Tongasoa eto amin'ny KingSong PCB Teknolojia
Image: Single misy rindrina Alumina Ceramic PCB Suppliers
1.Ceramic PCB Board Capabilities:
Layer：1，2
Material：96% Alumina，99% Aluminium nitride(AIN),Sapphire,High Borosilicate Glass
Material Thickness(mm)：0.38，0.635，0.5，1.0，1.2，1.5
Material Size(mm)：120*120，127*127，132*132，140*130，190*140
Min Hole：0.075mm
Min Line width/space：0.1/0.1mm
Laser Outline: line width:0.1mm，tolerance：+/-0.1mm
Surface Finish:Immersion Silver,Immersion Gold,Immersion Tin,OSP
Copper Thickness(oz):H/H 1/1 2/2 3/3 4/4 5/5 6/6 7/7 8/8 9/9 10/10
Thermal conductivity value: 20~27W/m.K for Alumina; 180W~220W/m.K for Aluminium nitride , 27~30W/m.K for Sapphire,2 ~ 5 W/m.K for High Borosilicate Glass
Product Description:
Alumina Ceramic PCB dia avo conductivity mafana substrate ahitana avo-conductivity dielectric Ceramic PCB biraom ahitana vy sy mendri-kaja ambony conductivity miaro mafana ara-nofo, afaka hamaha ny olana amim-pahombiazana ny ambany sy ny mafana conductivity PCB substrate aluminium. Mba tsara nafanaina ny hafanana niteraka ny hafanana avo-Electronic Components, hampitombo singa fahamarinan-toerana sy hanitatra ny fanompoana ny fiainana.
Ceramic PCB Features:
Do not need to change the original processing procedures
Excellent mechanical strength
With good thermal conductivity
With resistance to erosion
Good surface characteristics, excellent flatness and flatness
Good thermal shock resistance
Low curl degree
Good stability under high temperature can be processed into a variety of complex shapes
Ceramic PCB Fampiharana:
high-accuracy clock oscillator,
voltage controlled oscillator (VCXO),
temperature compensated crystal oscillators (TCXOs),
oven controlled crystal oscillators (OCXOs);
emiconductor cooler;
electric power electronic control module;
high insulation & high pressure device;
high temperature (up to 800C)
high power LED
High Power semiconductor modules
solid state relay (SSR)
DC-DC module power sources
electric power transmitter modules
Solar-panel arrays
Fitaovana manan-tsaina hery
Automotive electronics
High power semiconductor module
Solar panel components
Lighting industry
Aerospace
Communications
The power electronics industry
2.Delivery fotoana:
Sample:3-5 or 12-15 working days,
Mass production:5-7 or 12-15 working days
3.Package: Inner banga fonosana, fitsipika ivelany boaty baoritra fonosana.
4.Shipping:
A: By DHL, UPS, Fedex, TNT sns
B: Ny ranomasina ho an'ny faobe be araka ny mpanjifa ny fepetra.
5.If mila PCB teny nindramina ho an'ny tetikasa, pls manome manaraka Info:
A: Quote dia be,
B: Gerber ampy amin'ny 274-X endrika,
C: fepetra ara-teknika na ny masontsivana (ara-nofo, sosona, varahina hatevin'ny,
birao hatevin'ny, ambonin'ny famaranana, solder saron-tava / silkscreen loko ...)
Raha misy manontany na te-hianatra bebe kokoa, azafady handefa mailaka ho antsika malalaka na hiresaka an-tserasera amin'ny alalan'ny rafitra, Misaotra noho ny fanohanana mialoha!
