Metal Core PCB

With the increase of the LED chip size and polycrystalline LED the development of packaging design, LED the heat load are also redouble,in addition to this the heat dissipation capacity of plate material, its thermal stability of materials are also affect the LED products’ life.In short, high power LED products loading board material needs to have at the same time the characteristics of high heat dissipation and high heat resistance, so the packaging substrate material becomes the key factor, on the application of traditional LED heat dissipation substrate,Metal Core PCB be widely used.

Metal core printed circuit board PCB (you aslo can call it MCPCB , Thermal PCB, boima Koporo PCB) ke ea mofuta ofe PCB boto le lintho tse bonahalang tšepe botlaaseng sebakeng sa lohelloa khalase FR4, FR3 kapa others.There e le 'ngoe le ka lehlakoreng, habeli sekamela lehlakoreng le le multilayer boto. Bao boholo ba Metal Core PCB manufacturers are commonly used metal core material is aluminum, copper and alloy. Aluminum is the most frequently used among them due to its good heat transfer ability,dissipation ability and relatively cheaper costs than copper,even which may has a better performance,so it widely was accepted.copper although have better performance,but its cost more expensive,steel is more rigid than both aluminum and copper,it has normal steel and stainless steel,but its thermal conductivity is lower than others,simple speaking,aluminum material is the best choice,even considering from cost,rigidness and thermal conductivity.

There are single sided,two layer and multi-layer mcpcb,the Single sided metal core printed circuit board consists of a metal base (aluminum or copper alloy), dielectric layer, and copper conductor layer. The single layer MCPCB can be used with surface mount and chip & wire components. It provides much lower thermal resistance than FR4 PCB. And the metal core provides lower cost and allows much larger areas than ceramic substrates.

Metal Core PCB e sebelisoa ho nka sebaka sa tsa setso FR4 kapa CEM3 PCBs ka lebaka la bokhoni ba ho ka tsela e atlehileng dissipate mocheso hole dikarolo le. Sena se finyelloa ka ho sebelisa thermally conductive lera dielectric.

The prepreg dielectric fana e babatsehang mocheso phetiso tloha foil le dikarolo ho poleiti botlaaseng, ha ho lula re ena e babatsehang ea motlakase ho itšehla thajana. Botlaaseng aluminium kapa poleiti ea koporo e fana ka le 'ngoe-tsehelitseng substrate phetha molao botšepehi, le ho aba le ho e fetisetsa ho mocheso ho mocheso teba, ntseng bo eketseha holim' kapa ka kotloloho ho moeeng ambient.

Metal Core PCB tšobotsi:

• kalafo ea atlehang oa diffusion mogote ka PCB oa potoloho moralo
• Fokotsa mocheso ho sebelisa mehaho, eketsa matla a segokanyipalo sa le tšepahala, lelefatsa bophelo ba sehlahisoa
• Nyenyane footprint, tlaase hardware 'me phutheho ditjeo
• Nka sebaka sa ho pshatleha habonolo ceramic substrates PCB le molemo durability phetha molao

Metal Core PCB dikopo:

• Lighting: LED Light ke kholo ka ho fetisisa la mosebedisi le ya Aluminium PCB
• Matla mojulung ona: matla Converters, Inverters, boemo ba phetela tiileng, matla rectifier marokho
• Matla a phepelo: ho switjha regulator, DC / lenaihana converter, NW regulator
• Le be le Puisano thepa ea elektronike: phahameng maqhubu seholisa, lisebelisoa filthara, fetisang lipotoloho
• thepa Audio: input, khumo amplifiers, e leka-lekaneng amplifiers, amplifiers mamelwang, preamplifiers, matla amplifiers
• Khomphuteng: CPU mapolanka, kganna tiske, phepelo matla disebedisweng tse ding
• Office thepa itsamaise: kganna dilenaneo ...
• Matla mojulung ona: Inverters, boemo ba phetela tiileng, matla rectifier marokho
• Koloi: Electronic regulator, thothetsang molelo, ba laolang matla ...

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