1. Monga cholumikizira zofunika pakompyuta, PCB ntchito mankhwala pafupifupi zonse zamagetsi, imatengedwa "mayi wa mankhwala a pakompyuta dongosolo," kusintha ake zamakono akavalidwe msika akhala aone zokhoma wa mabizinezi ambiri.
Panopa, pali awiri zoonekeratu zinthu za mankhwala a pakompyuta: wina ndi woonda ndi waufupi, winayo ali mkulu pafupipafupi, mkulu liwiro galimoto pambuyo pake PCB mogwirizana ndi osalimba mkulu, mkulu kusakanikirana, encapsulation, wochenjera, ndi malangizo a stratification angapo, Kowonjezereka kwa pamwamba wosanjikiza PCB ndi HDI .
Top pcb board wiring length is short, low impedance circuit, high-frequency high-speed work, stable performance, can take on more complex function, is to the high frequency electronic technology, multi-function large capacity development inevitable trend.In particular, the in-depth application of large-scale integrated circuits will further drive PCB to high precision and high level.
2. Pakali pano, PCB zimagwiritsa ntchito zoyendera magetsi banja, PC, kompyuta ndi mapulogalamu ena a pakompyuta, pamene ntchito yapamwamba-yotsiriza monga mkulu ntchito Mipikisano njira maseva ndi Azamlengalenga ayenera kukhala zigawo zoposa 10 PCB.Take polumikiza monga mwachitsanzo, PCB bolodi pa makina limodzi ndi ziwiri zambiri pakati 4-8 zigawo , pamene gulu lalikulu la seva mkulu-yotsiriza, monga 4 ndi 8 misewu, pamafunika zambiri zigawo 16 , ndi backplate lamulo loposa zigawo 20.
HDI Kulumikizana kachulukidwe wachibale wamba multilayer pcb gulu ubwino zoonekeratu, ndilo kusankha waukulu mainboard wa panopa smartphone.Smartphone ntchito kunadetsa zovuta ndi buku chitukuko opepuka, kuchepa malo bolodi chachikulu, zimafunika zochepa onyamula zambiri zigawo zikuluzikulu pa bolodi chachikulu, wamba Mipikisano wosanjikiza gulu n'kovuta kukumana atawalamula.
Mkulu kachulukidwe interconnection dera bolodi (HDI) utenga ndi laminated malamulo dongosolo bolodi, wamba multilayer bolodi ngati maziko gulu stacking, ntchito kuboola ndi dzenje ndondomeko metallization, kupanga zigawo zonse za mzere pakati pa mkati kugwirizana ntchito. Poyerekeza ndi ochiritsira yekha matabwa kudzera-dzenje multilayer pcb, HDI molondola amakhazikitsa chiwerengero cha vias akhungu ndi vias m'manda kuchepetsa chiwerengero cha vias, amapulumutsa PCB Kamangidwe dera, ndipo kwambiri kumawonjezera chigawo osalimba, motero mofulumira kumaliza multilayer ntchito mu mafoni Laminating njira zina. 
The technical difference of HDI is reflected in the increment stacked number, the more layer quantity, the more difficult the technology.HDI can be divided into single stacked HDI, doule stacked HDI, triple stacked HDI,or high stacked HDI, etc., the number of layers is expressed as C+N+ C, where N is the number of normal core laminar, and C is the number of added layers, namely the stacked number of HDI..High stacked HDI cabling has higher density, but at the same time, it has more pressure, such as position, punch hole and copper plating, etc., which has higher requirements on the technical process and process capability of the manufacturer.
Popular zisakuyenda mkulu-mapeto yamakono umasinthasintha wosanjikiza HDI ndi apamwamba zakhala zikuzunza m'miyoyo ya HDI, amafuna aliyense obowoka akhungu kugwirizana pakati pa zigawo pafupi, pa maziko a HDI wamba adzamupulumutsa pafupifupi theka la voliyumu, kotero kuti malo chifukwa batire ndi zina.
Wosanjikiza aliyense wa HDI amafuna kugwiritsa ntchito njira zamakono zapamwamba monga laser pobowola ndi electroplated dzenje mapulagi, ndilo kupanga kovuta kwambiri ndi apamwamba phindu anawonjezera HDI mtundu, amene sakhoza bwino kusonyeza mlingo luso HDI. 
Two important trends of the automobile industry are intelligent and electric.ADAS (Advanced Driver Assistance System) as the transition of complete intelligent driving before, has become a major automakers and crossover of Internet giant rushed to the layout of the new strategic highland, it involves the electronic device cover nearly all of the whole vehicle driving and safety related System, with the rapid penetration of ADAS, comprehensive automobile electronic level will be raised.
3. Ndipo magalimoto watsopano mphamvu woimira malangizo a galimoto za magetsi, poyerekezera ndi galimoto ya makolo, pempho apamwamba mlingo pakompyuta, zamakono ndalama miyambo limousine nkhani pafupifupi 25%, 45% kufika pa 45% mu galimoto latsopano mphamvu , wapadera dongosolo mphamvu ulamuliro (BMS, VCU ndi MCU), zimapangitsa ntchito galimoto PCB ndi lalikulu kuposa galimoto ya makolo atatu mphamvu kulamulira dongosolo PCB ntchito pafupifupi pafupifupi 3-5 mamita lalikulu, kuchuluka kwa PCB galimoto Pakati 5-8 mamita lalikulu.
4. The kukula kwa ADAS ndi magalimoto mphamvu zatsopano, lotengeka ndi matayala, nayenso anali ndi magalimoto zamagetsi msika kukula pa mlingo wa pachaka wa maperesenti oposa 15 posachedwapa years.Accordingly, msika wa PCB adzapitiriza m'mwamba, ndipo analosera kuti ulimi wa PCB adzakhala upambana $ 4 billion mu 2018, ndipo kachitidwe kukula bwino kwambiri, m'majakisoni patsogolo latsopano mu makampani PCB.
5. Mafoni Amakono akhala dalaivala akuluakulu a makampani PCB m'nyengo past.Mobile Internet Intaneti koposa kwa PC kuti mafoni osachiritsika zida, udindo wa PC kompyuta nsanja msanga m'malo mwa osachiritsika a m'manja, kuyambira 2008, ogula lonse pakompyuta zigawo zikuluzikulu ogwira ntchito mwamphamvu chitukuko, makamaka 2012 ~ 2014, foni mu infiltration.Therefore mofulumira, kukula mofulumira PCB ali lotengeka ndi pambuyo pake za malo mafoni umaimiridwa ndi anzeru phones.Between 2010 ndi 2014, foni msika mu pambuyo pake wa PCB anafika pachaka mlingo pafupifupi kukula pawiri la 24%, kutali choposa cha mafakitale ena pambuyo pake, kupereka kukula madalaivala chachikulu makampani PCB.
Mu mkulu-mapeto PCB, HDI Mwachitsanzo, foni ndi miyambo HDI msika, mu 2015, mwachitsanzo, mafoni nkhani oposa theka chiwerengero, ndi kaonedwe ka mafoni anzeru, mphatso ntchito yatsopano pafupifupi zokolola ntchito HDI monga mavabodi.
Onse pa kaonedwe ka PCB ndi mkulu-mapeto HDI, ndi mkulu wa liwiro kukula foni yopita ku kufunika kulemera pambuyo pake, motero kuchirikiza kukula kwa padziko lonse mabizinezi PCB mwayi.
Koma palibe kumakana kuti msika foni ali mochedwa kuyambira 2014, patatha mofulumira kusalola ndi kulowa mwapang'onopang'ono mafoni mu era.On katundu msika lonse, Mapa atsopano ku IDC2016 anamasulidwa mu November 2016, padziko lonse otumiza yamakono mu 2016 ayenera kukhala biliyoni 1,45, ndi kulumpha kwambiri kukula kwa 0,6 monga mawu percent.In deta kukula, ngakhale hafu ya ofunsira PCB a pambuyo pake akadali imayendetsedwa ndi mafoni, magulu ambiri PCB, kuphatikizapo HDI, ndi mochedwa mu mafoni osachiritsika m'deralo.
Ngakhale nkhani ya zachuma, yamakono makampani mu theka lachiwiri ndi zosachita Pomaliza, koma pamaziko a mbadwa lalikulu, chifukwa kuwonetsera zotsatira mavenda ena londola, ogula kufunika an'dzacosa ndi replacement.The chachikulu katundu msika wa mafoni anzeru komabe mungathe yaikulu, ndi mavenda ya malo adzachita amayesetsa kusintha ululu mfundo ogula 'n'cholinga yotithandiza kufunika ndi msika katengedwe share.As chifukwa, foni anzeru, monga waukulu pambuyo pake ntchito PCB m'mbuyomu, mungathe zazikulu kukula kwa PCB mu yaikulu malire katundu.
Pazaka zaka ziwiri kapena zitatu za anzeru azimuth chitukuko foni, kutchuka zala, 3D Kukhudza, chophimba chachikulu, kamera wapawiri ndi zina mosalekeza luso wakhala akutulukira, komanso kupitiriza yotithandiza m'malo Mokweza.
Mu nkhani ya mafoni kulowa zaka katundu, ndi lalikulu buku maziko alinga kuti kukula wachibale chifukwa cha luso kugulitsa mfundo akadali zidzapangitsa kuti kuwonjezereka kwakukulu kuchuluka mtheradi wa demand.Stock za luso komanso mmoyo PCB lonse, ngati tsogolo yamakono luso Mokweza mu PCB, kuganizira alipo foni wopanga kutumiza mwamsanga kukula ndi ena malangizo apo, luso Mokweza adzakhala imathandizira malowedwe, motero anju ofanana ndi kuwala, lamayimbidwe, etc.
6. Kuganizira pa PCB mafakitale inayamba FPC ndi wosanjikiza aliyense wa interconnection HDI amakopeka opanga ena londola, ndipo mfundo chimachokera pamwamba kupanga chitsanzo cha malowedwe mofulumira:
FPC imatchedwanso "pcb kusintha" ndi kusintha polyimide kapena poliyesitala filimu m'munsi chuma cha kusintha dera bolodi tinkawasindikiza ndi osalimba mkulu wa Kulumikizana, kulemera kuwala, makulidwe woonda, kusintha, mkulu kusinthasintha, Catering kuti makhalidwe a mankhwala pakompyuta opepuka, kusintha azimuth.
Ntchito iPhone kwake zidutswa 16 FPC, zogula ndi dziko lonse FPC, dziko pamwamba asanu FPC Mlengi wa makasitomala chachikulu ndi opanga monga apulo, Samsung, huawei, OPPO pansi apulo chionetsero komanso patsogolo FPC ntchito yake ya mafoni.
Mafoni monga mphamvu yaikulu galimoto, kukula kwa FPC ndi kupindula apulo ndi zotsatira zake chionetsero, FPC mofulumira kusinthitsa, 09 tingakhalebe kukula mkulu, chaka chilichonse kuyambira zaka 15 pamene yekha yowala malo mu makampani PCB, anakhala yekha zabwino kukula gulu .
7. gawo lapansi Ngati PCB (amatchedwa SLP) mu luso HDI, zochokera ndondomeko M-kuyamwa, akhoza zina yeretsani mzere, ndi mbadwo watsopano wa mzere chabwino kusindikizidwa dera bolodi.
The kalasi bolodi (SLP) ndi m'badwo wotsatira PCB hardboard, sipangakhalenso adzafupikitsidwa ku 40/40 microns wa HDI kuti 30/30 microns.From ndondomeko lingaliro, kalasi potsegula gulu kuyandikira ntchito mu michenga yopangira zida zamagetsi ma CD IC bolodi, koma ali koma kuwafika IC wa specifications wa gulu la katundu, ndi cholinga chake akuchitabe onse a zigawo chabe, chifukwa chachikulu akadali limabweretsa gulu la PCB.For latsopanoli mzere chabwino yosindikiza mbale gulu, tidzatero kutanthauzira miyeso itatu ya inatha maziko ake, kupanga ndondomeko ndi suppliers.Why angathe kuchita mukufuna kuitanitsa kalasi katundu bolodi: woyengeka kwambiri ma CD amafuna mzere superposition SIP, mkulu osalimba kudakali mzere waukulu, mafoni anzeru, mapiritsi, ndi zipangizo wearable ndi mapulogalamu ena a pakompyuta kukhala ku mbali ya kusintha muti_function miniaturization ndi kuti tipitirize chiwerengero cha zigawo zikuluzikulu ali kwambiri wadera gulu danga Koma koposa zochepa.
M'nkhaniyi, PCB waya m'lifupi, cm, m'mimba mwake wa gulu yaying'ono ndi mtunda pakati dzenje, ndi wochititsa wosanjikiza ndi makulidwe a zokutira zitsulo wosanjikiza akugwa, amene kupanga PCB kuchepetsa kukula, kulemera ndi buku la milandu, izo akhoza kumakhalamo components.As kwambiri malamulo Moore ndi kuti semiconductors, mkulu osalimba ndi kutsatira mukusowa matabwa kusindikizidwa dera:
Kwambiri zofunika zambiri dera ndi apamwamba kuposa kachulukidwe HDI.High akutulutsira PCB kuti sule mzere, ndi mamvekedwe a mpira (BGA) ali adzafupikitsidwa.
Mu zaka zingapo zapitazo, 0,6 mamilimita kuti 0,8 mamilimita phula luso lakhala likugwiritsidwa ntchito zipangizo m'manja, m'badwo uno wa mafoni anzeru, chifukwa kuchuluka kwa ine / O chigawo ndi mankhwala miniaturization, PCB ambiri amagwiritsa ntchito luso 0.4 mamilimita phula. Zotsatira kusiyana kwa 0.3mm. Ndipotu chitukuko cha 0.3mm luso kusiyana kwa malo mafoni kale begun.At nthawi yomweyo, kukula kwa micropore ndi m'mimba mwake wa chimbale polumikiza akhala kusanduka 75 mamilimita ndi 200 mm motero.
cholinga makampani ndi kusiya micropores ndi zimbale kuti 50mm ndi 150mm ankalemekeza yotsatira ochepa years.The 0.3mm cm kapangidwe mfundo amafuna kuti mzere m'lifupi mzere ndi 30 / 30μm.
iye kalasi gulu zimagwirizana SIP ma CD mfundo more.SIP dongosolo mlingo ma CD luso, zochokera tanthauzo la mayiko michenga yopangira zida zamagetsi mzere bungwe (ITRS): ndimweko kwa zigawo angapo yogwira pakompyuta zimagwira ntchito zosiyanasiyana ndiponso optional zigawo chabe, ndi zipangizo zina monga MEMS kapena kuwala chipangizo patsogolo pamodzi, kukwaniritsa ntchito zina umodzi muyezo ma CD, ma CD luso kupanga dongosolo kapena subsystem.
Pali zambiri njira ziwiri kuzindikira ntchito ya dongosolo pakompyuta, limodzi ndi SOC, ndi dongosolo pakompyuta kuzindikira pa Chip ndi limodzi integration.Another yapamwamba SIP, amene integrates CMOS ndi madera ena Integrated ndi mbali amagetsi mu phukusi ntchito okhwima osakaniza kapena interconnection luso, amene akhoza kukwaniritsa lonse makina ntchito mwa anakuta yomweyi tchipisi zosiyanasiyana zinchito.
Bolodi kalasi limabweretsa PCB hardboard, ndi ndondomeko yake ndi pakati mwapamwamba HDI ndi IC mbale, ndi mkulu-mapeto HDI opanga ndi IC opanga bolodi ndi mwayi wofalitsa.
opanga HDI ndi zambiri zazikulu, zokolola adzakhala key.Compared ndi IC mbale, HDI ochuluka mpikisano ndipo wakhala wofiira nyanja msika, ndi masamba phindu declining.Face kalasi potsegula bolodi, mwayi HDI opanga mungathe kupeza latsopano malamulo, pa dzanja limodzi, pa dzanja zina mutha kuzindikira mankhwala Mokweza, optimizing mankhwala Kusakaniza ndi mlingo wa zasungidwa Choncho mukufuna wamphamvu, amphamvu kwambiri kamangidwe choyamba.
Chifukwa ndondomeko apamwamba kalasi potsegula bolodi, HDI opanga kuti aganyali kapena latsopano kupanga zida kusinthidwa, ndi MSAP ndondomeko zatsopano opanga HDI komanso zimafuna kuphunzira nthawi, kuchokera njira wochotsera mu MSAP, mankhwala zokolola adzakhala ofunika.
8. LED chitukuko mofulumira mkulu matenthedwe madutsidwe CCL kukhala otentha spot.The yaing'ono cm anatsogolera Ubwino wa unspelt, zabwino anasonyeza tingati ndi moyo wautali utumiki. Mu zaka zapitazo, wayamba kusinthitsa, ndipo wakhala kukula mofulumira. Choncho, chofunika mkulu matenthedwe madutsidwe CCL wakhala otentha banga.
Galimoto PCB pa zofunika mankhwala khalidwe ndi kudalilika ndi okhwima kwambiri, ndipo zambiri ntchito yapadera zamagetsi zipangizo ntchito CCL.Automotive ndi yofunika PCB pambuyo pake ofunsira. Automotive mankhwala pakompyuta choyamba afunika kukwaniritsa magalimoto monga njira zoyendera ayenera kukhala ndi mikhalidwe kutentha, nyengo, kusinthasintha voteji, mu atomu kuwasokoneza, kugwedera ndi zina luso dziphunzitsiranso amafuna kuposa magalimoto PCB zipangizo kuika zofunika patsogolo apamwamba, ntchito zambiri Special zipangizo ntchito (monga zipangizo mkulu Tg, zipangizo odana CAF (wothinikizidwa asibesitosi CHIKWANGWANI), zipangizo wandiweyani mkuwa ndi zipangizo ceramic, etc.) CCL.