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Study on sifooyinka qalabka PCB Ceramic

 

Iyadoo horumarinta sayniska iyo farsamada, daabacay guddiga circuitayaa waxay noqdeen qayb electronic lagama maarmaan ah, guddiga circuit daabacay ayaa lagu baxshay sida substrate electronic imanba substrate.Traditional for Al2O3, iyo SIC, BEO iyo substrate AlN, kuwaas oo qalab ku conductivity kaamerada ah, laabaya xoog iyo Wehliyaha ballaarinta kaamerada uu leeyahay qaab ciyaareed wanaagsan, waxaa haatan si ballaaran loo isticmaalo warshadaha waxbarasho MCM substrate.The oo ka mid ah waxyaabaha PCB Ceramic waa Al2O3 micron iyo CaZrO3 sida wax ugu weyn ee cayriin, la isticmaalayo foorno iska caabin carbide Silicon sintering, iyo baadi- cufnaanta qaraabo, joogto dielectric iyo guryaha khasaaro dielectric.

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Dhoobada PCB Qalabka

Falanqaynta cufnaanta 1.Relative
Falanqaynta dhoobada cufnaanta Qaraabo PCB
The influence of the relative density of alumina ceramic integrated circuit substrate with different micron Al2O3 and nano CaZrO3 powder was added.By a figure known as the temperature increases, the relative density with the increase of substrate material, temperature of 1100 ℃ maximum.When micron Al2O3 content is 60 wt %, the adding amount of nano ZrO2 is 10 wt %, the relative density of alumina ceramic pcb substrate integrated material relative to other formula is the largest, the sample is relatively dense, is beneficial to integration of alumina ceramics substrate material mechanics performance improvement.

Falanqaynta joogto 2.Dielectric
PCB Qalabka Dielectric falanqaynta dhoobada joogto ah
The above is the dielectric constant of the PCB Ceramic material with the curve of sintering temperature.It can be seen that as the temperature rises, its dielectric constant increases.When the temperature reached 1100 ℃, the dielectric constant peak.When the addition of micron Al2O3 was changed from 50 wt% to 65 wt %, and the addition of nano-cazro3 was changed from 20 wt% to 5 wt %, the dielectric constant of the alumina integrated electric subgrade plate was first increased and then decreased.When the content of micron Al2O3 was 60 wt% and the content of nano CaZrO3 was 10 wt %, the sample performance was the best.This is because the factors that influence the dielectric constant are multifaceted, as long as the chemical composition of the formulation is involved, the more the alkali metal ion oxide content is, the greater the permittivity is.In addition, the thermal exercise of the ions and dipoles in the process of rising temperature increases, resulting in an increase in the permittivity.

Falanqaynta khasaaro 3.Dielectric
Plate PCB dhoobada falanqaynta khasaaro Dielectric
The above is the dielectric loss of the ceramic pcb cesubstrate material with the sintering temperature curve.As the temperature increases, the dielectric loss gradually decreases.When the micron Al2O3 in 50 wt % 65 wt % change between nano CaZrO3 between 20 wt % to 5 wt % change, dielectric loss reduced after increased first, when the micron Al2O3 content is 60 wt %, nano CaZrO3 amount to 10 wt %, and when the sintering temperature is 1100 ℃, the dielectric loss value of the minimum sample after sintering.
The dielectric loss of the ceramic pcb material is caused by the internal electron, ion drain and space charge polarization, and the smaller the volume resistivity of the material, the larger the dielectric loss.Of the existence of samples CaZrO3 Ca (superscript 2 +) ions of other low price and tetravalent Zr ions produce depressive effect, make the dielectric loss of samples increased, the Na2O and the existence of K2O, makes the ion K and Na ions as a result of the action of the double effect of alkali, make the network combined with close, so the sample dielectric loss less.

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