E nwere ọtụtụ Filiks na elu nke biri ebi circuit iba : ọtọ PCB osisi (dịghị elu ọgwụgwọ), OSP, Hot Air inwetaghachi (edu ndú tin, na-edu-free tin), plating gold, imikpu gold wdg ndị ọzọ anya.
The dị iche n'etiti imikpu gold na plating gold
Imikpu gold bụ a usoro nke chemical deposition. A chemical oyi akwa a kpụrụ site a chemical ọxịdashọn-Mbelata mmeghachi omume. N'ozuzu, na ọkpụrụkpụ dịtụ oké. Ọ bụ ụdị nke chemical nickel-gold-gold oyi akwa deposition usoro, na nwere ike nweta a oké gold oyi akwa.
Gold plating eji ụkpụrụ nke electrolysis, na-akpọ electroplating. Ọtụtụ ndị ọzọ na metal n'elu agwọ ọrịa na-nwekwara electroplated. 
In the actual product application, 90% of the gold pcb board is the immersed gold pcb board,because the poor solderability of the plated circuit board is his fatal flaw, and it is also the direct cause of many companies to give up the gold plating process!
Imikpu gold usoro edebe n'elu nke biri ebi sekit mbadamba na mụ na agba, ezi ìhè, ezigbo plating, na ezi solderability nke nickel gold plating. Ihe ọ nwere ike kewara n'ime anọ nkebi: tupu omume (mmanụ mwepụ, Micro-etching, ebighị, post-itinye), nickel ọdịda, arọ gold, post-omume (n'efu mmiri saa, dị mmiri saa, ihicha). Imikpu gold ọkpụrụkpụ bụ n'etiti 0.025-0.1um.
Gold na-etinyere na n'elu omume nke e biri ebi sekit mbadamba n'ihi na ya elu eletriki conductivity, ezi ọxịdashọn eguzogide, na ogologo lifespan. Ọ na-eji dị ka isi mbadamba, gold mkpịsị aka PCB mbadamba, wdg The isi ihe dị iche n'etiti ọlaedo mbadamba na gold-mikpuru mbadamba bụ na gold plating bụ ike. Gold (abrasion eguzogide ọgwụ), gold bụ adụ gold (bụghị-eyi na-eguzogide ọgwụ). 
1. The crystal structure formed by Immersion Gold and Gold Plating is different. Immersion Gold is much thicker than Gold Plating. Immersion Gold will be golden yellow and yellower than Gold Plating (this is the method of distinguishing between gold plating and heavy gold plating.) a) Gold plating will be slightly white (nickel color).
2. The crystal Ọdịdị kpụrụ imikpu gold na gold plating bụ dị iche iche. Imikpu gold bụ mfe Weld karịa gold plating na ga-eme ka ihe ọjọọ ịgbado ọkụ. The nchegbu nke immerison gold osisi bụ mfe akara, ma ọ bụ ndị ọzọ eme ka bonding usoro maka bonded ngwaahịa. N'otu oge ahụ, n'ihi na gold bụ ihe ọlaedo karịa ọlaedo, gold-atụ aka gold mkpịsị aka bụghị wearable (adịghị emezi emezi nke gold efere).
3. E nwere nanị nickel-gold na mpe mpe akwa na gold-mikpuru PCB board .Onye mgbaàmà nnyefe na akpụkpọ mmetụta adịghị emetụta mgbaàmà na ọla kọpa oyi akwa.
4. imikpu gold ọzọ bụ na ok karịa ọlaedo plating crystal Ọdịdị, adịghị mfe iji na-emepụta ọxịdashọn.
5. Na-amụba ina maka biri ebi circuit ibanhazi ziri ezi, akara n'obosara, spacing ruru 0.1mm n'okpuru. Gold plating bụ ewekarị gold obere sekit. The gold efere naanị nwere nickel na gold na mpe mpe akwa, n'ihi ya, ọ dịghị mfe iji na-emepụta a gold obere sekit.
6. The imikpu gold naanị nwere nickel gold na mpe mpe akwa, otú ahụ solder iguzogide na akara na-ọzọ ike o sie ka ọla kọpa oyi akwa. The oru ngo ga-emetụta ndị spacing mgbe na-eme akwụ ụgwọ.
7. N'ihi na elu chọrọ nke PCB osisi, flatness chọrọ mma, izugbe ojiji nke nmikpu gold , imikpu gold n'ozuzu adịghị egosi mgbe nzukọ nke nwa ute onu. The flatness na ọrụ ndụ nke gold efere dị mma karịa na nke gold efere.
Ya mere ọ dị ugbu a kasị ụlọ mmepụta ihe na-eji nmikpu gold usoro na-emepụta gold PCB board .Ma, mgbe ndị gold-mikpuru usoro bụ ihe dị oké ọnụ karịa ọlaedo-plating usoro (ọzọ gold ọdịnaya), ya mere, e nwere ndị ka a ọnụ ọgụgụ buru ibu nke ala-ọnụ ngwaahịa iji gold-plating Filiks (dị ka ime akara ogwe, toy mbadamba).