1. Dị ka ihe dị mkpa electronic njikọ, PCB na-eji nke fọrọ nke nta niile na kọmputa na ngwaahịa, a na-ewere "nne electronic usoro ngwaahịa," ya na nkà na ụzụ mgbanwe na ahịa na ọnọdụ na-na-elekwasị anya nke uche nke ọtụtụ ulo oru.
Ugbu a, e nwere abụọ doro anya na ọnọdụ na kọmputa na ngwaahịa: otu bụ mkpa na mkpụmkpụ, ndị ọzọ bụ elu ugboro, elu na-agba mbanye downstream PCB ya ka elu njupụta, elu mwekota, encapsulation, aghụghọ, na ntụziaka nke multiple stratification,-eto eto ina maka top oyi akwa PCB na HDI .
Top pcb board wiring length is short, low impedance circuit, high-frequency high-speed work, stable performance, can take on more complex function, is to the high frequency electronic technology, multi-function large capacity development inevitable trend.In particular, the in-depth application of large-scale integrated circuits will further drive PCB to high precision and high level.
2. Ugbu a, PCB na-bụ-eji maka ezinụlọ ngwa, PC, na desktọọpụ na ndị ọzọ na kọmputa na ngwaahịa, mgbe elu-ọgwụgwụ ngwa dị ka elu arụmọrụ multi-ụzọ sava na aerospace na-chọrọ nwere ihe karịrị 10 n'ígwé nke PCB.Take nkesa dị ka ihe atụ, ndị PCB osisi na otu na abụọ na-ụzọ server bụ n'ozuzu n'etiti 4-8 n'ígwé , mgbe isi osisi nke elu-ọgwụgwụ server, dị ka 4 8 ụzọ, na-achọ ihe karịrị 16 n'ígwé , na backplate a chọrọ bụ n'elu 20 n'ígwé.
HDI wiring njupụta ikwu nkịtị multilayer PCB osisi nwere doro anya uru, nke bụ isi oke nke mainboard nke ugbu a smartphone.Smartphone ọrụ na-esiwanye mgbagwoju na olu na fechaa mmepe, na-erughị na-erughị ohere maka isi osisi, ịchọ enweghị ebu ihe nke mmiri na isi osisi, nkịtị multi-oyi akwa osisi na-esi ike izute ina.
High-njupụta interconnection circuit osisi (HDI) adopts na laminated usoro iwu osisi, ndị nkịtị multilayer osisi dị ka isi osisi stacking, ojiji nke mkpọpu ala, na oghere metallization usoro, na-eme ihe niile n'ígwé nke dị n'etiti esịtidem njikọ ọrụ. E jiri ya tụnyere ot site-onu naanị multilayer PCB mbadamba, HDI n'ụzọ ziri ezi na-esetịpụrụ ndị ọnụ ọgụgụ nke kpuru ìsì vias lìe vias iji belata ọnụ ọgụgụ nke vias, na-azọpụta PCB layout ebe, na budata enwekwu akụrụngwa njupụta, si otú ngwa ngwa emecha multilayer ime ihe na smartphones Laminating ọzọ. 
The technical difference of HDI is reflected in the increment stacked number, the more layer quantity, the more difficult the technology.HDI can be divided into single stacked HDI, doule stacked HDI, triple stacked HDI,or high stacked HDI, etc., the number of layers is expressed as C+N+ C, where N is the number of normal core laminar, and C is the number of added layers, namely the stacked number of HDI..High stacked HDI cabling has higher density, but at the same time, it has more pressure, such as position, punch hole and copper plating, etc., which has higher requirements on the technical process and process capability of the manufacturer.
Popular na-adịbeghị anya na elu-ọgwụgwụ ama aka ike oyi akwa HDI na-kasị elu stacked nke HDI, achọ ihe ọ bụla nwere ìsì oghere njikọ n'etiti n'akụkụ n'ígwé, na ndabere nke nkịtị HDI ga-azọpụta ihe fọrọ nke nta ọkara nke olu, ka ime ka ndị ọzọ ụlọ maka batrị na n'akụkụ ndị ọzọ.
Ọ bụla oyi akwa nke HDI achọ na ojiji nke elu teknụzụ dị ka laser-egwu na electroplated oghere plọg, nke bụ ihe kasị sie ike mmepụta na kasị elu uru-kwukwara HDI ụdị, nke nwere ike kacha mma na-egosipụta technical larịị nke HDI. 
Two important trends of the automobile industry are intelligent and electric.ADAS (Advanced Driver Assistance System) as the transition of complete intelligent driving before, has become a major automakers and crossover of Internet giant rushed to the layout of the new strategic highland, it involves the electronic device cover nearly all of the whole vehicle driving and safety related System, with the rapid penetration of ADAS, comprehensive automobile electronic level will be raised.
3. Na ọhụrụ ume ugbo ala na-anọchite anya ntụziaka nke electric ụgbọ ala, jiri ya tụnyere ihe ọdịnala ụgbọ ala, na elu arịrịọ nke electronic larịị, na kọmputa ngwaọrụ na omenala limousine akwụ ụgwọ gua ihe 25%, 45% na 45% na ọhụrụ ume ugbo ala , pụrụ iche ike akara usoro (BMS, VCU na MCU), na-eme ka ụgbọala na PCB ojiji ibu karịa omenala ụgbọala, ndị na atọ ike akara usoro PCB ojiji nkezi nke banyere 3-5 square mita, na ego nke ụgbọala PCB N'etiti 5-8 square mita.
4. The uto nke ADAS na ọhụrụ ume ugbo ala, chụpụrụ site ụkwụ abụọ, nwekwara nọ akpakanamde electronics ahịa na-eto eto na-eme kwa afọ ọnụego nke ihe karịrị 15 percent na-adịbeghị anya years.Accordingly, ahịa nke PCB ga-anọgide na elu, na ọ bụ buru amụma na mmepụta nke PCB ga gafere $ 4 ijeri 2018, na uto na-emekarị doro nnọọ anya, ịgbanye ọhụrụ ọkụ n'ime PCB ụlọ ọrụ.
5. Smartphones abụwo isi ọkwọ ụgbọala nke PCB ụlọ ọrụ na past.Mobile Internet oge, ihe na ọzọ ọrụ si PC ka mobile ọnụ ngwá, ọnọdụ nke PC Mgbakọ ikpo okwu ngwa ngwa dochie anya mobile ọnụ, ebe ọ bụ na 2008, uwa n'ji latrik enterprise ngwa ngwa mmepe, karịsịa na 2012 ~ 2014, ama n'ime ngwa infiltration.Therefore, na-eto ngwa ngwa nke PCB na-chụpụrụ site downstream nke mobile ọnụ anọchi anya smart phones.Between 2010 na 2014, na ama ahịa na downstream nke PCB ruru na nkezi kwa afọ compound ibu ọnụego nke 24%, nke di anya-uku na nke ndị ọzọ downstream ọrụ, na-enye isi ibu ọkwọ ụgbọala maka PCB ụlọ ọrụ.
Na elu-ọgwụgwụ PCB, HDI, n'ihi na ihe atụ, mobile ekwentị bụ omenala HDI ahịa, na 2015, ihe atụ, smartphones gua n'ihi na ihe karịrị ọkara hà, na si n'ọnọdụ nke smart phones, ugbu ọhụrụ ọrụ fọrọ nke nta niile na ngwaahịa na-eji HDI ka motherboard.
Ma si n'ọnọdụ nke PCB na elu-ọgwụgwụ HDI, ọ bụ elu na-agba nke ama ibu nke na-eduga ndị ọganihu ina downstream, si otú na-akwado uto nke zuru ụwa ọnụ, PCB uru ụlọ ọrụ.
Ma ọ dịghị ekwetaghị na ama ahịa kwụsịlata kemgbe 2014, mgbe a ngwa ngwa infiltration oge na gradual ntinye nke smartphones n'ime ngwaahịa era.On ndị zuru ụwa ọnụ ahịa, ndị ọhụrụ amụma si IDC2016 wepụtara na November 2016, ndị zuru ụwa ọnụ ama butekwara na 2016 na-atụ anya ga-1,45 ijeri, na a ịrịba na-awụlikwa elu na uto nke dị 0,6 percent.In okwu nke ibu data, ọ bụ ezie na ọkara nke PCB si downstream ngwa ka na-akwado site na mobile phones, ọtụtụ PCB ige, tinyere HDI, kwụsịlataworo na mobile ọnụ ebe.
Ọ bụ ezie na onodu nke nsogbu akụ na ụba, smartphone ụlọ ọrụ n'ime nkera nke abụọ bụ a foregone ọgwụgwụ, ma na-adabere na nke nnukwu ngwaahịa, n'ihi na ngosipụta mmetụta ndị ọzọ mgbere na-eso elu, n'ji ina ga ụgbọala replacement.The nnukwu ngwaahịa ahịa nke smart phones ka nwere nnukwu nwere, na mgbere nke ọnụ ga-eme ha kacha mma ka mma na-eji ọkụ 'mgbu ihe ka na-akpali ina na ijido ahịa share.As a N'ihi ya, smart ekwentị, dị ka isi downstream ngwa nke PCB na n'oge gara aga, nwere oké nwere maka uto nke PCB na nnukwu ngwaahịa ókè.
N'ime abụọ gara aga ma ọ bụ afọ atọ smart ekwentị development emekarị, mkpisiaka ude, 3D Touch, nnukwu ihuenyo, sọrọ igwefoto na ndị ọzọ na-aga n'ihu ọhụrụ e abụrụ, ma nọgide na-akpali nnọchi upgrade.
Na onodu nke mobile phones abanye afọ na ngwaahịa, na nnukwu olu ndabere na-ekpebi na ikwu ibu mere site ọhụrụ nke na-ere ihe ka ga na-eduga a nnukwu abawanye na zuru ukwu nke demand.Stock nke ọhụrụ na-na-emetụta ụwa nile PCB, ma ọ bụrụ na-eme n'ọdịnihu ama ọhụrụ upgrade na PCB, n'ịtụle ẹdude mobile ekwentị emeputa ngwa ngwa Mbupu size na ndị ọzọ ndị na-elu ga-, ọhụrụ upgrade ga mee ngwangwa penetration, si otú pụtara yiri ngwa anya, now, wdg
6. Ilekwasị anya PCB ụlọ ọrụ, akasiaha FPC na ihe ọ bụla oyi akwa nke interconnection HDI adọta ndị ọzọ Nsukka na-eso elu, na n'ókè ọchị na n'elu na-etolite a nlereanya nke ngwa ngwa penetration:
FPC -mara dị ka "mgbanwe PCB", bụ a mgbanwe polyimide ma ọ bụ polyester film isi ihe mere nke a na-agbanwe e biri ebi circuit osisi, na elu njupụta nke wiring, ìhè arọ, ọkpụrụkpụ na mkpa, na-agbanwe, elu mgbanwe, nri na-emekarị nke kọmputa ngwaahịa fechaa, mgbanwe na-emekarị.
Mee ya iPhone ruo 16 iberibe FPC, ị nweta bụ ndị kasị ibu n'ụwa FPC, ụwa si n'elu isii FPC emeputa isi ahịa na-na-emepụta dị ka apple, samsung, Huawei, OPPO n'okpuru apple ngosipụta nwekwara welie ya FPC ojiji nke smartphones.
Smartphones dị ka isi na-anya ụgbọ agha, na uto nke FPC bụ rite uru na apple na ya ngosipụta mmetụta, FPC ngwa ngwa ijupụta, 09 nwere ike ịnọgide na-enwe elu ibu, kwa afọ kemgbe afọ 15 dị ka onye nanị na-egbuke egbuke ntụpọ na PCB ụlọ ọrụ, ghọrọ naanị mma ibu Atiya .
7. mkpụrụ-Dị ka PCB (kwuru na dị ka SLP) na HDI technology, dabere na M-SAP usoro, nwere ike n'ihu nụchaa akara, bụ a ọgbọ ọhụrụ nke ezi akara biri ebi circuit iba.
Ndị klas osisi (SLP) bụ ọgbọ ọzọ PCB hardboard, nke nwere ike shortened site 40/40 microns nke HDI ka 30/30 microns.From usoro echiche, na klas loading osisi nso eji na okporo ọkụ nkwakọ IC osisi, ma nwere ma na-iru IC nke nkọwa nke ibu osisi, na nzube ya bụ ka na-ebu ụdị nile nke n'ezinụlọ mmiri, isi n'ihi na ka ọ bụ nke na udi nke PCB.For ọhụrụ a mma akara ebi akwụkwọ efere, Atiya, anyị ga- akọwa atọ akụkụ nke ya mbubata ndabere, n'ichepụta usoro ma nwere suppliers.Why ị chọrọ mbubata klas ibu osisi: nnọọ nụchara anụcha akara superposition inu nkwakọ chọrọ, elu njupụta dị ka isi akara, smart ntị, mbadamba, na wearable ngwaọrụ na ọzọ na kọmputa na ngwaahịa ịzụlite na ntụziaka nke miniaturization na muti_function mgbanwe, na-ebu na ọnụ ọgụgụ nke mmiri na-ukwuu ụba maka sekit osisi ohere, Otú ọ dị, ndị ọzọ na ndị ọzọ ole na.
N'ebe a, PCB waya n'obosara, spacing, na dayameta nke Micro panel na oghere center anya, na-eduzi oyi akwa na ọkpụrụkpụ nke-egbochi ihe oyi akwa na-ada ada, nke na-eme ka PCB iji belata size, ibu na olu nke ikpe, ọ ike ịba ndị ọzọ components.As Moore iwu bụ ka Semiconductors, elu njupụta bụ a persistent achụ nke e biri ebi sekit mbadamba:
Oké zuru ezu circuit chọrọ dị elu karịa HDI.High njupụta mere na PCB nụchaa akara, na pitch nke bọl (BGA) na nkpirikpi.
Na a afọ ole na ole gara aga, 0,6 mm ka 0,8 mm pitch technology e ji mee na handheld ngwaọrụ, ọgbọ a nke smart phones, n'ihi na nke ukwu nke m / O akụrụngwa na ngwaahịa miniaturization, PCB n'ọtụtụ ebe na-eji nkà na ụzụ nke 0.4 mm pitch. Nke a na-emekarị na-emepe emepe kwupụta 0.3mm. N'ezie, mmepe nke 0.3mm ọdịiche technology maka mobile ọnụ esesịn begun.At n'otu oge ahụ, na nke nke micropore na dayameta nke ejikọta diski e belata 75 mm na 200 mm karị.
The ụlọ ọrụ mgbaru ọsọ dị dobe micropores na discs na 50mm na 150mm karị na ole na ole sochirinụ years.The 0.3mm spacing imewe nkọwapụta na-achọ na akara obosara akara bụ 30 / 30μm.
ọ na klas osisi dabara inu nkwakọ nkọwapụta more.SIP usoro larịị nkwakọ technology, dabere na definition nke mba okporo ọkụ akara nzukọ (ITRS): inu maka otutu ifịk latrik na dị iche iche na ọrụ na ịnara n'ezinụlọ mmiri, na ndị ọzọ na ngwaọrụ dị ka MEMS ma ọ bụ ngwa anya ngwaọrụ mkpa ọnụ, na-enweta a ụfọdụ ọrụ nke a otu ọkọlọtọ nkwakọ, nkwakọ technology na-etolite a ma ọ bụ usoro subsystem.
E nwere na-emekarị ụzọ abụọ na-aghọta na ọrụ nke electronic usoro, na otu onye bụ SoC, na electronic usoro a na-ghọtara na otu mgbawa na elu integration.Another bụ inu, nke integrates CMOS na ndị ọzọ na integrated na sekit na sekit na latrik n'ime a ngwugwu iji tozuru okè Nchikota ma ọ bụ interconnection technology, nke nwere ike nweta dum igwe ọrụ site na yiri machie nke dị iche iche ọtọ ibe.
Ndị klas ahụ osisi bụ nke PCB hardboard, na ya usoro bụ n'etiti elu iji HDI na IC efere, na elu-ọgwụgwụ HDI emepụta na IC osisi emepụta nwere ohere isonye.
HDI emepụta na-ọzọ na-akpa ike, mkpụrụ a ga-key.Compared na IC efere, HDI-esiwanye asọmpi na aghọwo a red oké osimiri ahịa, na uru n'akụkụ peeji declining.Face klas loading osisi, ohere nke HDI emepụta nwere ike iji na-enweta ọhụrụ iwu, na otu aka, na aka nke ọzọ nwere ike na-aghọta ngwaahịa upgrade, optimizing ngwaahịa mix na larịị nke enwetakwa, ya mere bu n'obi na-ike, ndị ọzọ dị ike mbụ layout.
N'ihi na usoro elu klas loading osisi, HDI emepụta itinye ego ma ọ bụ ọhụrụ n'ichepụta ngwá mgbanwe, na MSAP usoro technology maka HDI emepụta chọkwara amụta oge, si mwepu usoro n'ime MSAP, ngwaahịa mkpụrụ ga-isi.
8. Ikanam ngwa mmepe nke elu thermal conductivity CCL ibu a na-ekpo ọkụ spot.The obere spacing ikanam nwere uru ndị unspelt, ezi ngosi mmetụta na ogologo ọrụ ndụ. Na-adịbeghị anya, ọ malitere ijupụta, na ọ na-e-eto eto n'ike n'ike. N'ihi ya, achọrọ elu thermal conductivity CCL aghọwo a na-ekpo ọkụ ntụpọ.
Vehicle PCB na ngwaahịa mma na a pụrụ ịdabere chọrọ siri nnọọ ike, na ndị ọzọ iji ihe pụrụ iche arụmọrụ ihe CCL.Automotive electronics bụ ihe dị mkpa PCB downstream ngwa. Automotive kọmputa na ngwaahịa ga-akpa izute akpakanamde dị ka a n'aka nke iga ahu genwe agwa nke okpomọkụ, idụhe, voltaji fluctuations, akpa ndabichi vibration na ndị ọzọ na-agbanwe ike elu chọrọ maka akpakanamde PCB ihe tinye n'ihu elu chọrọ, ojiji nke ọzọ Special arụmọrụ ihe (dị ka elu Tg ihe, mgbochi CAF (abịakọrọ Asbestos eriri) ihe, oké ọla kọpa ihe na seramiiki ihe, wdg) CCL.