Uamea PCB Koru

With the increase of the LED chip size and polycrystalline LED the development of packaging design, LED the heat load are also redouble,in addition to this the heat dissipation capacity of plate material, its thermal stability of materials are also affect the LED products’ life.In short, high power LED products loading board material needs to have at the same time the characteristics of high heat dissipation and high heat resistance, so the packaging substrate material becomes the key factor, on the application of traditional LED heat dissipation substrate,Uamea PCB Koru be widely used.

Metal core printed circuit board PCB (you aslo can call it MCPCB , PCB vevela, Mamafa PCB apamemea) e agalelei o PCB laupapa ma uamea faavae mea nai lo tioata lalagaina FR4, FR3 po others.There o le tasi itu, e lua itu, ma multilayer laupapa. O le tele o Metal Core PCB manufacturers are commonly used metal core material is aluminum, copper and alloy. Aluminum is the most frequently used among them due to its good heat transfer ability,dissipation ability and relatively cheaper costs than copper,even which may has a better performance,so it widely was accepted.copper although have better performance,but its cost more expensive,steel is more rigid than both aluminum and copper,it has normal steel and stainless steel,but its thermal conductivity is lower than others,simple speaking,aluminum material is the best choice,even considering from cost,rigidness and thermal conductivity.

There are single sided,two layer and multi-layer mcpcb,the Single sided metal core printed circuit board consists of a metal base (aluminum or copper alloy), dielectric layer, and copper conductor layer. The single layer MCPCB can be used with surface mount and chip & wire components. It provides much lower thermal resistance than FR4 PCB. And the metal core provides lower cost and allows much larger areas than ceramic substrates.

Uamea PCB Koru e faaaoga e sui PCBs masani FR4 po CEM3 ona o le tomai e vaevaeina lelei vevela ese mai le vaega. Ausia lenei mea i le faaaogaina o se vaega dielectric conductive thermally.

O le prepreg dielectric maua faaliliuina vevela lelei mai le pepa alumini ma vaega i le ipu faavae, ae o le faatumauina o le faaesea eletise lelei. O le faavae alumini po apamemea ipu tuuina atu e le tasi itu-substrate faamaoni masini, ma tufatufa atu ma faaliliuina i le vevela i se tapu vevela, mounting luga po o le saʻo i le ea ambient.

vaega PCB Koru uamea:

• togafitiga lelei o diffusion vevela i mamanu matagaluega PCB
• Faaitiitia faagaoioia vevela, faateleina mana density ma le faatuatuaina, ona faaopoopo le olaga o oloa
• Laiti tulagavae, tau maualalo o masini ma faapotopotoga
• Sui le maʻaleʻale substrates keramika PCB ma le anagata masini sili

talosaga PCB uamea Koru:

• Moli: loo taitaia le Malamalama o le tagata e faaaogāina sili o PCB alumini
• Mana module: Converters Power, Inverters, relays mautu tulaga, mana alalaupapa rectifier
• Mana tuuina atu: fesuiaʻi Pule Faatonu, DC / faaliliu AC, Pule Faatonu SW
• Fesootaiga meafaigaluega faaeletoroni: mea faʻamau maualuga-taimi, mea faigaluega e faamama, matagaluega transmitter
• meafaigaluega leo: sao, amplifiers galuega faatino, amplifiers paleni, otio amplifiers, preamplifiers, amplifiers mana
• laupapa CPU, floppy aveina tisiki, mana masini tuuina atu: komepiuta
• Ofisa meafaigaluega faʻaautomatika: aveina afi ...
• module Mana: Inverters, mautu relays tulaga, mana alalaupapa rectifier
• Taavale: Pule Faatonu faaeletonika, sulu, pule mana ...

gafatia: