Tongasoa eto amin'ny KingSong PCB Teknolojia.
Top Bluetooth Module Board PCB Manufacturers
Zavatra Services, toy ny hoe: Bluetooth Module Board, PCB Manufacturers, Bluetooth Module Board (4-Pin) sns
1.Detail mihetsika PCB Manufacturing Capabilities:
| No. |
Item |
Mass Production |
nitranga fahiny |
| 1 |
sosona |
1-8 sosona |
1-20 sosona |
| 2 |
Max. Panel Size |
600 * 770mm (23.62 "* 30,31") |
600 * 770mm (23.62 "* 30,31") 500 * 1200mm (19.69 "* 47,24") |
| 3 |
Max.Board hateviny |
8.5mm |
8.5mm |
| 4 |
Min. Board hateviny |
2L: 0.3mm,
4L: 0.4mm,
6L: 0.8mm |
2L: 0.2mm,
4L: 0.4mm.
6L: 0.6mm |
| 5 |
Min Inner Layer Clearance |
0.1mm (4mil) |
0.1mm (4mil) |
| 6 |
Min-dalana, sakany |
0.1mm (4/4 Mil) |
0.075mm (3/3 Mil) |
| 7 |
Min-dalana, toerana |
0.1mm (4/4 Mil) |
0.075mm (3/3 Mil) |
| 8 |
Min.Hole Size |
0.15mm (8mil) |
0.1mm (6mil) |
| 9 |
Min nopetahany takela lavaka hatevin'ny |
20um (0.8mil) |
20um (0.8mil) |
| 10 |
Min Blind / Nalevina haben'ny lavaka |
0.2mm (8mil) |
0.2mm (1-8layers) (8mil) |
| 11 |
Dia PTH. fandeferana |
± 0.076mm (± 3mil) |
± 0.076mm (± 3mil) |
| 12 |
Non PTH Dia. fandeferana |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 13 |
Hole Position fahadisoan-dàlana |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 14 |
Heavy Coppe |
4oz / 140μm |
6oz / 175μm |
| 15 |
Min S / M dity |
0.1mm (4mil) |
0.1mm (4mil) |
| 16 |
Soldermask loko |
Green, mainty, Blue, White, Yellow, Red |
Green, mainty, Blue, White, Yellow, Red |
| 17 |
Silkscreen loko |
White, Mavo, Mena, Black |
White, Mavo, Mena, Black |
| 18 |
drafitra |
Tambazotra, V-Groove, Beveling totohondriny |
Tambazotra, V-Groove, Beveling totohondriny |
| 19 |
Outline Tolerance |
± 0.15mm ± 6mil |
± 0.15mm (± 6mil) |
| 20 |
Peelable saron-tava |
Top, ambany, misy rindrina avo roa heny |
Top, ambany, misy rindrina avo roa heny |
| 21 |
voafehy Impedance |
+/- 10% |
+/- 7% |
| 22 |
Insulation Fanoherana |
1 × 1012Ω (Normal) |
1 × 1012Ω (Normal) |
| 23 |
Amin'ny alalan'ny Hole Resistance |
<300Ω (Normal) |
<300Ω (Normal) |
| 24 |
mafana dona |
3 × 10sec @ 288 ℃ |
3 × 10sec @ 288 ℃ |
| 25 |
Tenany sy ny heviny |
≤0.7% |
≤0.7% |
| 26 |
Electric Strength |
> 1.3KV / MG |
> 1.4KV / MG |
| 27 |
Peel Strength |
1.4N / MG |
1.4N / MG |
| 28 |
Solder Mask Abrasion |
> 6H |
> 6H |
| 29 |
Flammability |
94V-0 |
94V-0 |
| 30 |
Test TOSIKARATRA |
50-330V |
50-330V |
2.PCB nitarika ny fotoana: (raha toa ka mila maika fanompoana, isika ihany koa dia afaka hihaona)
| Description |
Double Layer |
4 Layer |
6 Layer |
8 Layer |
10 Layer na ambony |
| Sample (WD) |
4 |
7 |
8 |
10 |
12 |
| Lamesa famokarana (WD) |
7-9 |
10-12 |
13-15 |
16 |
20 |
3.Package: Inner banga fonosana, fitsipika ivelany boaty baoritra fonosana.
4.Shipping:
A: By DHL, UPS, Fedex, TNT sns
B: Ny ranomasina ho an'ny faobe be araka ny mpanjifa ny fepetra.
5.If mila PCB teny nindramina ho an'ny tetikasa, pls manome manaraka Info:
A: Quote dia be,
B: Gerber ampy amin'ny 274-X endrika,
C: fepetra ara-teknika na ny masontsivana (ara-nofo, sosona, varahina hatevin'ny,
birao hatevin'ny, ambonin'ny famaranana, solder saron-tava / silkscreen loko ...)
Pls andefaso olona antsika maimaim-poana ny handefa nanontany, Misaotra noho ny fanohanana mialoha!
