1. Sida an isku xira elektaroonik ah oo muhiim ah, PCB loo isticmaalo waxyaabaha ku dhowaad dhammaan elektaroonik ah, waxaa loo arkaa "hooyo ee alaabta hab elektaroonik," isbedelada ay tiknoolaji iyo isbedelka suuqa ayaa noqday diiradda ah dareenka ganacsiyada badan.
Currently, waxaa jira laba-rogga cad in waxyaabaha elektarooniga ah: mid waa khafiif ah oo gaaban, kooxda kale waa hirka sare, xawaaraha sare ee drive PCB geysto sida in cufnaanta sare, is-dhexgalka sare, encapsulation, khiyaano, iyo jihada of stratification badan, baahida loo qabo sii kordhaya ee ee PCB lakabka sare iyo HDI .
Top pcb board wiring length is short, low impedance circuit, high-frequency high-speed work, stable performance, can take on more complex function, is to the high frequency electronic technology, multi-function large capacity development inevitable trend.In particular, the in-depth application of large-scale integrated circuits will further drive PCB to high precision and high level.
2. Waqtigan xaadirka ah, PCB waxaa inta badan loo isticmaalaa qalabka guriga, PC, desktop iyo alaabooyinka kale ee elektaroonigga ah, halka codsiyada-dhamaadka sare sida waxqabadka sare server multi-hab iyo aerospace waxaa looga baahan yahay in ay leeyihiin in ka badan 10 layers of PCB.Take server tusaale, guddiga PCB on server hal iyo laba iyo jidka guud ahaan inta u dhaxaysa 4-8 layers , halka guddiga ugu weyn ee server-dhamaadka sare, sida 4 iyo 8 waddooyinka, waxay u baahan tahay in ka badan 16 layers , iyo backplate ah looga baahan yahay waa ka sii sarreeyaa 20 layers.
HDI cufnaanta taararka qaraabo si caadi ah guddiga PCB multilayer waxay leedahay faa'iidooyin cad, taas oo ah doorashada ugu weyn ee mainboard ah function smartphone.Smartphone hadda baaxad weyn iyo mugga horumarinta khafiifa, meel wax ka yar iyo wax ka yar, waayo guddiga ugu weyn, waxay u baahan yihiin Limited waday in ka badan oo qaybaha soo on board ugu weyn, guddiga multi-lakabka caadiga ah ayaa ku adag tahay in ay buuxiyaan baahida.
High-cufnaanta guddiga circuit isku (HDI) wuxuu qaadanayaa guddiga dahaaray sharci nidaamka, guddiga multilayer caadiga ah sida Sargaal Sare ee muhiimka ah guddiga, isticmaalka qodista, iyo habka metallization godka, samaynta dhamaan lakabyada xadka u dhaxeeya shaqada la xidhiidha gudaha. Marka la barbar dhigo dhex-dalool kaliya loox PCB multilayer caadiga ah, HDI si sax ah oo dhigaya tirada vias indha la 'oo vias aasay si loo yareeyo tirada vias, badbaadiyaa degaanka qaabka PCB, oo si weyn u kordhiyaa cufnaanta qayb, sidaas si degdeg ah dhamaystirka howlgalka multilayer ee casriga ah beddeli Laminating. 
The technical difference of HDI is reflected in the increment stacked number, the more layer quantity, the more difficult the technology.HDI can be divided into single stacked HDI, doule stacked HDI, triple stacked HDI,or high stacked HDI, etc., the number of layers is expressed as C+N+ C, where N is the number of normal core laminar, and C is the number of added layers, namely the stacked number of HDI..High stacked HDI cabling has higher density, but at the same time, it has more pressure, such as position, punch hole and copper plating, etc., which has higher requirements on the technical process and process capability of the manufacturer.
Popular sannadihii la soo dhaafay in HDI-dhamaadka sare smartphone daaha loo aabo yeelin waxaa ugu sareeya Mire Waqaf oo ah HDI, waxay u baahan yihiin wax indha la 'godad xiriir ka dhexeeya layers xiga, iyadoo ay ku saleysan HDI caadiga badbaadin lahaa ku dhowaad nus ka mid ah mugga, si loo sameeyo qolka more waayo, batteriga iyo qaybaha kale.
Lakabka kasta oo HDI u baahan adeegsiga tiknolojiyada sare sida qodista laser oo gelanayo godka electroplated, taas oo ah wax soo saarka ugu adag iyo nooca ugu sareeya ee qiimaha-daray HDI, kaas oo ugu wanaagsan ee ka tarjumaya karaan heerka farsamo ee HDI. 
Two important trends of the automobile industry are intelligent and electric.ADAS (Advanced Driver Assistance System) as the transition of complete intelligent driving before, has become a major automakers and crossover of Internet giant rushed to the layout of the new strategic highland, it involves the electronic device cover nearly all of the whole vehicle driving and safety related System, with the rapid penetration of ADAS, comprehensive automobile electronic level will be raised.
3. Oo baabuurta tamar cusub ayaa ka dhigan jihada of gaariga korontada, iyadoo gaariga dhaqanka marka la barbar dhigo, codsiga sare ee heer elektaroonik ah, qalabka elektarooniga ah ee kharashka limousine dhaqameed lagu tiriyaa ku saabsan 25%, 45% iyo 45% ee baabuurta tamar cusub , nidaamka gacanta awood u gaar ah (BMS, VCU iyo MCU), ka dhigaa isticmaalka PCB gaariga waa ka badan gaariga dhaqanka, saddexda gacanta awoodda nidaamka PCB celceliska isticmaalka ah oo ku saabsan 3-5 mitir oo laba jibbaaran, xaddiga PCB gaariga u dhaxaysa 5-8 mitir oo laba jibbaaran.
4. koritaanka ee ADAs iyo gaadiidka tamar cusub, kexeeyey oo laba giraangirood, ayaa sidoo kale lagu hayaa suuqa korantada baabuurta sii kordhaysa ee heerka sanadle ah oo ka badan 15 boqolkiiba ee la soo dhaafay years.Accordingly, suuqa ee PCB intii ka sii wadi doonaa, oo waa saadaaliyay in wax soo saarka ee PCB ka badan doonaa $ 4 bilyan oo 2018, iyo isbeddel koritaanka waa mid aad u cad, isku duro dardar cusub gelinno warshadaha PCB ah.
5. casriga ayaa darawalka weyn ee warshadaha PCB ee Zaman Internet past.Mobile ah, dadka isticmaala badan oo ka PC qalabka terminal mobile, xaaladda madal Kombuyuutarada PC si dhakhso ah bedelay terminal ka mobile, tan iyo sanadkii 2008, macaamiisha caalamka qaybaha electronic ganacsi horumarka degdeg ah, gaar ahaan 2012 ~ 2014, casriga galay infiltration.Therefore degdeg ah, si weynna u kobcay PCB la eryay by hoose ee boosteejada mobile wakiil phones.Between smart 2010 iyo 2014, suuqa smartphone ee hoose ee PCB ah gaadhay heerka koritaanka xarunta ah celceliska sannadlaha ah ee 24%, ilaa hadda aad iyo aad u ah in warshado kale geysto, bixinta darawallada koritaanka weyn ee warshadaha PCB ah.
In-dhamaadka sare PCB, HDI, tusaale ahaan, telefoonka mobile waa suuq HDI dhaqanka, 2015, tusaale ahaan, casriga ah lagu tiriyaa in ka badan nus saamiga, iyo marka laga eego ee telefoonada smart, shuqullada cusub la joogo ku dhawaad alaabta oo dhan iyadoo la isticmaalayo HDI sida motherboard.
Labada marka laga eego ee PCB iyo-dhamaadka sare HDI, waa xawaaraha sare ee koritaanka smartphone keenta in baahida barwaaqada geysto, sidaas taageeraya koritaanka shirkadaha faa'iido PCB caalamka.
Laakiin ma jiraan wax diidaya in suuqa casriga ah ayaa hoos u dhac tan iyo 2014, ka dib markii muddo dhexgalka deg deg ah oo soo galo si tartiib ah casriga galay era.On saamiyada suuqa caalamiga ah, saadaasha ugu dambeeyay ee ka IDC2016 sii daayay bishii November 2016-ka, ee shixnadaha smartphone caalamka 2016 ayaa la filayaa in uu noqdo 1.45 billion, la boodi weyn ee koritaanka kaliya 0.6 percent.In eego xogta koritaanka, inkastoo nus ka mid ah codsiyada geysto PCB ayaa wali ay taageerto telefoonada gacanta, inta badan qaybaha PCB, oo ay ku jiraan HDI, ayaa yareeyey ee aagga terminal mobile.
Inkastoo ee macnaha guud ee hoos u dhaca dhaqaalaha, warshadaha casriga ah qeybtii labaad mid natiijadeeda la ah, laakiin ku salaysan stock badan, ay sabab u tahay bandhig saamaynta waratada kale in ay dabagal, baahida macaamiisha eryi doonaa replacement.The stock weyn suuqa telefoonada smart wali leedahay awood weyn, iyo waratada ee boosteejada ku sameyn doonaa inti karaankiisa ah si loo hagaajiyo dhibcood xanuun macaamiisha si ay u kicin baahida iyo suuqa qabsado share.As natiijo, telefoonka smart, sida codsiga ugu weyn ee uu webigu ee PCB ee la soo dhaafay, ay leedahay awood weyn oo loogu talagalay koritaanka PCB ee soohdinta stock weyn.
In ka badan laba ama saddex sano ee la soo dhaafay ee arrimuhu smart horumarinta phone, aqoonsiga faraha, 3D Touch, screen weyn, dual camera iyo hal-abuurnimo kale oo joogto ah ayaa soo baxaya, laakiin sidoo kale ay sii wadaan in ay kicin hagaajinta bedelka.
In macnaha guud ee telefoonada gacanta galaya da'da stock, sal mug weyn ay go'aamiso in koritaanka qaraabo sababa cusub ee dhibcaha iibinta weli waxay keeni doontaa in kor u kaca weyn ee tirada buuxda ee demand.Stock ee hal-abuurnimo sidoo kale saamayn ku PCB caalami ah, haddii mustaqbalka hagaajinta abuurnimo smartphone in PCB, ka fiirsaneysa inay soo saaraha telefoonka mobile size jira shixnad deg-deg ah iyo mid kale oo dabagal doonaa, hagaajinta abuurnimo dardar doonaa wax lays, sidaas u muuqan mid ah indhaha, loomana baahno, iwm
6. Ku Nuuxnuuxsiga ee PCB warshadaha, dillaacay of qoyska iyo daaha kasta oo ka mid HDI isku soo jiidata saarayaasha kale in ay raacaan, oo barta radiates in ay dusha sare si ay u sameeyaan model ah oo wax lays deg deg ah:
qoyska waxaa sidoo kale loo yaqaan "PCB dabacsan", waa wax a polyimide ama film caag saldhig dabacsan, oo loox dabacsan daabacay circuit dhigay, la cufnaanta sare ee taararka, miisaanka iftiin, oo dhumucdiisuna waxay khafiif ah, dabacsan, dabacsanaan sare, kadambeeya in dhaqankan cusub ee sheyga elektaroonik ah oo khafiifa, arrimuhu dabacsan.
Waxaa loo adeegsaday in ay iPhone ilaa 16 gogo 'oo qoyska, soo iibsiga waa qoyska, top lix ugu weyn dunida ee adduunka ee soo saaraha ee qoyska macaamiisha ugu muhiimsan yihiin saarayaasha sida tufaaxa, Samsung, Huawei, OPPO hoos bandhig tufaaxa ayaa sidoo kale kor u adeegsigii qoyska ee casriga ah.
sannad kasta casriga ah sida ciidanka wadida asaasiga ah, koritaanka qoyska waa lacagta ka tufaax iyo saamaynta bandhig ay, qoyska si degdeg ah ka doodida, 09 joogteyn karto koritaanka sare, tan iyo 15 sano ee sida kaalinta kaliya ee dhalaalaya in industry PCB, wuxuu noqday category koritaanka wanaagsan kaliya .
7. substrate-Like PCB (loo yaqaan SLP) ee technology HDI ah, oo ku salaysan habka M-SAP, sii kala miiri karaa khadka, waa jiil cusub oo line ganaax daabacay guddiga circuit.
Guddiga ayaa fasalka (SLP) waa sibibixda PCB jiilka soo socda, taas oo loo gaabin karaa 40/40 microns of HDI in 30/30 microns.From dhibic habka of view, guddiga loading fasalka u dhaw in loo isticmaalo in guddiga Baakadaha Semiconductor IC, laakiin weli in ay gaaraan IC oo ka mid ah caddaymaha guddiga Xamuulka, iyo ujeedada weli waxa uu wadaa jiray cayn kasta oo ka kooban dadban, natiijada ugu weyn ee weli iska leh category ee PCB.For ee this line ganaax saxan daabacaadda category cusub, waxaana fasiri sadex dhinac oo asalkoodu soo dejinta ay, habka wax soo saarka iyo ka iman kara suppliers.Why samayn aad rabto in aad soo dhoofsadaan guddiga load fasalka: shuruudaha baakooyinka line SIP superposition aad u la safeeyey, cufnaanta sare waa weli line ugu weyn, telefoonada smart, kiniin, iyo qalabka wearable iyo alaabooyinka kale ee elektaroonigga ah si ay u horumariyaan jihada of miniaturization iyo isbedelka muti_function, si ay u fuliyaan on tirada qaybaha waxa si wayn u kordhay waayo, meel guddiga circuit, si kastaba ha ahaatee, qaar badan oo ka kooban.
Macnaha halkan, width silig PCB, kala dheereynta, dhexroorka of guddiga micro iyo masaafada dhexe godka, iyo daaha kaari ah oo dhumucdiisuna waxay of lakabka qalabada yihiin, taas oo ka dhigi PCB si loo yareeyo size, miisaanka iyo mugga kiisaska waxaa, karo components.As dheeraad ah sharciga Moore waa in semiconductors, cufnaanta sare waa raad joogto ah oo looxyada ku circuit daabacay:
Aad iyo shuruudaha circuit faahfaahsan oo ay ka sareeyaan HDI.High cufnaanta kaxeeya PCB si loo tijaabiyo khadka, iyo garoonka kubada (BGA) waa la soo gaabiyey.
In dhawr sano ka hor, ka 0,6 mm in 0.8 mm technology garoonka ayaa loo isticmaali jiray in qalabka Xararad, qarnigan ee telefoonada smart, sababtoo ah tirada oo aan qayb O / iyo miniaturization wax soo saarka, PCB ballaaran ISTICMAALKA technology ee garoonka 0.4 mm. Isbeddelkani waxa uu horumar dhinaca 0.3mm. Dhab ahaantii, horumarinta 0.3mm technology farqiga for boosteejada mobile ayaa hore u begun.At waqti isku mid ah, size ee micropore iyo dhexroor ee disc ee isku xidha ayaa waxaa hoos u dhigay 75 mm iyo 200 mm siday u kala horreeyaan.
goolka industry ee waa in ay hoos u micropores oo cajaladood in 50mm iyo 150mm siday u kala horreeyaan in yar years.The 0.3mm faahfaahinta soo socda design kala dheereynta u baahan yahay in line line width waa 30 / 30μm.
uu guddiga fasalka ku haboon faahfaahinta Baakadaha SIP more.SIP technology Baakadaha heerka nidaamka, ku salaysan qeexidda ururka caalamiga ah line Semiconductor (ITRS): kabasho ah ee ka kooban firfircoon badan electronic hawlo kala duwan iyo qaybaha dadban optional, iyo aaladaha kale sida MEMS ama mudnaanta qalab indhaha wada, si ay u gaaraan shaqo gaar ah oo baakadaha hal caadiga ah, technology baakadaha ah si ay u sameeyaan nidaam ama jimaynta.
sida caadiga ah Waxa jira laba siyaabood si ay ugaaraan shaqo ee nidaamka elektarooniga ah, mid ka mid ah waa GOS, iyo habka electronic waxaa ogaaday on chip kaliya ee la integration.Another sare waa SIP, taas oo midaynaysa CMOSka iyo wareeggeedii kale isku dhafan oo ka kooban electronic galay xirmo isticmaalaya baaluq isku dhafan ama isku technology, taas oo gaari karo shaqada mashiinka oo dhan iyada oo ku dahaadhaa ee isku midka ah ee chips functional kala duwan.
Guddiga fasalka iska leh PCB sibibixda, iyo nidaamka u dhaxaysa si sare HDI iyo saxan IC, iyo-dhamaadka sare saarayaasha HDI iyo saarayaasha guddiga IC fursad u leeyihiin inay ka qayb qaataan.
saarayaasha HDI yihiin more firfircoon, dhalidda la key.Compared doonaa saxan IC, HDI ayaa si isa soo taraysa ee tartan rasmi ah oo uu noqday suuq badda cas, la xadad faa'iido declining.Face guddiga loading fasalka, fursad of saarayaasha HDI kartaan si aad u hesho cusub amarada, ka mid ah gacanta, ayaa dhanka kale ay ogaadaan karaa hagaajinta wax soo saarka, fiican isku darka wax soo saarka iyo heerka dakhliga ku soo gala, oo sidaas daraaddeed doonayaan in ay xoog, oo awood badan qaabka ugu horeysay.
Sababo la xiriira guddiga loading fasalka ka sareeya nidaamka, saarayaasha HDI in ay maal ama wax ka beddelid qalab cusub soo saarka, iyo MSAP technology habka for saarayaasha HDI sidoo kale u baahan tahay waqti waxbarasho, ka hab-goynta galay MSAP ah, dhalidda wax soo saarka waxay noqon doontaa muhiim ah.
8. LED horumarinta deg deg ah ee CCL sare conductivity kaamerada noqon spot.The kulul LED dheereynta yar uu leeyahay faa'iidooyinka unspelt, saamayn bandhigay wanaagsan iyo nolol dheer. Sanadihii la soo dhaafay, waxa uu bilaabay inuu ka doodida, oo waxaa la dhakhsaha badan u kordhaya. Iyadoo la raacayo, looga baahan yahay CCL conductivity kaamerada sare waxa uu noqday kaalinta kulul.
PCB Vehicle on shuruudaha tayada wax soo saarka iyo isku halaynta ay yihiin kuwo aad u adag, iyo isticmaalka badan oo korantada qalabka waxqabadka CCL.Automotive gaar ah waa PCB ah codsiyada geysto muhiim ah. products electronic Automotive waa in marka hore la kulmaan baabuurta ah iyada oo loo adeegsanayo gaadiid waa in ay leeyihiin sifooyinka of heerkulka, cimilada, isbedbedelka danab, faragelinta electromagnetic, gariirka iyo awooda kale qabsiga shuruudaha sare ee qalabka PCB baabuurta saaray shuruudaha weeraryahanka sare, isticmaalka more Gaarka ah qalabka wax qabadka (sida qalabka sare Tg, qalabka anti-CAF (Tifaftirayaasha fiber asbestos), qalabka copper qaro weyn iyo qalabka dhoobada, iwm) CCL.