1. Waa maxay sababta looga baahan yahay guddiga circuit aad guri
In line ee galinta si toos ah, haddii guddiga circuit daabacaadda ma aha guri, waxaa ka dhigi doonaa meesha uu u noqon sax ahayn, qaybaha aan la gashan karaa gelin godka iyo dusha sare ee ahaa wasladdii khafiifka, iyo xataa siib automatic loader.When guddiga PCB oo soo ururay oo qayb ka ah waxaa welded ka dib, kabida, iyo cagta ee element waa ay adag tahay in laga gooyaa, guddiga PCB neatly.The sidoo kale aan lagu rakibi karo sanduuqa mishiinka ama godka ee mashiinka, sidaas darteed, warshad saxan kulanka shirka PCB qalloocan yahay sidoo kale waa mid aad u troublesome.At joogo, ee guddiga circuit daabacaadda ayaa galay marxalad ka mid ah loo xirxiro dusha iyo rakibaadda chip, iyo circuit geedka daabacay guddiga shirka waa in ay noqdaan qaar badan oo ka adag iyadoo looga baahan yahay of saxan qalloocan yahay.
2. Standard iyo imtixaanka habab dunta
Sida ay United States IPC-6012 (1996 edition) << aqoonsiga guddiga circuit daabacay adag iyo caddaymaha waxqabadka >>, warping la ogolyahay ugu badnaan iyo dhalanrog of saxan dusha sii kordhaya waa 0,75%, iyo dhan loox kale PCB waxaa loo ogol yahay 1.5% .Tani ayaa kor shuruudaha korka ka sii kordhaya guddiga saxan oo ka mid ah IPC-RB-276 (1992 version) .Marka la joogo, degree dunta fidsan ee liisanka ee kasta ee shirka PCB elektaroonik ah dhirta, iyadoo aan loo eegayn double ama PCB multi-lakabka, 1.6mm oo dhumucdiisuna waxay, sida caadiga ah 0.70 ~ 0,75%, dad badan oo SMT, saxan BGA, looga baahan yahay 0.5% .Qaar korantada warshadaha waxaa qas kordhiyo 0.3 boqolkiiba heerarka warping, iyo tallaabooyinka warping imtixaanka raaco gb4677. 5-84 ama guddiga PCB IPC-TM-650.2.4.22b.Put on boosteejo ah oo xaqiijin, irbad imtixaanka si dunta degree of hoose ee ugu weyn, si ay u tijaabiso dhexroorka irbadda, qaybsan by dhererka qalooca guddida PCB, dunta degree of guddiga circuit ku daabacan loo xisaabin karaa.
3. Warping inta lagu guda jiro soo saarta habka
design 1. Engineering: design ee guddiga circuit daabaco in la ogaadaa waa:
A. heshiis ee prepreg u dhexeeya lakab waa in symmetrical, sida lixda laminates PCB Board , dhumucda 1 ~ 2 iyo 5 ~ 6 layers waa in ay waafaqsan tahay tirada xabbadood semi-bedesheen ah, haddii kale cadaadis lakabka sahlanaan doonto in ay dunta fidsan.
B. Multi-dahaaray PCB asaasiga ah iyo kiniiniyada semi-daaweyn loo isticmaali doonaa in waxyaabaha qeybiyaha la mid ah ayaa.
C. Aagga oo ka mid ah khadadka A iyo B dibadda ah waa in sida ugu dhow ee possible.If wejiga A waa A dusha copper waaweyn, iyo B waa kaliya A dhowr khadadka, saxanka waa u fududahay in ay dunta fidsan ka dib markii etching.If labada dhinac oo ka mid ah farqiga meesha line aad u ballaaran yahay, waxaad ku dari kartaa qaar ka mid ah Roobka la taag daran dhinaca caatada ah, si ay u dheelli.
2, guddiga dubida hor jarida:
CCL guddiga PCB dubista hor jarida (150 degrees, 8 ± 2 hours) ujeeddo waa in meesha laga saaro qoyaanka gudaha guddiga, oo waxaad ka samaysaa cusbi u daaweyn gudahood saxan, sii baabi'inta stress haraaga ah ee saxan, taas oo waa waxtar leh si looga hortago in guddiga warping.At joogo, PCB badan double-madaxyo simanna, loox PCB multi-lakabka weli u hoggaansamaan ee pre-blanking ama post-dubayo step.But sidoo kale waxaa jira qaar ka mid ah warshad wax soo saarka guddiga PCB, hadda guddiga circuit PCB ah Warshadda guddiga dubista sharciyada waqtiga sidoo kale khilaafsan, laga bilaabo 4 illaa 10 saacadood, soo jeediyay in fasalka sida ay wax soo saarka ee daabacay guddiga circuitiyo baahida macaamiisha waayo degrees dunta si decide.Cut googooyo ama ka dib gabal oo dhan kariyaa, kariyaa, foornada gooyay wax, labada hababka waa macquul, waxaa lagu talinayaa jarida guddiga dib markii jarida. Guddiga hoose sidoo kale waa in qalajinta guddiga.
3. dunta fidsan iyo weft of prepreg:
Ka dib markii dukumiintiyo prepreg ah, yaraanshaha ee tilmaamaha dunta fidsan iyo weft waa ka duwan yahay, iyo tilmaamaha dunta fidsan iyo weft waa in la kala duwanaayeen markii blanking iyo stacking.Otherwise, waa ay fududahay in dunta saxan dhamaystirtay ka dib laminating, xitaa haddii ay adag tahay in la saxo. Multi-lakabka PCB sababo warping, qaar badan oo ka mid ah dukumiintiyo ah ee prepreg markii dunta fidsan iyo weft ma u dhexeeya kala saaro, yaac iyo kala sooc lahayn ay keento.
Sida loo kala saaro loolka iyo dhigaha? Roll prepreg duudduubay jihada waa dunta, iyo jihada width waa weft ah; copper guddiga bireed dhinaca dheer, kooxda yar latitudes waa dunta fidsan, haddii aan la hubi inaad la soo saaraha ama qeybiyaha.
4. Stress ka dib markii laminating:
guddiga PCB multilayer, ka dib markii fulinta cut ama axdi qarameedka ka burrs qabow-saxaafadeed kulul-riixaya, ka dibna flat on dubayo ee Celsius foornada 150 degrees 4 saacadood, si stress ka intraplate si tartiib tartiib ah u sii daayo oo ka dhigi cusbi ku bogsiiyey , tallaabadan waa ka baxeysaa.
5. Baahida in toosi waslad khafiif ah halka dahaadhay:
0.4 ~ 0.6mm khafiif ah guddiga PCB multi-lakabka for dahaadhay guddiga circuit iyo dahaadhay graphic waa in la sameeyaa of kitaabkii duudduubnaa qanjaruufan gaar ah, line dahaadhay si toos ah on clip Feiba on xaashida, oo leh bar wareega inay clip oo dhan on Fiba ee xadhig leh waxaa wada Hashii lagu toosiyo oo dhan wuxuu u sameeyey looxyada wareeg daabacan isaguu ku si taargooyinka plated ma deform doonaa. Xisaab la'aan this, ka dib markii dahaadhay labaatan ama soddon microns of lakabka copper, xaashida la xootay doonaa, oo ay adag tahay in daawaynta.
6. Guddiga qaboobaya ka dib markii Nigeria hawada kulul:
Hawada kulul oo ka mid ah daabacay guddiga circuit waxaa saameeya heerkulka sare oo qabaal Alxan (oo ku saabsan 250 digrii Celsius). Ka dib waxaa la saaray, waa in lagu shubaa marmar ama bir waslad khafiif ah oo guri in ay si dabiici ah ku qaboojiyo, ka dibna mashiinka post-processing waa cleaned.This u fiican yahay warping ee warshad boards.Some si kor loogu qaado dhalaalka dusha sare ee hogaanka , iyo waxa daasadda, guddiga biyaha qabow galay, isla markiiba ka dib Nigeria hawada kulul a seconds yar oo reprocessing ka dib, qandho sida lama filaan ah oo qabow ah, waayo, noocyo ka mid ah loox u badan tahay in ay soo saaraan warping, Intaa waxaa dheer oo israac raacsan ama blister.In, ka hawada sariirta sabayn lagu dari karaa si uu ku qaboojiyo qalabka.
7. warping processing guddiga:
In warshad si fiican loo maamulo, guddiga yeelan doontaa jeeg flatness 100% ah oo ku saabsan kormeerka final. All loox PCB aan la aqbali karin in la soo gaaray doonaa, meeleeyay foorno, dubay at 150 degrees Celsius cadaadis weyn oo culus 3 ilaa 6 saacadood, iyo cadaadis ka mid ah qaboojinta dabiiciga ah. Markaas dajinaya saxan iyo ka qaad guddiga PCB ah, in jeegga flatness ah, sidaas darteed qayb ka mid ah guddiga la badbaadin karaa, iyo qaar ka mid ah loox wareeg daabacan u baahan tahay in laba ilaa saddex jeer kariyaa, si ay u level.If anti kor ku xusan -warping tallaabooyinka habka aan la fulin, qaar ka mid ah dubista guddiga waa aan waxtar lahayn, kaliya burburinayo.