |
| 6 |
Mets Line bophara |
0.075mm (3/3 mila) |
0.075mm (3/3 mila) |
| 7 |
Mets Line sebaka |
0.075mm (3/3 mila) |
0.075mm (3/3 mila) |
| 8 |
Min.Hole size |
0.15mm (6mil) |
0.15mm (6mil) |
| 9 |
Mets tlotsitsoe lesoba botenya |
20um (0.8mil) |
20um (0.8mil) |
| 10 |
Mets Foufetseng / patoa lesoba ka boholo |
0.1mm (4mil) |
0.1mm (1-8layers) (4mil) |
| 11 |
PTH Dia. mamello |
± 0.076mm (± 3mil) |
± 0.076mm (± 3mil) |
| 12 |
Bao e seng PTH Dia. mamello |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 13 |
Hole Boemo kheloha |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 14 |
boima Coppe |
4oz / 140μm |
6oz / 175μm |
| 15 |
Mets S / M sekontiri se metsi |
0.1mm (4mil) |
0.1mm (4mil) |
| 16 |
Soldermask mmala |
Green, e ntšo, Blue, White, Yellow, Red |
Green, e ntšo, Blue, White, Yellow, Red |
| 17 |
Silkscreen mmala |
White, Yellow, Red, Black |
White, Yellow, Red, Black |
| 18 |
kemiso |
Routing, V-groove ka, Beveling litebele |
Routing, V-groove ka, Beveling litebele |
| 19 |
kemiso mamello |
± 0.15mm ± 6mil |
± 0.15mm (± 6mil) |
| 20 |
Peelable maske |
Top, tlase, habeli sekamela lehlakoreng le le |
Top, tlase, habeli sekamela lehlakoreng le le |
| 21 |
laoloa Impedance |
+/- 10% |
+/- 7% |
| 22 |
Insulation Khanyetso |
1 × 1012Ω (Normal) |
1 × 1012Ω (Normal) |
| 23 |
Ka Hole Khanyetso |
<300Ω (Normal) |
<300Ω (Normal) |
| 24 |
Thermal makala |
3 × 10sec @ 288 ℃ |
3 × 10sec @ 288 ℃ |
| 25 |
Koba le sotha |
≤0.7% |
≤0.7% |
| 26 |
Matla a ea motlakase |
> 1.3KV / limilimithara |
> 1.4KV / limilimithara |
| 27 |
Peel Matla |
1.4N / limilimithara |
1.4N / limilimithara |
| 28 |
Solder Shorts Abrasion |
> 6H |
> 6H |
| 29 |
Flammability |
94V-0 |
94V-0 |
| 30 |
teko gagamalo |
50-330V |
50-330V |
2.PCB etella pele nako: (haeba u hloka tšebeletso potlakileng, re ka boela ra kopana)
| Tlhaloso |
habeli lera |
4 lera |
6 lera |
8 lera |
10 lera kapa ka holimo |
| Sampole (WD) |
3 |
7 |
8 |
10 |
12 |
| Boima tlhahiso ea (WD) |
7-9 |
10-12 |
13-15 |
16 |
20 |
3.Package: Inner lephaka paka, Outer tekanyetso lebokose lebokose paka.
4.Shipping:
A: Ka DHL, baholo, FedEx, TNT jj
B: By leoatle bakeng sa palo ka bongata ho ea ka tlhokahalo moreki.
5.If hlokahale khotheishene bakeng sa diporojeke hao PCB, pls fana latelang Info:
A: Quote ngata,
B: Gerber faele ka 274-: x thalong,
C: Technical hlokahalang kapa entsprechen (tse bonahalang, kolohantsoeng, botenya koporo,
boto le tsona ka botenya, holim 'a qetile, solder maske / silkscreen mala ...)
Ha dipatlisiso kapa batla ho ithuta ho eketsehileng, ka kōpo romela ya imeile ho re ka bolokolohi kapa qoqa ke tsamaiso online, leboha bakeng sa tšehetso ea hao esale pele!
