E tele ni taualumaga i luga o le laupapa matagaluega lomia : laupapa pcb lavalava (leai se togafitiga luga), OSP, vevela faalaugatasi Air (taʻimua apa, taitai-saoloto apa), Plating auro, faatofuina auro isi nei e sili atu vaaia.
O le eseesega i le va o le auro faatofuina auro ma Plating
Faatofuina auro o se auala o Deposition vailaau. ua faia e se vaega vailaau e se tali faaitiitia-oxidation vailaau. E masani lava, o matua mafiafia le mafiafia. O se ituaiga o vailaau auala Deposition vaega limasene-auro-auro, ma e mafai ona ausia se mafiafia vaega auro.
Faaaoga plating Gold le mataupu faavae o electrolysis, ua taua foi electroplating. O le tele o isi togafitiga luga uamea ua electroplated foi. 
In the actual product application, 90% of the gold pcb board is the immersed gold pcb board,because the poor solderability of the plated circuit board is his fatal flaw, and it is also the direct cause of many companies to give up the gold plating process!
Teuina faagasologa auro faatofuina i luga o le lomia laupapa matagaluega ma lanu fale o manu, pupula lelei, plating lamolemole, ma solderability lelei o limasene plating auro. Uiga moni lava e mafai ona vaevaeina i vaega e fa: muai togafitiga (suauu aveesea, Laiti-etching, faatoagaina mai, a mavae le fufui), precipitation limasene, auro mamafa, mavae le togafitiga (otaota fufuluina vai, Di fufuluina vai, faamagoina). Faatofuina mafiafia auro i le va o 0.025-0.1um.
Auro o loo faatatau i le laualuga togafitiga o lomia laupapa matagaluega ona o lona conductivity maualuga eletise, tetee lelei oxidation, ma lifespan umi. E masani faaaogaina o laupapa autu, auro tamatamai lima laupapa pcb, ma isi le eseesega faavae i le va o laupapa plated-auro ma laupapa faatofuina-auro e faapea plating auro faigata. Auro (abrasion tetee), auro o auro vaivai (e le ofuina tetee). 
1. The crystal structure formed by Immersion Gold and Gold Plating is different. Immersion Gold is much thicker than Gold Plating. Immersion Gold will be golden yellow and yellower than Gold Plating (this is the method of distinguishing between gold plating and heavy gold plating.) a) Gold plating will be slightly white (nickel color).
2. O le tioata fausaga faia i le faatofuina auro ma plating auro e ese. e faigofie auro faatofuina e weld nai lo plating auro ma o le a lē faasusulu maopoopo leaga. O le popole o le e faigofie laupapa auro immerison e pulea ai, ma e sili atu ona fesoasoani i le faagasologa fusia mo oloa fusia. I le taimi lava lea e tasi, ona e sili atu auro plated-auro nai lo le auro, e le wearable le tamatamailima auro fingered-auro (vaivaiga o le ipu auro).
3. E na o le limasene-auro i le pad i le faatofuina-auro laupapa pcb .The auina atu faailoga i e lē aafia ai le aafiaga paʻu le faailo i le vaega apamemea.
4. faatofuina auro e sili atu ona mafiafia nai lo le faatulagaga tioata plating auro, e le faigofie ona maua oxidation.
5. O le faatupulaia o manaoga mo laupapa matagaluega lomiasaʻo gaosia, laina lautele, faavavaina ua oo 0.1mm lalo. O plating Gold matele i le matagaluega puupuu auro. Le ipu auro na ei limasene ma le auro i luga o le pad, o lea e le faigofie ona maua ai se fesootaiga puupuu auro.
6. O le auro faatofuina le gata ei ai auro limasene i le pad, ina solder tetee i le ua mausali atili fusia le laina i le vaega apamemea. O le a le aafia ai galuega faatino o le faavavaina pe a faia ni taui.
7. Mo le manaoga maualuga o le laupapa pcb, e lelei manaoga flatness, o le faaaogaina lautele o le faatofuina auro , faatofuina auro masani e le foliga mai ina ua mavae le faʻapotopotoga o le aafiaga matautia fala uliuli. O le flatness ma le auauna ola o le ipu auro e sili atu nai lo lena o le ipu auro.
Lea I le taimi nei gaosi sili ona faaaoga le faagasologa auro faatofuina e maua laupapa pcb auro .However, o le e sili atu ona taugata faagasologa faatofuina-auro nai lo le faagasologa auro-plating (sili atu mataupu auro), lea o loo i se vaega tele lava o le maualalo priced oloa faaaogaina auro-plating taualumaga (e pei o panels maotua pulea, laupapa meataalo).