Welcome to KingSong PCB Technology
Setšoantšo: habeli sekamela lehlakoreng le le OSP Half Hole Potoloho Board Ka Control Impedance
Sena 2 lera OSP PCB boto sebelisoa ka Industrial Kopo, tse kang Electronic sefotoli, bohlale molaoli eo dihlahiswa, A PCB Potoloho Board Ka OSP Bokaholimo fihlela qetellong ke barbotage pakeng tsa motsoako o le se nang letho pcb boto, Impedance Control le Half Hole tlotsitsoe ka bohale ba boto ea tla ba le e khethehileng le ho e rarahaneng thekenoloji nakong tshebetso tlhahiso, empa hore ho na le bothata leha e le efe bakeng sa rōna re le litsebi PCB moetsi, re ha ba feela fana ka ditshebeletso tenyetseheng pcb, empa hape fana tenyetsehang pcb difeme & ditshebeletso feletseng bokane.
1.Detail PCB Manufacturing bokgoni:
| Che |
ntho |
Misa Production |
mochine |
| 1 |
dikarolo |
1-8 le dikarolo |
1-20 dikarolo |
| 2 |
Max. Panel size |
600 * 770mm (23.62 "* 30,31") |
600 * 770mm (23.62 "* 30,31") 500 * 1200mm (19.69 "* 47,24") |
| 3 |
Max.Board botenya |
8.5mm |
8.5mm |
| 4 |
Mets. boto botenya |
2L: 0.3mm,
4L: 0.4mm,
6L: 0.8mm |
2L: 0.2mm,
4L: 0.4mm.
6L: 0.6mm |
| 5 |
Mets Inner lera Clearance |
0.1mm (4mil) |
0.1mm (4mil) |
| 6 |
Mets Line bophara |
0.1mm (4/4 mila) |
0.075mm (3/3 mila) |
| 7 |
Mets Line sebaka |
0.1mm (4/4 mila) |
0.075mm (3/3 mila) |
| 8 |
Min.Hole size |
0.15mm (8mil) |
0.1mm (6mil) |
| 9 |
Mets tlotsitsoe lesoba botenya |
20um (0.8mil) |
20um (0.8mil) |
| 10 |
Mets Foufetseng / patoa lesoba ka boholo |
0.2mm (8mil) |
0.2mm (1-8layers) (8mil) |
| 11 |
PTH Dia. mamello |
± 0.076mm (± 3mil) |
± 0.076mm (± 3mil) |
| 12 |
Bao e seng PTH Dia. mamello |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 13 |
Hole Boemo kheloha |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 14 |
boima Coppe |
4oz / 140μm |
6oz / 175μm |
| 15 |
Mets S / M sekontiri se metsi |
0.1mm (4mil) |
0.1mm (4mil) |
| 16 |
Soldermask mmala |
Green, e ntšo, Blue, White, Yellow, Red |
Green, e ntšo, Blue, White, Yellow, Red |
| 17 |
Silkscreen mmala |
White, Yellow, Red, Black |
White, Yellow, Red, Black |
| 18 |
kemiso |
Routing, V-groove ka, Beveling litebele |
Routing, V-groove ka, Beveling litebele |
| 19 |
kemiso mamello |
± 0.15mm ± 6mil |
± 0.15mm (± 6mil) |
| 20 |
Peelable maske |
Top, tlase, habeli sekamela lehlakoreng le le |
Top, tlase, habeli sekamela lehlakoreng le le |
| 21 |
laoloa Impedance |
+/- 10% |
+/- 7% |
| 22 |
Insulation Khanyetso |
1 × 1012Ω (Normal) |
1 × 1012Ω (Normal) |
| 23 |
Ka Hole Khanyetso |
<300Ω (Normal) |
<300Ω (Normal) |
| 24 |
Thermal makala |
3 × 10sec @ 288 ℃ |
3 × 10sec @ 288 ℃ |
| 25 |
Koba le sotha |
≤0.7% |
≤0.7% |
| 26 |
Matla a ea motlakase |
> 1.3KV / limilimithara |
> 1.4KV / limilimithara |
| 27 |
Peel Matla |
1.4N / limilimithara |
1.4N / limilimithara |
| 28 |
Solder Shorts Abrasion |
> 6H |
> 6H |
| 29 |
Flammability |
94V-0 |
94V-0 |
| 30 |
teko gagamalo |
50-330V |
50-330V |
2.PCB etella pele nako: (haeba u hloka tšebeletso potlakileng, re ka boela ra kopana)
| Tlhaloso |
habeli lera |
4 lera |
6 lera |
8 lera |
10 lera kapa ka holimo |
| Sampole (WD) |
4 |
7 |
8 |
10 |
12 |
| Boima tlhahiso ea (WD) |
7-9 |
10-12 |
13-15 |
16 |
20 |
3.Package: Inner lephaka paka, Outer tekanyetso lebokose lebokose paka.
4.Shipping:
A: Ka DHL, baholo, FedEx, TNT jj
B: By leoatle bakeng sa palo ka bongata ho ea ka tlhokahalo moreki.
5.If hlokahale khotheishene bakeng sa diporojeke hao PCB, pls fana latelang Info:
A: Quote ngata,
B: Gerber faele ka 274-: x thalong,
C: Technical hlokahalang kapa entsprechen (tse bonahalang, kolohantsoeng, botenya koporo,
boto le tsona ka botenya, holim 'a qetile, solder maske / silkscreen mala ...)
Ha dipatlisiso kapa batla ho ithuta ho eketsehileng, ka kōpo romela ya imeile ho re ka bolokolohi kapa qoqa ke tsamaiso online, leboha bakeng sa tšehetso ea hao esale pele!
