Ihe bụ isi nzube nke PCB elu ọgwụgwọ bụ iji hụ ezi weldability ma ọ bụ eletriki performance.Because eke ọla kọpa na ikuku nēche na-na ụdị oxides, ọ bụ eleghi anya ịnọgide na ọla kọpa maka a ogologo oge, n'ihi ya, na ọla kọpa dị mkpa n'ihi na ndị ọzọ agwọ ọrịa .
1.Hot Air inwetaghachi (Hal / HASL)
Hot ikuku leveling, makwaara dị ka na-ekpo ọkụ ikuku solder leveling (akpọkarị Hal / HASL), nke a na-ntekwasa na PCB n'elu kpo oku wụrụ awụ tin solder (edu ndú) na eji abịakọrọ ikuku na dum (igbu) ewepụghị technology, ka ya n'ụdị a oyi akwa nke ọla kọpa ọxịdashọn eguzogide, na ike inye ezi weldability nke mkpuchi layer.The solder na ọla kọpa na-guzobere na nkwonkwo na-etolite a compound.The PCB ga-mikpuru n'ime wụrụ awụ solder n'oge na-ekpo ọkụ ikuku conditioning.The ifufe mma flushes mmiri mmiri solder tupu solder solidifies.The ifufe mma pụrụ ibelata ekwe nke solder na ọla kọpa elu ma gbochie ịgbado ọkụ akwa.
2.Organic Weldable echebe Ukwu (OSP)
OSP-e biri ebi circuit iba (PCB) ọla kọpa foil n'elu ọgwụgwọ nke a ụdị technology izute chọrọ nke RoHS directive.OSP bụ afo nke Organic Solderability egbochi mmebi. Ọ na-amara dị ka Organic soldering film, a makwaara dị ka ọla kọpa na-echebe, na-mara dị ka Preflux na English.In a nutshell, na OSP bụ a na ya ju oyi akwa nke organic akpụkpọ n'elu ọcha, iferi copper.This film nwere mgbochi ọxịdashọn, kwes ujo na mmiri na-eguzogide, nke nwere ike ichebe ọla kọpa n'elu si nchara (ọxịdashọn ma ọ bụ vulcanization) na nkịtị environment.But na ụdi ịgbado ọkụ okpomọkụ, nke na-echebe film na a ga-ngwa ngwa wepụrụ agbanwe oge mfe, otú ike ka dị ọcha na ọla kọpa elu nke show bụ na a nnọọ obere oge na wụrụ awụ solder ozugbo ibu a siri ike solder nkwonkwo.
3.Full efere Nickel / Gold
efere Nickel / Gold na-plated n'elu PCB na mgbe plated na a oyi akwa nke gold. The nickel plating bụ tumadi iji gbochie mgbasa nke ọlaedo na copper.Now e nwere ihe abụọ na ụdị electroplating nickel gold: adụ gold plating (gold, gold n'elu ọdịdị bụghị na-egbuke egbuke) na ike gold plating (elu bụ ezigbo onye na ike, na-eyi-n'iguzogide , nwere ndị ọzọ ọcha dị ka cobalt, gold anya ọzọ ìhè) .Soft gold na-bụ-eji maka mgbawa nkwakọ gold waya; The ike gold na-bụ-eji maka eletriki interconnection na-abụghị ịgbado ọkụ ebe.
4.Immersion Gold
imikpu gold na-ntekwasa na a oké, electrically ọma nickel-gold alloy na ọla kọpa n'elu, nke nwere ike ichebe PCB ruo ogologo time.In adianade do, o nwere ndidi nke ọzọ elu ọgwụgwọ technologies.In adianade do, na-emikpu gold nwekwara ike gbochie mgbasa nke ọla kọpa, nke ga-aba uru-edu-free mgbakọ.
5.Immersion gbamgbam
Ebe niile solders dabeere na tin, gbamgbam oyi akwa nwere ike dakọtara ụdị ọ bụla nke solder.Tin usoro n'etiti ewepụghị ọla kọpa tin ogige pụrụ kpụrụ, nke a mma na-eme ka arọ tin nwere dị ka na-ekpo ọkụ ikuku leveling nke ọma weldability na ọ dịghị na-ekpo ọkụ ikuku leveling flatness nke isi ọwụwa nsogbu; imikpu tin ike ịchekwa n'ihi na ogologo na a ga-kpọkọtara n'usoro nke edozi tin.
6.Immersion Silver
The silver usoro bụ n'etiti organic mkpuchi na electroless nickel plating. Usoro dị mfe ma fast.Even mgbe ọ gụrụ ikpo, iru mmiri na mmetọ, silver nwere ike ịnọgide na-enwe ezi weldability ma ya ga-atụfu ya luster.The silver anaghị nwere ezi ahụ ike nke chemical plating nickel / emikpu gold n'ihi na e nweghị nickel n'okpuru silver oyi akwa.
7.ENEPIG (Electroless Nickel Electroless palladium imikpu Gold)
E jiri ha tụnyere ENEPIG na ENIG, e nwere ihe ọzọ oyi akwa nke palladium n'etiti nickel na gold. Palladium pụrụ igbochi corrosion onu mere site nnọchi mmeghachi omume, na-eme ka zuru nkwadebe maka imikpu gold.Gold chiri anya kpuchie palladium, na-enye a ezi interface.
8.Plating Ike Gold
Iji melite wear-eguzogide ihe onwunwe nke ngwaahịa, dịkwuo ntinye nọmba na plating ike gold.
