1. Gịnị bụ sekit osisi chọrọ nnọọ ewepụghị
Na akpaka ntinye akara, ma ọ bụrụ na-ebi akwụkwọ sekit osisi bụghị ewepụghị, ọ ga-eme ka ebe na-etịbe, na mmiri ike-etinyere n'ime oghere na elu nke efere, na ọbụna akpaka nkwụnye loader.When na PCB osisi nke kpọkọtara akụrụngwa na-welded mgbe soldering, na ụkwụ nke mmewere bụ ike a ga-ebipụ neatly.The PCB osisi nwekwara ike-arụnyere ke igwe igbe ma ọ bụ na anya na igwe, otú ahụ, PCB nzukọ factory nzute efere ya amaghị dịkwa nnọọ troublesome.At ugbu a, na -ebi akwụkwọ sekit osisi banyere oge nke elu echichi na mgbawa echichi, na biri ebi circuit iba nzukọ osisi ga-abụ ndị ọzọ na ndị ọzọ siri ike na chọrọ nke efere ya amaghị.
2. Standard na ule ụzọ maka ogologo
Dị ka United States IPC-6012 (1996 mbipụta) << isiike biri ebi circuit iba njirimara na arụmọrụ nkọwa >>, na allowable kacha warping na distortion nke elu-arịọnụ efere bụ 0,75%, na niile ọzọ PCB mbadamba na-ekwe 1.5% ahụ .Nke mụbara chọrọ maka n'elu-arịọnụ efere osisi nke ipc-rb-276 (1992 version) .Mgbe ihe ugbu a, owu e ji ogo nke ikike nke ọ bụla electronic PCB nzukọ osisi, n'agbanyeghị abụọ ma ọ bụ multi-oyi akwa PCB, 1.6mm ọkpụrụkpụ, na-emekarị 0,70 ~ 0,75%, ọtụtụ SMT, BGA egbuke, ihe a chọrọ bụ 0,5% .Ka electronics ụlọ mmepụta ihe na-ikwu ka a 0.3 percent abawanye na warping ụkpụrụ, na ule warping jikoro eso gb4677. 5-84 ma ọ bụ ipc-TM-650.2.4.22b.Put PCB osisi na a kwupụtara n'elu ikpo okwu, ule agịga mebie ogo nke kasị obodo, iji nwalee dayameta nke agịga, kewara site usoro ogologo nke PCB osisi, ogologo ogo nke e biri ebi sekit osisi nwere ike gbakọọ.
3. Warping n'oge n'ichepụta usoro
1. Engineering imewe: imewe nke ebi akwụkwọ sekit osisi a ga-kwuru, sị:
A. The ndokwa nke prepreg n'etiti n'ígwé kwesịrị symmetrical, dị ka isii laminates PCB Board , na ọkpụrụkpụ nke 1 ~ 2 na 5 ~ 6 n'ígwé ga-agbanwe agbanwe na ọnụ ọgụgụ nke ọkara sikwuo ike iberibe, ma ọ bụghị oyi akwa mgbali ga-adị mfe mebie.
B. Multi-laminated isi PCB na ọkara gwọrọ mbadamba ga-eji na-otu soplaya si na ngwaahịa.
C. The ebe nke elu A na B edoghi kwesịrị dị ka nso ka possible.If A na ihu bụ A nnukwu ọla kọpa elu, na B bụ naanị ole na ole e, efere dị mfe hie mgbe etching.If abụọ n'akụkụ nke akara ebe dị iche bụ oke buru ibu, i nwere ike tinye ụfọdụ indifferent okporo na dabere n'akụkụ, iji ghara imegide.
2, Mmiri na osisi tupu ịcha:
CCL mmiri PCB board tupu ịcha (150 degrees, 8 ± awa 2) n'ihi nzube bụ wepu mmiri n'ime osisi, na-eme ka resin gwọrọ n'ime efere, n'ihu iwepu mmapụta nchegbu na efere, nke na-enye aka iji gbochie osisi warping.At ugbu a, ọtụtụ abụọ-kwadoro PCB, multi-oyi akwa PCB mbadamba ka rube isi na tupu blanking ma ọ bụ post-mmiri step.But e nwekwara ụfọdụ PCB board n'ichepụta factory, ugbu a na PCB sekit osisi factory mmiri osisi oge iwu nwekwara ekwekọghị, sitere na si 4 10 awa, na-atụ aro na klas dị ka mmepụta nke biri ebi circuit ibana ahịa ina ogologo degrees na decide.Cut n'ime iberibe ma ọ bụ mgbe dum mpempe ime ime oven bee ihe onwunwe, na abụọ na usoro na-apụtakarị ihe, ọ na-atụ aro ịcha osisi mgbe ịcha. N'ime osisi kwesịkwara ihicha bọọdụ.
3. The ogologo na weft nke prepreg:
Mgbe prepreg lamination, na shrinkage na ogologo na weft ntụziaka dị iche iche, na ogologo na weft ntụziaka ga-ike oké mgbe blanking na stacking.Otherwise, ọ dị mfe mebie okokụre efere mgbe laminating, ọbụna ma ọ bụrụ na ọ bụ ike iji gbazie. Multi-oyi akwa PCB warping ihe mere, ọtụtụ n'ime ndị lamination nke prepreg mgbe owu e ji na weft emeghị ịmata ọdịiche dị n'etiti, aghara aghara mbiputegharị kpatara.
Olee otú ịmata ọdịiche dị n'etiti ohere na lonjituudu? Roll prepreg afụkọta direction bụ ogologo, na obosara direction bụ weft; ọla kọpa foil osisi maka ogologo n'akụkụ nke latitudinal, obere n'akụkụ bụ ogologo, ma ọ bụrụ na ọ bụghị n'aka-elele na emeputa ma ọ bụ soplaya.
4. Nchegbu mgbe laminating:
multilayer PCB osisi, mgbe imezu ọkụ-na ịpị oyi-pịa ịkpụ ma ọ bụ-egwe ọka burrs, mgbe ahụ, ewepụghị na mmiri na oven 150 degrees Celsius maka 4 awa, nke mere na intraplate nchegbu nwayọọ nwayọọ hapụ na-eme ka resin gwọrọ , a nzọụkwụ omitted.
5. Need ịgbatị na mkpa efere mgbe plating:
0.4 ~ 0.6mm mkpa multi-oyi akwa PCB osisi maka sekit osisi plating na graphic plating ka nke pụrụ iche nip mpịakọta, akpaka plating akara na Feiba clip na mpempe akwụkwọ, na a gburugburu mmanya dum clip na Fiba The ndido urụk na-strung ọnụ ịgbatị niile e biri ebi sekit mbadamba na ala nke na plated efere agaghị deform. Enweghị a mee ihe, mgbe plating iri abụọ ma ọ bụ iri atọ microns ọla kọpa oyi akwa, mpempe akwụkwọ ga-kpudo, na ike usọbọ.
6. Board jụrụ mgbe na-ekpo ọkụ ikuku leveling:
Na-ekpo ọkụ ikuku nke biri ebi circuit iba na-emetụta elu okpomọkụ nke solder trough (banyere 250 degrees Celsius). Mgbe ọ na-ewepụ, ọ ga-etinye n'ime larịị marble ma ọ bụ ígwè efere ajụkwa ndammana, mgbe ahụ, post-nhazi ígwè bụ cleaned.This dị mma maka warping nke boards.Some factory welie ìhè nke elu nke-edu ndú , tin, na osisi n'ime mmiri oyi, ozugbo ọkụ ikuku leveling mgbe a ole na ole sekọnd na reprocessing, dị a fever a oyi ujo, maka ụdị ụfọdụ nke mbadamba yiri ka na-emepụta warping, layered ma ọ bụ blister.In adianade do, ikuku sere n'elu bed ike-atụkwasịkwara ajụkwa nke akụrụngwa.
7. warping osisi nhazi:
Na a na-jisiri factory, na osisi ga-a 100% flatness ego na ikpeazụ nnyocha. All adịghị anakwere PCB mbadamba ga-ẹmende si, enịm ke ihe oven, butere na 150 degrees Celsius na arọ mgbali 3 6 awa, na n'okpuru mgbali nke eke jụrụ. Mgbe ahụ butuo efere na-ewepụ ndị PCB osisi, na flatness ego, nke mere na akụkụ nke osisi nwere ike-azọpụta, na ụfọdụ biri ebi sekit mbadamba mkpa ka abụọ ugboro atọ na ime iji level.If n'elu-e kwuru mgbochi -warping usoro jikoro na-emejuputa atumatu, ụfọdụ osisi mmiri bụ na-abaghị uru, na hapụrụ.