1. Ka rite ki te tūhono hiko nui, PCB te whakamahia mō te hua tata hiko katoa, whakaaro te "te whaea o ngā hua pūnaha hiko," Kua riro ona huringa hangarau, me ngā mākete i te arotahi o te aro o pakihi maha.
I tēnei wā, i reira e rua ngā kitea i roto i ngā hua hiko: kotahi he kikokore, me te poto, te tahi atu he auau tiketike, tere nui puku PCB awa runga i ki kiato tiketike, tuitui tiketike, encapsulation, mohio, me te aronga o te raupapatanga maha, tipu te hiahia hoki te runga PCB kahu me te HDI .
Top pcb board wiring length is short, low impedance circuit, high-frequency high-speed work, stable performance, can take on more complex function, is to the high frequency electronic technology, multi-function large capacity development inevitable trend.In particular, the in-depth application of large-scale integrated circuits will further drive PCB to high precision and high level.
2. I reira, PCB te nuinga whakamahia hoki taputapu whare, PC, papamahi me ētahi atu hua hiko, i tono tiketike-mutunga pērā i te mahi nui maha-ara tūmau me te Aerospace e hiahiatia ki te whai atu i te 10 ngā papa o PCB.Take te tūmau hei tauira, te poari PCB i runga i te tūmau kotahi me rua-ara ko te tikanga i waenganui i 4-8 ngā papa , i titau te poari matua o te tūmau nui-mutunga, pērā i 4 me 8 ara, neke atu i te 16 ngā papa , me te backplate ko runga ake titauraa 20 papa.
HDI waea kiato whanaunga ki mau poari multilayer PCB he painga kitea, i te mea te whiriwhiri matua o mainboard o te mahi smartphone.Smartphone nāianei piki matatini me te rōrahi ki te whanaketanga Kōmāmā, iti iho me te iti wāhi mo te poari matua, hiahia iti noaiho e mau ana ake o nga wae i runga i te poari matua, kua noa poari maha-apa kua uaua ki te whakatau i te tono.
High-kiato poari ngatahi iahiko (HDI) Tiwihana te poari pūnaha ture Whakakirihōu, te mau poari multilayer rite te poari tāpae matua, te whakamahi o te kōhao, me te tukanga metallization poka, hanga papa katoa o te raina i waenganui i te mahi hononga ā-. Ina whakaritea ki tikanga i roto i-poka anake papa PCB multilayer, HDI tika whakatakoto ana te maha o vias matapo me vias tanumia ki te whakaiti i te maha o vias, whakaora rohe tahora PCB, a tino whakanuia ana wae kiato, ko te kupu tere te whakaoti i te mahi multilayer i roto i smartphones whirinoa laminating. 
The technical difference of HDI is reflected in the increment stacked number, the more layer quantity, the more difficult the technology.HDI can be divided into single stacked HDI, doule stacked HDI, triple stacked HDI,or high stacked HDI, etc., the number of layers is expressed as C+N+ C, where N is the number of normal core laminar, and C is the number of added layers, namely the stacked number of HDI..High stacked HDI cabling has higher density, but at the same time, it has more pressure, such as position, punch hole and copper plating, etc., which has higher requirements on the technical process and process capability of the manufacturer.
Popular i roto i nga tau tata nei i roto i te HDI nui-mutunga atamai paparanga noho ko te tāpae rawa o HDI, rapua e whai tetahi rua matapo hononga i waenganui i ngā papa pātata, i runga i te pūtake o te HDI noa e whakaora tata hawhe o te rōrahi, kia rite ki te hanga atu ruma hoki pūhiko me ētahi atu wāhanga.
Tetahi paparanga o HDI titau te whakamahi o hangarau matatau pērā i taiaho kōhao me ngā kōhao poka electroplated, i te mea te hanga uaua tino me te momo teitei uara-tapiritia HDI, e taea pai whakaata i te taumata hangarau o HDI. 
Two important trends of the automobile industry are intelligent and electric.ADAS (Advanced Driver Assistance System) as the transition of complete intelligent driving before, has become a major automakers and crossover of Internet giant rushed to the layout of the new strategic highland, it involves the electronic device cover nearly all of the whole vehicle driving and safety related System, with the rapid penetration of ADAS, comprehensive automobile electronic level will be raised.
3. A waka pūngao hou te māngai te aronga o te motokā hiko, whakaritea ki te motokā tuku iho, te tono teitei o te taumata hiko, kiia pūrere hiko i roto i ngā utu limousine tuku iho hoki e pā ana ki te 25%, 45% ki te 45% i roto i te waka pūngao hou , pūnaha mana te mana ahurei (BMS, VCU ko MCU), hanga he nui atu i te motokā tuku iho te whakamahi i waka PCB, te toru mana te mana pūnaha PCB whakamahinga toharite o e pā ana ki 3-5 mita pūrua, te nui o te PCB waka waenganui i 5-8 mita pūrua.
4. , Kua puritia te tupu o ADAS me waka pūngao hou, peia e rua wira hoki te mākete te hikohiko automotive tipu i te tere ā-tau o neke atu i te 15 ōrau i roto i te tata years.Accordingly, ka haere tonu i te mākete o te PCB maha, a ko reira tohu e ka nui te hanga o PCB $ 4 piriona i roto i te 2018, ka ko te tino mārama te au tupu, injecting whakauka hou ki te ahumahi PCB.
5. Kua kua he taraiwa nui o te ahumahi PCB i roto i te wā past.Mobile Ipurangi Smartphones, ake me te atu kaiwhakamahi i PC ki te taputapu pūkoro kāpeka, te mana o te turanga rorohiko PC hohoro whakakapi e te kāpeka pūkoro, mai 2008, kiritaki ao wāhanga hiko hinonga whanaketanga nohopuku, rawa i roto i 2012 ~ 2014, atamai ki infiltration.Therefore tere, peia te tupu tere o te PCB e te awa o terminals pūkoro kanohi e phones.Between atamai 2010 me 2014, te mākete atamai i roto i te awa o te PCB tae te tere toharite tipu pūhui ā-tau o te 24%, tawhiti rawa e o te tahi atu ahumahi te awa, whakarato i te taraiwa tupu matua mo te ahumahi PCB.
I roto i te tiketike-mutunga PCB, HDI, hei tauira, te waea pūkoro ko te mākete HDI tuku iho, i roto i 2015, mo te tauira, kiia smartphones hoki neke atu i te hawhe te rahi, me i te tirohanga o waea atamai, nga mahi hou reira tata hua katoa te whakamahi i HDI rite kaupapa.
Rua i te tirohanga o te PCB me tiketike-mutunga HDI, ko reira te tere tiketike o te tupu atamai e arata'i ki te tono te pai te awa, ko te kupu tautoko i te tupu o ao hinonga painga PCB.
Otiia kahore he whakakahore e kua pakanga te mākete atamai iho mai 2014, i muri i te wā kookuhutanga tere, me te tomokanga āta o smartphones ki te era.On kararehe te mākete ao, te matapae hou i IDC2016 tukua i roto i te Noema 2016, i te Tuhinga atamai ao i roto i te 2016 e tūmanakohia ana ki te kia 1.45 piriona, me te peke nui i roto i te tupu o te tika 0.6 percent.In ngā o ngā raraunga tupu, ahakoa kei te tautoko tonu te hawhe o tono te awa o PCB i waea pūkoro, te nuinga o ngā kāwai PCB, tae atu HDI, kua tömuri te i roto i te wāhi kāpeka pūkoro.
Ahakoa i roto i te horopaki o te hekenga taha ohaoha, ahumahi atamai ki te hawhe tuarua ko te mutunga mua, te engari i runga i te pūtake o te rakau nui, e tika ana ki te pānga whakaatu atu kaihoko ki te whai ake, ka peia kiritaki tono te rakau nui replacement.The mākete o waea atamai kua tonu pea nui, a ka mahi i nga kaihoko o te terminals ratou pai ki te whakapai ake i kiritaki 'ngā mamae kia rite ki te whakaongaonga tono me te mākete kōrapurapu share.As he hua, te waea atamai, rite te tono awa matua o te PCB i roto i te mua, he pūmanawa nui mo te tupu o PCB i roto i te rohe kararehe nui.
kua Neke te mua e rua ranei e toru nga tau o au atamai whanaketanga waea, āhukahuka tapumati, 3D Touch, nui mata, kāmera rua, me te tahi atu auaha tonu kua puta, engari ano hoki tonu ki te whakaongaonga whakakapinga whakamohoa.
I roto i te horopaki o waea pūkoro tomo te tau o te kararehe, e whakatau i te pūtake rōrahi nui e te tupu whanaunga meinga e te auaha o te hoko ngā ka arahi tonu ki te hua nui i roto i te rahinga tino o demand.Stock o auaha hoki pā PCB ao, ki te heke mai whakamohoa atamai auaha i roto i te PCB, whakaaro te rahi tukuna akiaki kaihanga waea pūkoro ngā me ētahi atu whai-ake ka, ka whakatere te auahatanga whakamohoa kătahi, te kupu puta rite ki te whatu, acoustic, me ētahi atu
6. Te arotahi ki runga i te PCB ahumahi, te pakarutanga o FPC me tetahi apa o ngatahi HDI tohoakii atu kaihanga ki te whai ake, a ka faaite mai te wāhi ki te mata, ki te hanga i te tauira o te penetration tere:
FPC Kei te mohiotia ano rite "PCB ngāwari", ko te rauemi polyimide pareaku kiriata ranei turanga ngāwari hanga o te poari taiawhio tāngia ngāwari, ki te kiato nui o waea, taimaha marama, matotoru kikokore, ngāwari, ngāwari tiketike, whāngai ki te ia o te hua hiko Kōmāmā, au hangore.
Whakamahia i roto i ona iPhone ki runga ki te 16 nga wahi o FPC, ähua ko nui rawa FPC, runga e ono o te ao o te ao FPC kaihanga o kiritaki matua he kamupene pērā i aporo, Samsung, huawei, Huihia raro aporo whakaaturanga whakarei hoki tona whakamahinga FPC o smartphones.
Smartphones rite te kaha peia tuatahi, te tupu o FPC he painga i aporo me tona pānga whakaaturanga, FPC tere tomo, 09 e taea te pupuri tipu nui, nga tau, mai i te 15 tau pera me te wahi tu a kanapa anake i roto i te ahumahi PCB, ka te kāwai tupu pai anake .
7. Tïpako-rite PCB (kīia ki rite SLP) i roto i te hangarau HDI, e hāngai ana i runga i te tukanga M-te SAP, ka taea e te whakamahine atu i te aho, ko he whakatupuranga hou o te raina pai tāngia poari ara iahiko.
Ko te poari o te piha haapiiraa (SLP) ko te PCB Self whakatupuranga i muri, e taea te poroa i 40/40 microns o HDI ki 30/30 microns.From wāhi tukanga o te tirohanga, te utanga o te piha haapiiraa poari ofi ki whakamahia i roto i te Semiconductor tākai poari IC, engari he ano ki tae te IC o nga ngā o te poari kawenga, me tona whakaaro kei te mau ana ano katoa o ngā wāhanga hāngū, ko te hua matua no tonu ki te kāwai o te PCB.For tenei raina pai kāwai pereti tā hou, e matou whakamāori i te taha e toru o tona kawemai papamuri, tukanga ahumahi me te suppliers.Why pea te mahi e hiahia ana koe ki te kawemai poari kawenga piha: aho superposition SIP tino parakore whakaritenga tākai, kiato tiketike ko tonu te raina matua, waea atamai, papa, me ngā pūrere kākahu, me ētahi atu hua hiko ki te whakawhanake i roto i te ahunga o te wāhinga me huringa muti_function, ki te kawe i runga i te maha o ngā wāhanga kei te tino nui haere hoki wāhi te poari ara iahiko, Heoi, atu me te ake iti.
I roto i tenei horopaki, whanui waea PCB, mokowā, te diameter o te rōpū moroiti me te tawhiti pokapū poka, me te apa kaiwhakahaere me te matotoru o te apa tuuraa e hinga, te PCB e hanga ki te whakaiti i te rahi, te taimaha me te rōrahi o te wā, i te reira Ka taea e te whakanoho atu components.As he ki Semiconductors ture a Moore, kiato tiketike ko te whai tamau o te papa iahiko tā:
Tino e teitei whakaritenga iahiko taipitopito atu pei HDI.High kiato te PCB ki whakamahine te aho, ka poroa te ware o te pōro (BGA) te.
I roto i te tau i ma'iri a'e nei, te 0.6 mm ki 0.8 mm hangarau te ware i whakamahia i roto i te whakaaro puriringa, tenei whakatupuranga o waea atamai, no te mea te nui o ahau e wāhanga me ngā wāhinga hua /, PCB whānui whakamahi te hangarau o 0.4 mm te ware. kei te whakawhanake i tēnei au ki 0.3mm. I roto i te meka, kua begun.At kua te whanaketanga o 0.3mm hangarau āputa mō terminals pūkoro te wa taua, te rahi o te micropore me te diameter o te kōpae honotanga kua heke ki te 75 mm, me 200 mm te whakaatu i.
whāinga o te ahumahi, ko te ki te maturuturu micropores me kōpae ki 50mm me 150mm aua i roto i te torutoru years.The 0.3mm hoahoa mokowā whakatakotoranga muri titau e te raina whānui raina ko 30 / 30μm.
ia hāngai poari piha te SIP tākai whakatakotoranga more.SIP taumata pūnaha tākai hangarau, e hāngai ana i runga i te whakamāramatanga o te whakahaere raina Semiconductor ao (ITRS): SIP hoki maha wāhanga hiko kaha ki ngā mahi rerekē, me te kōwhiringa wāhanga hāngū, me ētahi atu pūrere pērā i MEMS ranei matua pūrere whatu tahi, ki te whakatutuki i te tetahi mahi o te tākai paerewa kotahi, hangarau tākai ki te hanga i te pūnaha pūnaha ranei.
E te tikanga e rua ara ki ite i te mahi o te pūnaha hiko, he SoC kotahi, a ka mohio te pūnaha hiko kei runga i te maramara kotahi ki integration.Another tiketike he SIP, e whakauru ana CMOS me ētahi atu iahiko integrated me ngā wāhanga hiko ki te mōkihi te whakamahi i pakeke huinga ngatahi ranei hangarau, e taea te whakatutuki i te mahi katoa mīhini i roto i te whakakikorua whakarara o ngā maramara mahi.
No te poari piha ki PCB Self, a ko tona tukanga i waenganui i te tikanga nui HDI me pereti IC, me te tiketike-mutunga HDI kaihanga me ngā kaiwhakanao poari IC i te whai wāhi ki te whai wāhi.
e atu hihiri, ka tukua kia key.Compared kaiwhakanao HDI ki pereti IC, hei HDI kua piki whakataetae, me te kua riro te mākete moana whero, ki te tawhē te pai declining.Face te utanga o te piha haapiiraa poari, te rave'a o kaiwhakanao HDI taea ki te tiki i te hou whakahau, i runga i tetahi ringa, i te tahi atu i te ringa e taea ite whakamohoa hua, mä te ranunga hua me te taumata o moni, na reira e hiahia ana ki kaha, ake kaha te tahora tuatahi.
Nā ki te tukanga teitei utanga piha poari, HDI kaiwhakanao ki te haumi ranei taputapu ahumahi hou whakarerekē, a MSAP hangarau tukanga mō kaiwhakanao HDI titau hoki wa ako, i te tikanga tangohanga ki MSAP, ka kia matua tukua hua.
8. arahina whanaketanga tere o tiketike CCL kawe ia ngāwhā hei te spot.The wera mokowā iti LED kua nga painga o unspelt, pānga whakaatu pai, me te ora ratonga roa. I roto i nga tau tata nei, kua timata te reira ki te ô, a kua tipu i te reira tere. Fakatatau ki ai, kua riro te tiketike CCL kawe ia ngāwhā hiahiatia te wahi wera.
Waka PCB i runga i nga whakaritenga te kounga hua me te tika e tino tino, me te ake te whakamahi o te hikohiko rauemi mahi CCL.Automotive motuhake ko te PCB nui tono te awa. Me tuatahi whakatau hua hiko Automotive te automotive rite me whai he tikanga o waka nga āhuatanga o te pāmahana, āhuarangi, rerekē ngaohiko, pokanoa hiko, wiri me tahi atu kaha urutau ki ngā whakaritenga teitei hoki hoatu rauemi PCB automotive whakaritenga mua teitei, te whakamahi o atu Motuhake rauemi mahi (pēnei i ngā rauemi tiketike TG, (te muka papa kiripaka kōpeke) rauemi-CAF anti, rauemi parahi matotoru me ngā rauemi uku, me ētahi atu) CCL.