1. Raws li ib qho tseem ceeb hluav taws xob connector, PCB yog siv rau yuav luag tag nrho cov hluav taws xob cov khoom, yog suav hais tias "leej niam ntawm hluav taws xob system khoom," nws kev vam thiab kev ua lag luam tiam sis tau ua tus ua kom pom tseeb xim ntawm ntau cov lag luam.
Tam sim no, muaj ob cuab tiam sis nyob rau hauv hluav taws xob cov khoom: ib tug yog nyias thiab luv luv, lwm yam yog siab zaus, kev kub ceev tsav downstream PCB raws li rau kev kub ceev, siab koom ua ke, encapsulation, hloov maj mam, thiab cov kev taw qhia los ntawm ntau yam stratification, loj hlob coob rau rau sab saum toj txheej PCB thiab cov HDI .
Top pcb board wiring length is short, low impedance circuit, high-frequency high-speed work, stable performance, can take on more complex function, is to the high frequency electronic technology, multi-function large capacity development inevitable trend.In particular, the in-depth application of large-scale integrated circuits will further drive PCB to high precision and high level.
2. Tam sim no, PCB yog tsuas yog siv rau tsev neeg cov khoom siv, PC, desktop thiab lwm yam electronic khoom, thaum high-end daim ntaub ntawv xws li muaj kev kawm siab multi-txoj kev servers thiab aerospace yuav tsum muaj ntau tshaj li 10 khaubncaws sab nraud povtseg ntawm PCB.Take neeg rau zaub mov raws li ib qho piv txwv, cov PCB board nyob rau hauv ib thiab ob-txoj kev neeg rau zaub mov yog feem ntau nyob nruab nrab ntawm 4-8 khaubncaws sab nraud povtseg , thaum lub sij hawm lub ntsiab rooj tsavxwm ntawm lub high-end neeg rau zaub mov, xws li 4 thiab 8 txoj kev, yuav tsum tau ntau tshaj li 16 khaubncaws sab nraud povtseg , thiab cov backplate yuav tsum tau yog saum toj no 20 khaubncaws sab nraud povtseg.
HDI xov ceev txheeb ze rau tib yam multilayer PCB board muaj cuab zoo, uas yog lub ntsiab xaiv ntawm mainboard ntawm tam sim no smartphone.Smartphone muaj nuj nqi nce complex thiab ntim rau khaub-ncaws nyias txoj kev loj hlob, thiab tsawg tsawg qhov chaw rau cov ntsiab board, yuav tsum yog tas nqa ntau tshaj ntawm cov Cheebtsam rau ntawm lub ntsiab board, zoo tib yam multi-txheej board tau nyuaj kom tau raws li qhov kev thov.
High-density interconnection Circuit Court board (HDI) adopts cov laminated kev cai lij choj board, cov zoo tib yam multilayer board raws li cov tub ntxhais board stacking, siv cov drilling, thiab qhov metallization txheej txheem, ua tag nrho cov khaubncaws sab nraud povtseg ntawm cov kab ntawm cov internal kev twb kev txuas muaj nuj nqi. Piv nrog rau cov pa los ntawm-qhov tsuas multilayer PCB boards, HDI meej teev tus xov tooj ntawm qhov muag tsis pom vias thiab faus vias rau txo tus naj npawb ntawm vias, txuag PCB layout cheeb tsam, thiab ho tsub kom tivthaiv ceev, yog li sai ua kom tiav cov multilayer lag luam nyob rau hauv smartphones Laminating cawm. 
The technical difference of HDI is reflected in the increment stacked number, the more layer quantity, the more difficult the technology.HDI can be divided into single stacked HDI, doule stacked HDI, triple stacked HDI,or high stacked HDI, etc., the number of layers is expressed as C+N+ C, where N is the number of normal core laminar, and C is the number of added layers, namely the stacked number of HDI..High stacked HDI cabling has higher density, but at the same time, it has more pressure, such as position, punch hole and copper plating, etc., which has higher requirements on the technical process and process capability of the manufacturer.
Nrov nyob rau hauv xyoo tsis ntev los nyob rau hauv lub high-end smartphone arbitrary txheej HDI yog lub siab tshaj plaws stacked ntawm HDI, yuav tsum tau tej muaj qhov muag tsis pom qhov kev twb kev txuas ntawm ib sab khaubncaws sab nraud povtseg, rau lub hauv paus ntawm zoo tib yam HDI yuav cawm tau ze li ntawm ib nrab ntawm cov volume, thiaj li mus ua ntau chav rau roj teeb thiab lwm qhov chaw.
Tej txheej ntawm HDI yuav tsum siv cov advanced technologies xws li laser drilling thiab Electroplated qhov plugs, uas yog lub feem ntau nyuaj ntau lawm thiab lub siab tshaj plaws nqi-ntxiv HDI yam, uas yuav zoo tshaj plaws kev cuam tshuam cov kev theem ntawm HDI. 
Two important trends of the automobile industry are intelligent and electric.ADAS (Advanced Driver Assistance System) as the transition of complete intelligent driving before, has become a major automakers and crossover of Internet giant rushed to the layout of the new strategic highland, it involves the electronic device cover nearly all of the whole vehicle driving and safety related System, with the rapid penetration of ADAS, comprehensive automobile electronic level will be raised.
3. Thiab tshiab zog tsheb yog sawv cev rau cov kev taw qhia ntawm cov hluav taws xob lub tsheb, muab piv nrog cov tus tsoos tsheb, lub siab dua kev thov ntawm hluav taws xob theem, hluav taws xob nyob rau hauv tsoos limousine nqi lees paub txog 25%, 45% mus rau 45% nyob rau hauv lub tshiab zog tsheb , tshwj xeeb hwj chim tswj system (BMS, VCU thiab MCU), ua rau lub tsheb PCB pab yog loj dua cov tsoos tsheb, peb hwj chim tswj system PCB pab nruab nrab ntawm txog 3-5 square meters, tus nqi ntawm lub tsheb PCB ntawm 5-8 square meters.
4. Cov kev loj hlob ntawm ADAS thiab tshiab zog tsheb, uas tau tsav los ntawm ob lub log, kuj cia cov tsheb electronics lag luam loj hlob nyob rau ntawm ib txhua xyoo tus nqi ntawm ntau tshaj li 15 feem pua nyob rau hauv tsis ntev los no years.Accordingly, kev ua lag luam ntawm PCB yuav ntxiv upward, thiab nws yog ib kwv yees hais tias tus zus tau tej cov PCB yuav ntau tshaj $ 4 billion nyob rau hauv 2018, thiab cov kev loj hlob qauv yog heev ntshiab, hno tshiab momentum mus rau hauv lub PCB kev lag luam.
5. Smartphones tau ib tug loj tsav tsheb ntawm lub PCB kev lag luam nyob rau hauv lub past.Mobile Internet era, ntau thiab ntau cov neeg los ntawm PC rau mobile davhlau ya nyob twg khoom, cov xwm txheej ntawm cov PC xam platform sai sai hloov los ntawm lub mobile davhlau ya nyob twg, txij li thaum 2008, lub ntiaj teb no cov neeg siv hluav taws xob Cheebtsam enterprise ceev txoj kev loj hlob, tshwj xeeb tshaj yog nyob rau hauv 2012 ~ 2014, smartphone rau hauv sai infiltration.Therefore, kev loj hlob sai ntawm PCB yog tsav los ntawm lub downstream ntawm mobile terminals sawv cev los ntawm ntse phones.Between 2010 thiab 2014, lub smartphone lag luam nyob rau hauv lub downstream ntawm PCB mus txog ib tug nruab nrab txhua xyoo compound txoj kev loj hlob nqi ntawm 24%, nyob deb tshaj hais tias ntawm lwm yam downstream industries, kev muab cov ntsiab txoj kev loj hlob tsav tsheb rau lub PCB kev lag luam.
Nyob rau hauv high-end PCB, HDI, piv txwv li, mobile xov tooj yog ib tug ib txwm HDI ua lag luam, nyob rau hauv 2015, rau piv txwv, smartphones lees paub rau ntau tshaj ib nrab ntawm cov kev faib ua feem, thiab los ntawm lub foundations ntawm ntse tes, rau tam sim no tshiab tej hauj lwm yuav luag tag nrho cov khoom siv HDI li motherboard.
Ob leeg los ntawm lub foundations ntawm PCB thiab high-end HDI, nws yog ib lub high school cov kev ceev ntawm smartphone txoj kev loj hlob uas ua rau yus txoj kev vam meej thov downstream, yog li yuav txhawb tau kev loj hlob ntawm ntiaj teb no PCB kom zoo dua qhauj.
Tab sis yog tsis muaj qhov tsis kam hais tias cov smartphone kev ua lag luam tau slowed down vim 2014, tom qab ib tug sai infiltration lub sij hawm thiab lub tsheb txhob sibtsoo nkag teb chaws ntawm smartphones mus rau hauv lub Tshuag era.On lub ntiaj teb no kev ua lag luam, qhov tseeb forecast los ntawm IDC2016 tso nyob rau hauv Kaum ib hlis 2016, lub ntiaj teb no smartphone tuaj nyob rau hauv 2016 yuav tsum 1,45 billion, nrog ib tug tseem ceeb dhia nyob rau hauv txoj kev loj hlob ntawm cia li 0.6 percent.In cov nqe lus ntawm txoj kev loj hlob cov ntaub ntawv, txawm hais tias ib nrab ntawm PCB lub downstream daim ntaub ntawv tseem txhawb los ntawm cov xov tooj txawb, feem ntau PCB pawg, xws li HDI, muaj tub ceevxwm nyob rau hauv lub mobile davhlau ya nyob twg cheeb tsam.
Txawm tias nyob rau hauv lub ntsiab lus teb ntawm tus economic downturn, smartphone lag luam mus rau hauv lub thib ob ib nrab yog ib tug foregone xaus, tab sis nyob rau hauv lub hauv paus ntawm lub loj Tshuag, vim tus qauv qhia nyhuv lwm cov neeg muag khoom ua raws li, tus neeg thov yuav tsav replacement.The loj Tshuag kev ua lag luam ntawm ntse tes tseem muaj cov loj loj tej zaum, thiab cov neeg muag khoom ntawm lub terminals yuav ua lawv zoo tshaj plaws los mus txhim kho cov kev pab 'mob cov ntsiab lus thiaj li mus tsim kho kev thov thiab muab kev ua lag luam share.As ib tug tshwm sim, lub ntse xov tooj, raws li lub ntsiab downstream daim ntawv thov ntawm PCB nyob rau hauv lub dhau los lawm, muaj ntau yam zoo rau txoj kev loj hlob ntawm PCB nyob rau hauv lub loj loj Tshuag ciam.
Tshaj yav dhau los ob los yog peb lub xyoos ntawm ntse xov tooj txoj kev loj hlob qauv, tuabneeg paub, 3D kov, loj screen, dual lub koob yees duab thiab lwm yam tas mus li innovation tau tawm, tab sis kuj tseem mus tsim kho hloov txawj tej yam ntxiv.
Nyob rau hauv lub ntsiab lus teb ntawm cov xov tooj txawb nkag mus rau lub hnub nyoog ntawm Tshuag, lub loj loj ntim hauv paus txiav txim tias tus txheeb ze txoj kev loj hlob tshwm sim los ntawm lub innovation ntawm muag cov ntsiab lus tseem yuav ua rau ib tug loj loj nce nyob rau hauv lub meej kom muaj nuj nqis ntawm demand.Stock ntawm innovation kuj muaj feem xyuam rau lub ntiaj teb no PCB, yog hais tias yav tom ntej smartphone innovation txawj tej yam ntxiv nyob rau hauv PCB, xaiv cov uas twb muaj lawm lub xov tooj txawb chaw tsim tshuaj paus ceev zaub mov xa tuaj loj thiab lwm yam kev soj qab taug yuav, innovation txawj tej yam ntxiv yuav leeb allergic, yog li nyob zoo ib yam li tus kho qhov muag, acoustic, etc.
6. Kev Tsom PCB kev lag luam, lub phaum ntawm FPC thiab tej txheej ntawm interconnection HDI attracts lwm manufacturers ua raws li, thiab tus taw tes radiates mus rau qhov chaw tsim ib tug qauv ceev allergic:
FPC no kuj hu ua "saj zawg zog PCB", yog ib tug saj zawg zog polyimide los yog polyester zaj duab xis puag cov ntaub ntawv uas ua los ntawm ib tug saj zawg zog luam Circuit Court board, nrog rau cov kev kub ceev ntawm thaiv, lub teeb yuag, thickness nyias, saj zawg zog, siab yooj, catering rau tus qauv ntawm lub hluav taws xob khoom khaub-ncaws nyias, saj zawg zog sib.
Siv nyob rau hauv nws cov iPhone mus txog 16 daim ntawm FPC, ceev yog lub ntiaj teb no tus loj tshaj plaws FPC, ntiaj teb no lub sab saum toj rau FPC chaw tsim tshuaj paus lub ntsiab cov neeg muas zaub yog manufacturers xws li kua, samsung, huawei, OPPO nyob rau hauv Kua ua qauv qhia tseem txhim khu nws FPC kev pab ntawm smartphones.
Smartphones li cov thawj tsav quab yuam, txoj kev loj hlob ntawm FPC yog kev pab los ntawm cov kua thiab nws ua qauv qhia nyhuv, FPC sai ris, 09 yuav muaj siab txoj kev loj hlob, txhua txhua xyoo txij li thaum 15 xyoos raws li lub xwb kaj chaw nyob rau hauv PCB kev lag luam, los ua tus tsuas zoo kev loj hlob qeb .
7. Substrate-Zoo li PCB (xa mus rau raws li SLP) nyob rau hauv lub HDI technology, raws li nyob rau hauv lub M-kua ntoo txheej txheem, yuav ntxiv cais puab cov kab, yog ib tug tshiab tiam ntawm fine line luam Circuit Court board.
Cov chav kawm ntawv board (SLP) yog cov tiam tom ntej PCB hardboard, uas yuav tsum tau zog los ntawm 40/40 microns ntawm HDI rau 30/30 microns.From txheej txheem taw tes ntawm view, hauv chav kawm ntawv loading board los ze zog mus siv nyob rau hauv lub semiconductor ntim IC board, tab sis twb tsis tau mus cuag cov IC ntawm lub specifications ntawm lub load board, thiab nws cov hom phiaj tseem nqa tag nrho cov xaiv ntawm cov passive Cheebtsam, lub ntsiab tshwm sim yog tseem belongs rau cov qeb ntawm lub PCB.For no tshiab zoo kab luam ntawv phaj qeb, peb yuav txhais tau cov peb qhov ntev ntawm nws ntshuam tom qab, raug cov txheej txheem thiab tej zaum suppliers.Why ua koj xav import chav kawm ntawv load board: tsis tshua muaj neeg ua kom zoo zoo kab superposition SIP ntim uas yuav tsum tau, kev kub ceev yog tseem lub ntsiab kab, ntse tes, ntsiav tshuaj, thiab wearable kiag li lawm thiab lwm yam electronic khoom los tsim nyob rau hauv cov kev taw qhia ntawm miniaturization thiab muti_function hloov, mus nqa nyob rau hauv lub xov tooj ntawm Cheebtsam yog heev zog rau circuit Court board qhov chaw, txawm li cas los, ntau thiab ntau tsawg.
Nyob rau hauv qhov ntsiab lus teb, PCB hlau dav, yov, lub lub cheeb ntawm lub micro vaj huam sib luag thiab lub qhov chaw deb, thiab tus neeg xyuas pib txheej thiab lub thickness ntawm insulating txheej yuav ntog, uas ua rau lub PCB los txo loj, qhov hnyav thiab qhov ntim ntawm tus neeg mob, nws yuav haum ntau components.As Moore txoj cai yog semiconductors, kev kub ceev yog ib tug pheej caum qab ntawm cov ntawv luam circuit Court laug cam:
Tsis tshua muaj neeg ncauj lus kom ntxaws Circuit Court yuav tsum muaj ntau tshaj li HDI.High ceev drives lub PCB cais puab cov kab, thiab lub suab ntawm lub pob (BGA) yog zog.
Nyob rau hauv ib ob peb xyoos dhau los, lub 0.6 hli rau 0.8 hli suab technology twb tau muab siv nyob rau hauv lub handheld pab kiag li lawm, qhov no tiam ntawm ntse tes, vim hais tias cov nuj nqis ntawm cov I / O tivthaiv thiab khoom miniaturization, PCB lug siv cov technology ntawm 0.4 hli suab. Qhov no sib yog tsim ntawm 0.3mm. Nyob rau hauv qhov tseeb, txoj kev loj hlob ntawm 0.3mm kis technology rau mobile terminals twb begun.At tib lub sij hawm, qhov loj ntawm lub micropore thiab txoj kab uas hla ntawm lub txuas disc tau raug txo kom 75 hli thiab 200 mm feem.
Cov kev lag luam lub hom phiaj yog mus poob rau micropores thiab discs rau 50 hli thiab 150mm feem nyob rau hauv lub tom ntej no ob peb years.The 0.3mm yov tsim specification yuav tsum tau hais tias tus kab dav kab yog 30 / 30μm.
nws chav kawm ntawv board fits SIP ntim specification more.SIP system theem ntim tshuab, raws li nyob rau hauv lub ntsiab txhais ntawm thoob ntiaj teb semiconductor kab lub koom haum (ITRS): PAS rau ntau yam kom nquag plias hluav taws xob Cheebtsam nrog txawv zog thiab yeem passive Cheebtsam, thiab lwm yam pab kiag li lawm xws li MEMS los yog kho qhov muag ntaus ntawv feem ua ke, mus cuag ib tug tej yam muaj nuj nqi ntawm ib tug txheej txheem ntim, ntim tshuab kom tsim ib tug system los yog subsystem.
Muaj feem ntau yog ob txoj kev los twb paub lawm cov nuj nqi hluav taws xob system, ib tug yog SOC, thiab cov hluav taws xob system yog pom tau hais rau ib nti uas muaj integration.Another yog SIP, uas integrates CMOS thiab lwm yam kev circuits thiab hluav taws xob Cheebtsam rau hauv ib lub pob siv mature ua ke nrog los yog interconnection technology, uas muaj peev xwm ua tau tag nrho cov tshuab muaj nuj nqi los ntawm thaum uas tig mus overlay ntawm ntau yam kev haumxeeb chips.
Cov chav kawm ntawv board belongs rau PCB hardboard, thiab nws cov txheej txheem yog nruab nrab ntawm siab thiaj HDI thiab IC phaj, thiab lub high-end HDI manufacturers thiab IC board manufacturers muaj lub sij hawm mus koom.
HDI manufacturers muaj ntau dynamic, tawm los yuav tsum key.Compared nrog IC phaj, HDI tau ua nce kev sib tw thiab tau ua ib tug liab hiav txwv ua lag luam, nrog rau cov nyiaj margins declining.Face cov chav kawm ntawv loading board, lub sijhawm ntawm HDI manufacturers yuav tau txais cov tshiab txiav txim, rau ib txhais tes, nyob rau lwm yam tes yeej twb paub lawm cov khoom txawj tej yam ntxiv, optimizing cov khoom mix thiab lub theem ntawm cov nyiaj tau, yog li ntawd npaj siab yuav mus muaj zog dua, muaj hwj chim loj tus thawj layout.
Vim rau tus txheej txheem ntau dua chav kawm ntawv loading board, HDI manufacturers tau mus nqis peev los yog tshiab raug cov khoom kev hloov kho, thiab MSAP txheej txheem technology rau HDI manufacturers kuj yuav tsum tau kawm lub sij hawm, los ntawm qhov sib rho txoj kev mus rau hauv MSAP, khoom tawm los yuav qhov tseem ceeb.
8. LED sai kev loj hlob ntawm siab thermal conductivity CCL ua ib tug kub spot.The me me yov LED muaj qhov zoo ntawm unspelt, zoo zaub nyhuv thiab ntev kev pab cuam lub neej. Nyob rau hauv xyoo tsis ntev los, nws tau pib mus rau ris, thiab nws twb tau loj hlob sai heev. Raws li, qhov yuav tsum tau siab thermal conductivity CCL tau los ua ib tug kub cov nqaij ntawd.
Lub tsheb PCB rau cov khoom zoo thiab kev cia siab yuav tsum muaj nruj heev, thiab ntau dua kev siv ntawm tshwj xeeb kev kawm ntaub ntawv CCL.Automotive electronics yog ib qho tseem ceeb PCB downstream daim ntaub ntawv. Automotive hluav taws xob khoom uas yuav tsum ua raws li tsheb raws li ib tug txhais tau tias kev thauj yuav tsum muaj tus yam ntxwv ntawm kub, kev nyab xeeb, voltage hloov mus hloov los, electromagnetic cuam, kev co thiab lwm yam coj muaj peev xwm mus rau qib siab uas yuav tsum tau rau tsheb PCB ntaub ntawv muab tso rau pem hauv ntej ntau dua uas yuav tsum tau, rau kev siv ntawm ntau Tshwj xeeb kev kawm ntaub ntawv (xws li cov TG cov ntaub ntawv, anti-CAF (compressed asbestos fiber) cov ntaub ntawv, tuab tooj liab cov ntaub ntawv thiab tej hub cov ntaub ntawv, thiab lwm yam) CCL.