1. E le sehokedi bohlokoa tsa elektronike, PCB e sebediswa bakeng sa lihlahisoa tsa hoo e ka bang tsohle tsa elektronike, ho nkoa " 'mè oa lihlahisoa tsa elektronike tsamaiso," liphetoho lona ea theknoloji le mekhoa maraka fetohile a bua haholo ka tlhokomelo ea likhoebo tse ngata.
Hona joale, ho na le tse peli tse totobetseng mekhoa ka lihlahisoa tsa elektronike: 'ngoe e tšesaane le e khutšoanyane, tse ling tse e phahameng maqhubu a phahameng, lebelo ka koloi tlaase ho linoka PCB loketseng ho segokanyipalo phahameng, phahameng nyalano, encapsulation, poteletseng, le tataiso ea stratification multiple, le ntseng le hōla ya tlhokeho ya ka holimo lera PCB le HDI .
Top pcb board wiring length is short, low impedance circuit, high-frequency high-speed work, stable performance, can take on more complex function, is to the high frequency electronic technology, multi-function large capacity development inevitable trend.In particular, the in-depth application of large-scale integrated circuits will further drive PCB to high precision and high level.
2. Hona joale, PCB e haholo-holo sebelisoa bakeng sa lisebelisoa ka tlung, PC, komporong le lihlahisoa tse ling tsa elektronike, ha dikopo phahameng-qetellong kang phahameng tshebetso selotlolo tsela server le Aerospace lia hlokahala ho ba le dikarolo tse fetang 10 PCB.Take seva ya e le mohlala, ba PCB boto ka seva le 'ngoe le e' meli-tsela ke ka kakaretso pakeng 4-8 le dikarolo , le hoja boto e khōlō ea seva phahameng-qetellong, tse kang ea 4 le ea 8 litsela, hloka ho feta le dikarolo 16 , le backplate e hlokahalang e ka holimo le dikarolo 20.
HDI wiring segokanyipalo amanang le ho ba tloaelehileng multilayer pcb boto na le melemo e totobetseng, e leng lokela ho etsa khetho e khōlō ea mainboard tsa morao-rao smartphone.Smartphone mosebetsi eketsehileng tse rarahaneng le bophahamo ba modumo ho ntshetsopeleng bobebe, ka tlaase ho moo 'me ka tlaase ho moo sebaka sa boto ka sehloohong, hloka LIMITED jereng ho feta ea likarolo ho ka boto e khōlō, ba tloaelehileng selotlolo lera boto e bile ho le thata ho kopana le tlhokeho ya.
Phahameng-segokanyipalo interconnection oa potoloho boto (HDI) o inkela ho laminated tsamaiso ea molao boto, le tloaelehileng multilayer boto e le ea mantlha boto stacking, tšebeliso ea ho cheka, 'me lesoba thulaganyou e metallization, ho etsa le dikarolo kaofela ha mola pakeng tsa ka hare mabapi mosebetsi. Bapisoa le tloaelehileng feela mapolanka ka-lesoba multilayer pcb, HDI nepo beha palo ea vias foufetseng le vias patoa ho fokotsa palo ea vias, pholosa PCB moralo sebakeng, 'me haholo eketsa karolo segokanyipalo, kahoo ka potlako ho tlatsa le multilayer tshebetso ka smartphone Laminating sebelisa mekhoa e meng. 
The technical difference of HDI is reflected in the increment stacked number, the more layer quantity, the more difficult the technology.HDI can be divided into single stacked HDI, doule stacked HDI, triple stacked HDI,or high stacked HDI, etc., the number of layers is expressed as C+N+ C, where N is the number of normal core laminar, and C is the number of added layers, namely the stacked number of HDI..High stacked HDI cabling has higher density, but at the same time, it has more pressure, such as position, punch hole and copper plating, etc., which has higher requirements on the technical process and process capability of the manufacturer.
Popular lilemong tsa morao tjena ka se phahameng-qetellong smartphone hatellang lera HDI e phahameng ka ho fetisisa stacked ya HDI, hloka leha e le efe nang le mekoti foufetseng mabapi pakeng tsa le dikarolo e haufi, ka lebaka la HDI ba tloaelehileng ba ne ba boloka hoo e ka bang halofo ea bophahamo ba modumo, e le ho etsa sebaka se eketsehileng bakeng sa leshala le likarolong tse ling.
Lera efe kapa efe ya HDI hloka ho sebelisa theknoloji e tsoetseng pele tse kang tsa laser ho cheka le electroplated lesoba lipolaka, e leng tlhahiso ea thata ka ho fetisisa le phahameng ka ho fetisisa boleng le eketsang HDI mofuta, e leng ho ka molemo ka ho fetisisa li bonahatsa boemo ba botekgeniki tsa HDI. 
Two important trends of the automobile industry are intelligent and electric.ADAS (Advanced Driver Assistance System) as the transition of complete intelligent driving before, has become a major automakers and crossover of Internet giant rushed to the layout of the new strategic highland, it involves the electronic device cover nearly all of the whole vehicle driving and safety related System, with the rapid penetration of ADAS, comprehensive automobile electronic level will be raised.
3. 'Me likoloi tse ncha matla a emetseng tataiso ea koloing ea motlakase, ha e bapisoa le koloi ea neano, kopo e phahameng ea boemo ba elektronike, lisebelisoa tsa elektronike ka ditjeo tsa moetlo Limousine e ileng ea ka bang 25%, 45% ho 45% ka likoloi tse ncha eneji, le , buka e ikhethang oona tsamaisong matla taolo (BMS, VCU le MCU), etsa hore tšebeliso koloi PCB e kholoanyane ho feta koloi le setso, tse tharo matla le tsamaiso ea taolo PCB tšebeliso karolelano ea ka 3-5 limithara tse lisekoere, ka tjhelete e ya PCB koloi Pakeng 5-8 limithara tse lisekoere.
4. The kgolo ya ADAS le likoloi eneji ee e ncha, le khannoang ke mabili a mabeli, o ile a boela a 'na a le likoloi elektronike maraka hōla ka e sekhahla ea selemo le selemo ea liphesente tse fetang 15 ka morao tjena years.Accordingly, mebaraka ya PCB tla tsoela pele ho ea holimo,' me e ke a bolela esale pele hore ho hlahisa PCB tla feta $ limilione tse likete tse 4 ka 2018, 'me mokhoa ona kgolo ya e hlakile haholo, injecting botsitso e ncha ka indasteri e PCB.
5. smartphone ebe e ne e le mokhanni e khōlō ea indasteri ea PCB ka mehla past.Mobile Internet, basebelisi ba eketsehileng le ho feta ho tswa PC ho selefouno seemelong thepa, boemo ba PC dikhomphiutha sethaleng potlako nkeloa sebaka ke seemelong mobile, kaha 2008, moreki ea lefatše elektroniki dikarolo kgwebo itima lijo ntshetsopeleng, haholo-holo ka 2012 ~ 2014, smartphone ka infiltration.Therefore ka potlako, ho hōla ka potlako PCB e khannoang ke tlaase ho linoka tsa boemelong selefouno emeloang ke bohlale phones.Between 2010 le 2014, le smartphone maraka ka tlaase ho linoka tsa PCB e ile ea fihla ea selemo le selemo sekhahla karolelano kgolo ya komponeng ea 24%, hole feteng hore ba liindasteri tse ling tlaase ho linoka, ho fana ka kholo bakhanni ka sehloohong bakeng sa ho indasteri e PCB.
Ka e phahameng-qetellong PCB, HDI Ka mohlala, fono selefouno ke ea setso HDI maraka, ka 2015, ho etsa mohlala, li-smartphone e ileng ea fetang halofo lekana, 'me ho tloha pono ea lifono bohlale, eo hona joale e mesebetsi e ncha hoo e ka bang lihlahisoa tsohle sebedisa HDI ka motherboard.
Bobeli ho tloha pono ea PCB le phahameng-qetellong HDI, ke phahameng lebelo la kgolo ya smartphone e isang ho se ho hlokahala nala tlaase ho linoka, ka tsela eo ho tšehetsa kgolo ya lefatše likhoebo PCB molemo.
Empa ha ho na ho latola hore marakeng smartphone e khoehlisa ho tloha 2014, ka mor'a nako e ka potlako khukhuneloa le ho kena butle-butle-smartphone ka era.On setokong marakeng oa lefatše lohle, e prognoza morao-rao ho tswa ho IDC2016 lokolloa ka November 2016, ho lefatše a sekhukhu smartphone ka 2016 ba lebelletswe ho ba limilione tse likete tse 1,45, ka ho qhoma bohlokoa khōlong ea tse 0.6 feela mantsoe a percent.In ya data kgolo ya, le hoja ba ka etsang halofo ea dikopo PCB e tlaase ho linoka li ntse li tšehetsoa ke Strategy, dihlopha fetisisa PCB, ho akarelletsa le HDI, li liehisa ka selefouno seemelong area.
Le hoja e le moelelo oa ho putlama ha moruo, smartphone indasteri ka halofo ea bobeli ke foregone fihlela qeto, empa ka lebaka la ho setokong kgolo, ka lebaka la ho totobetseng e le hantle barekisi ba bang ho tšalo-morao, mosebedisi ya tlhokeho tla khanna replacement.The kholo setokong 'maraka oa lifono bohlale ntse e na le bokgoni ba le leholo,' me barekisi ba boemelong ba tla etsa sohle se matleng a bona ho ntlafatsa bohloko lintlha bareki 'e le hore a susumetse tlhokeho le' maraka itseela share.As lebaka leo, le fono bohlale, e le ka sehloohong tlaase ho linoka kopo ya PCB nakong e fetileng, o na le menyetla e mengata bakeng sa kgolo ya PCB ka bokhothokhotho Moeli o setokong.
Ho fetela ho past lilemo tse peli kapa tse tharo tsa bohlale mokhoa ntshetsopeleng fono, ho amohela menoana, 3D ama, skrine se seholo, camera kopanetsoe le tse ling tse tsoelang pele le popontshwa e se e hlahella, empa hape ho tsoela pele ho susumelletsa Phetolo apkreite.
Moelelong oa lithelefono tsa cellular kena a le lilemo li setokong, e kholo bophahamo ba modumo motheong oa qeto ea hore e kholo e lekanyelitsoeng e bakiloeng ke le popontshwa ho rekisa lintlha ntse o tla etella pele ho ba le keketseho e khōlō ea lenane feletseng demand.Stock popontshwa hape ama PCB lefatše, haeba nakong e tlang smartphone le popontshwa apkreite ho PCB, ho hlahloba o teng fono selefouno moetsi thepa e potlakileng boholo le ka le leng o latele-up tla, le popontshwa apkreite tla potlakisa ho kenella ka hare, ka hona, ho bonahala eka tšoanang ho Optical, mexri, joalo-joalo
6. nahana ka ho PCB indasteri, ho qhoma ha FPC le lera efe kapa efe ya interconnection HDI hohela bahlahisi ba bang ho tšalo-morao, 'me ntlha ka hlahang ho holim'a metsi ya ho theha e le mohlala oa ho kenella ka hare ka potlako:
FPC e boetse e tsejoa e le "pcb tenyetsehang", ke tenyetsehang polyimide kapa poliester filimi botlaaseng lintho tse bonahalang e entsoe ka tenyetsehang oa potoloho boto e ngotsoeng, le segokanyipalo sa ea phahameng oa wiring, boima ba 'mele leseli, botenya masesaane, tenyetsehang, phahameng tenyetseha, Catering ho mokhoa oa sehlahisoa elektroniki bobebe, tenyetsehang mokhoa.
Sebelisoa ka iPhone lona ho fihlela ho likotoana 16 of FPC, phumantsho ya ke ea lefatše ho ea kholo ka ho fetisisa FPC, lefatše holimo tse tsheletseng FPC moetsi oa bareki ba ka sehloohong ba bahlahisi kang apole, Samsung, huawei, OPPO tlas'a apole pontšo hape ntlafatsa FPC tšebeliso ea eona ea li-smartphone.
Smartphone ka matla a ka sehloohong ea ho khanna, kgolo ya FPC ke rua molemo apole le phello ea oona totobetseng, FPC potlako tlala, 09 ka lula re sebeletsa kholo phahameng, selemo le selemo ho tloha lilemong tse 15 e le feela e khanyang letheba ho indasteri PCB, ea e-ba feela positive, kgolo ya sehlopha .
7. Substrate-Joaloka PCB (bitsoa SLP) ka thekenoloji HDI, e thehiloeng tshebetso M-Sap, ka ho eketsehileng hloekisa mohala, na le moloko o mocha oa mola o motle hatisitsoeng oa potoloho boto.
Sehlopha sa boto (SLP) ke moloko o latelang PCB dikhateboto, e leng e ka shortened ho tloha 40/40 microns tsa HDI ho 30/30 microns.From thulaganyou e maikutlo, sehlopha sa hlahlela boto haufi le sebelisitsoe ka semiconductor ambalaji edy boto, empa na le leha ho le joalo ho finyella edy tsa tobileng tsa boto mojaro, le morero oa oona e ntse ba jereng mefuta eohle ea dikarolo etseng letho, phello e ka sehloohong e ntse e leng oa dihlopha tsa PCB.For ena e ncha mola o motle oa khatiso poleiti sehlopha, re tla hlalosa litekanyo tse tharo tsa bohlokoa semelo sa lona, thulaganyo difeme le suppliers.Why 'nang ha u batla ho kenya sehlopha sa mojaro boto: e hloekisitsoeng ka ho fetisisa ambalaji ditlhoko mola superposition Sip, phahameng segokanyipalo e ntse e le mola ka sehloohong, lifono bohlale, matlapa, le lisebelisoa wearable le lihlahisoa tse ling tsa elektronike ho ntshetsa pele ka nģa ea phetoho muti_function miniaturization le, ho tsoela pele ka palo ea dikarolo ea eketseha haholo bakeng sa balebeli ba potoloho boto sebaka Leha ho le joalo, ho feta le ho feta e fokolang.
Tabeng ena, PCB terata bophara, le sebaka dipakeng, le bophara ba tsa phanele senang le hole setsi lesoba, le mokhanni lera le tsona ka botenya ba sireletsang serameng lera oang, eo etsa PCB ho fokotsa boholo, boima ba 'mele le ba modumo ea linyeoe, ho ka amohela components.As ho feta molao Moore ke ho semiconductors, phahameng segokanyipalo ke lelekisa leqoophe tsa mapolanka hatisitsoeng oa potoloho:
Haholo ditlhoko qaqileng oa potoloho a phahame ho feta segokanyipalo HDI.High lehlanya le PCB ho hloekisa mola, 'me sekontiri se metsi tsa bolo (BGA) e shortened.
Ka lilemo tse seng kae fetileng, tse 0.6 limilimithara ho 0,8 limilimithara sekontiri se metsi thekenoloji 'nile la sebelisoa ka maqheka handheld, moloko ona ba lifono bohlale, hobane palo ea I / O motsoako le sehlahisoa miniaturization, PCB pharaletseng SEBELISA theknoloji ea 0,4 limilimithara sekontiri se metsi. mokhoa ona e ho ntshetsa pele ikutloeleng 0.3mm. Ha e le hantle, ho hōla ha 0.3mm thekenoloji lekhalo bakeng boemelong selefouno e se e begun.At nako e tšoanang, e le boholo ba micropore le bophara ea disk tlohang di fokotsehile ho 75 limilimithara le 200 limilimithara ho latellana.
sepheo indasteri ke hore le tlohele micropores le discs ho 50mm le 150mm ka ho latellana ka latelang tse 'maloa years.The 0.3mm sekgala moralo ga tlhaloso hloka hore moleng bophara mola e 30 / 30μm.
a sehlopha sa boto lumellana le Sip ambalaji ga tlhaloso more.SIP oona tsamaisong boemo ba ambalaji theknoloji, e thehiloeng tlhaloso ea machaba semiconductor mola mokgatlo (ITRS): Sip tsa dikarolo tse ngata ba sebetsa ka mafolofolo tsa elektronike le mesebetsi e fapaneng le boikhethelo dikarolo etseng letho, 'me lisebelisoa tse ling tse kang MEMS kapa Optical sesebediswa etelletsa pele hammoho, ho fihlela mosebetsi o itseng oa ka le 'ngoe molao-motheo ambalaji, theknoloji ambalaji ho theha tsamaiso kapa subsystem.
Ho na le hangata ba babeli litsela tsa ho hlokomela mosebetsi oa tsamaiso ea elektronike, e mong o teng SOC, 'me tsamaiso ea lintho tsa elektronike e hlokomela ka ladica i le ba se nang balekane le integration.Another phahameng ke Sip, eo hokahanngwe CMOS le lipotoloho tse ling setshehetso sa le dikarolo tsa elektronike ka sephutheloana le sebelisa ba hōlileng tsebong motswako kapa interconnection theknoloji, e leng ho ka fihlela kaofela mochini mosebetsi ka koahele e tšoanang le ea dita tse fapa-fapaneng tsa tshebetso.
Boto sehlopha sa ke ea PCB dikhateboto, le thulaganyo lona e pakeng phahameng odara HDI le edy poleiti, le phahameng-qetellong HDI bahlahisi le edy bahlahisi boto na le monyetla oa ho ba le seabo.
bahlahisi HDI ba eketsehileng matla, ka lihlahisoa tla key.Compared le edy poleiti, HDI fetohile ka ho eketsehileng oa tlhōlisano le ho e se e le e khubelu leoatle 'maraka, ka margins phaello declining.Face sehlopha sa hlahlela boto, monyetla oa HDI bahlahisi ka se khonang ho fumana le lecha litaelo, ka lehlakoreng le leng, ka hlakoreng le leng ka hlokomela sehlahisoa apkreite, go lekanyetsa sehlahisoa Remix 'me boemo ba moputso, ka hona rera ho matla le ho feta, ea matla ho feta e moralo pele.
Ka lebaka la tsamaiso e phahame ho sehlopha sa hlahlela boto, HDI bahlahisi ho sebelise kapa e ncha ho etsa thepa thepa phetolo, le MSAP thulaganyou e theknoloji bahlahisi HDI hape hloka ithuta nako, ho tloha mokhoa tlosa ka ka MSAP, sehlahiswa ka lihlahisoa tla ba bohlokoa.
8. LED ntshetsopeleng e potlakileng ea phahameng mogote conductivity CCL ba chesang spot.The nyane sekgala LED o na le melemo ea unspelt, ntle bontshiweng sebetsa mme bophelo telele tšebeletso. Lilemong tsa morao tjena, ho o qalile ho tlala, 'me e' nile ea hōla ka potlako. Ka lebaka leo, ho hlokahala phahameng mogote conductivity CCL fetohile e chesang letheba.
Koloi PCB ka ditlhoko boleng sehlahiswa le tšepahala ba ka thata-thata haholo, le ho feta tshebediso ya e khethehileng elektronike thepa tshebetso CCL.Automotive ke bohlokoa PCB tlaase ho linoka dikopo. Kfz-Händler lihlahisoa tsa elektronike lokela ho qala ka ea kopana le likoloi e le mokhoa oa ho tsamaisa lokela ho ba le litšobotsi tsa mocheso, boemo ba leholimo, liphetoho gagamalo, motlakase tshitsiso, thothometsa le tse ling tse bokhoni ba etsehang ho ditlhoko e phahameng bakeng sa likoloi PCB thepa beha ditlhoko pele e phahameng, ho sebelisa eketsehileng Special thepa tshebetso (tse kang thepa ea phahameng Tg, thepa-ba khahlanong le khefi (a petetswa asbestos faeba), thepa teteaneng koporo le thepa ceramic, joalo-joalo) CCL.