1. E like me ka nui lolouila hūlili, PCB ua hoʻohana 'ia no ka aneane pau lolouila huahana, ua noʻonoʻo "ka makuahine o ka lolouila'ōnaehana huahana," Ua lilo konaʻanoʻenehana loli a me ka makeke kū i ke au i ka pulakaumaka o ka noonoo ana o na mea he nui pāʻoihana.
Currently, ma laila nō nā ahuwale LIKE ma ka lolouila huahana: kekahi mea lahilahi, a pōkole,ʻo nā mea kiʻekiʻe alapine (frequency), kiʻekiʻe ka māmā holo lalo iho PCB pela i kiʻekiʻe nuʻa, kiʻekiʻe hoʻohui ', encapsulation, maalea, a me ka olelo o mau stratification, ulu koi no ka ka luna, ahu iho PCB a me ka HDI .
Top pcb board wiring length is short, low impedance circuit, high-frequency high-speed work, stable performance, can take on more complex function, is to the high frequency electronic technology, multi-function large capacity development inevitable trend.In particular, the in-depth application of large-scale integrated circuits will further drive PCB to high precision and high level.
2. I keia manawa, PCB uaʻano nui hoʻohana no ka hale nā mīkini home, PC,ʻoneki a me nā lolouila huahana, oiai kiʻekiʻe-hope noi e like me kiʻekiʻe hana nunui-ala kikowaena, a me ka aerospace e koi i ka i oi mamua o 10 mau papa o PCB.Take ke kikowaena me lakou i mea hoike, i ka PCB papa ma luna o ka mea hookahi, a elua-ala KikowaenaUa mea nuiʻana ma waena o 4-8 papa , oiai i ka papa kuhikuhiE papa o ka mea kiʻekiʻe-hopena KikowaenaUa, e like me 4 a me 8 alanui, pono oi ma mua o 16 mau papa , a me ka backplate koi o luna 20 papa.
HDI pilina nuʻa pili i ka maʻamau multilayer pcb papa he maopopo pono, i mea no ka papa i waeia o ka mainboard oʻikena smartphone.Smartphone kuleana pili i increasingly eiiieaena a me ka leo i Lightweight kūpono 'ana, emi emi a me ka lewa no ka papa kuhikuhiE papa, e noi mai ana kaupalena' lawe hou o na eiiiiiaiou ma luna o ka papa kuhikuhiE papa, ano nunui-, ahu iho papa i ua paakiki e halawai me ke koi.
High-pa apŘ interconnection huakai kaapuni a ka papa (HDI) apono i ka ua laminekaʻia loio i'ōnaehana ka papa, i ka maʻamau multilayer papa like me ka Kora naʻEsau papa stacking, ka hoʻohana 'ana o kaʻeli, a me ka puka metallization kaʻina, e nā papa o ka laina ma waena o ka pilina kuleana pili i maloko. Ke hoʻohālikelike me kaʻike mau ma-puka wale multilayer pcb papa, HDI pololei e kuhikuhi i ka helu o ka makapo Via, a kanu Via e emi i ka helu ana o Via, hoopakele PCBʻia wahi, a me ka nui loa maoli ke keʻena nuʻa, pela hoʻomaka koke pau ai ka multilayer ana i loko o Phone Laminating ka papa haʻawina. 
The technical difference of HDI is reflected in the increment stacked number, the more layer quantity, the more difficult the technology.HDI can be divided into single stacked HDI, doule stacked HDI, triple stacked HDI,or high stacked HDI, etc., the number of layers is expressed as C+N+ C, where N is the number of normal core laminar, and C is the number of added layers, namely the stacked number of HDI..High stacked HDI cabling has higher density, but at the same time, it has more pressure, such as position, punch hole and copper plating, etc., which has higher requirements on the technical process and process capability of the manufacturer.
Popular i ka makahiki hou i loko o ka kiʻekiʻe-hopena Phone ākeʻakeʻa kumu, ahu iho HDI ua i ka lani kiekie loa noae o HDI, noi aku kekahi i makapo lua pili ma waena o e pili papa, ma ke kumu o ke ano o HDI makemake hoola aneane hapalua o ka buke, no laila, e like me ka hana hou lumi no ka pu ki aloha a me na wahi e ae.
Kekahi, ahu iho o HDI pono i ka hoʻohana 'ana o ka holomua loea e like me kukunaʻeli a electroplated puka kuʻina koʻo, i mea ka loa paakiki? Iecaianoaaiiuo a me ka mea kiekie loa waiwai-i hoʻohuiʻia HDI type, i hiki pono noonoo i ka oaoieei-kiʻekiʻe o HDI. 
Two important trends of the automobile industry are intelligent and electric.ADAS (Advanced Driver Assistance System) as the transition of complete intelligent driving before, has become a major automakers and crossover of Internet giant rushed to the layout of the new strategic highland, it involves the electronic device cover nearly all of the whole vehicle driving and safety related System, with the rapid penetration of ADAS, comprehensive automobile electronic level will be raised.
3. A hou ikehu kaa ua ho i ka olelo o ka uila kaʻa, like me ka hana kuʻuna kaʻa, ke noi kiʻekiʻe o ka lolouila ilikai, mīkini uila no ka loina Hawaii koina hoike ia ma kahi o 25%, 45% e 45% i loko o ka hou ikehu kaa , kū hoʻokahi mana ke kāohi'ōnaehana (BMS, VCU a me MCU), ka hoolaha aku i ke kaa i PCB oAaEeIeIAaIAeO mea nui ma mua o ka hana kuʻuna kaʻa, i ka ekolu mana hooponopono'ōnaehana PCB oAaEeIeIAaIAeO awelike o ma kahi o 3-5ʻahā like mika, i ka nui o ke kaa PCB waena 5-8 ʻahā like mika.
4. Ka ulu a'Ada, a me ka mea hou ikehu kaa, kipakuʻia nā huila, ua i mālama i ke kaʻa uilaʻoe kuai ulu i ka makahiki ana o ka oi ma mua o 15 pakeneka i ka hou years.Accordingly, e hoʻomau i luna o ka makeke o PCB, a me ia mea wānana i ka? iecaianoaaiiie o PCB, e oi aku mamua o $ 4 ieeeea? i ka 2018, a me ka ulu nā mea kū ka loa maopopo, injecting hou momentum i loko o ka PCB oihana puolo.
5. Phone ua Ua he nui Keaukaha o ka PCB hana i loko o ka past.Mobile Internet au, oi a oi mea hoʻohana mai PC i lawe lima maʻi pono, i ke kūlana o ka PC Me anuu koke auou caiaiai ia ma ka lawe lima maʻi, mai 2008, global consumer lolouila eiiiiiaiou hana hookeai kūpono 'ana, o ka oi aku i ka 2012 ~ 2014, Phone i loko o kokololio infiltration.Therefore, ka kokololio ulu o ka PCB ua kipakuia ma ka lalo iho o ka lawe lima maʻi poe e akamai phones.Between 2010 a me 2014, i ka Phone market ma ka lalo iho o ka PCB i hiki aku ai ka awelika makahiki hui ka ulu ana o ka 24%, mamao e oi aku ana o nā lalo iho na hana, hoomaopopo ana i ka ulu Keaukaha ka papa kuhikuhi no ka PCB oihana puolo.
Ma kiʻekiʻe-hope PCB, HDI, no kekahi laʻana, lawe lima kelepona mea he kahiko HDI market, i ka 2015, no ka laʻana, Phone hoike no ka oi ma mua o ka hapalua o ka like ana, a mai ke kuanaʻike o akamai kaul, ka makana hou hana Aneane pau huahana hoʻohana HDI like motherboard.
Ua mai ke kuanaʻike o ka PCB a me kiʻekiʻe-hope HDI, ka mea, o ka mämä holo kiʻekiʻe o ka Phone ka ulu ana e hiki aku ai i ka pomaikai koi lalo iho, pela kākoʻo i ka ulu ana o global PCB pono hana.
Akā,ʻaʻohe mea e hoole ana i ka Phone market i ka meheu o ia mai 2014, ma hope o ka kokololio infiltration manawa a me ka holo komo o Phone i loko o ka pua paha era.On ka global kuai, ka mea hope loa paha kēla mai IDC2016 hoʻokuʻuʻia i loko o November 2016, i ka global Phone shipments i ka 2016, ua manaoia e e 1,45 ieeeea? a £, a me ka nui Lele i loko o ka ulu ana o ka pono 0,6 percent.In hua'ōlelo o ka uluʻikepili, eia nae ka hapalua o ka PCB ka lalo iho noi i no i kākoʻo 'ia ma ka lawe lima kaul, loa PCB waeʻano, a me HDI, ua ka meheu o loko o ka Mobile maʻi wahi.
ʻOiai ma ka pōʻaiapili o ka oicyenoaaiiie downturn, Phone hana i loko o ka lua o ka hapalua o ka foregone ka hopena, akā, ma luna o ke kumu o ka lahuikanaka nui, ma muli o ia i ka h ÷ ike ia nā kanaka kūʻai aku, e hahai mai, consumer koi e kipaku aku i ka replacement.The nui kumukuai makeke o akamai kaul nō he nuiʻia, a me na kanaka kūʻai aku o ka maʻi, e hana i ko lakou pono i ka hoʻoikaika 'ana i nā mea kūʻai mai'ʻeha wahi no laila, e like me ka hoʻoulu koi a me ka mea loaʻa market share.As i ka hopena, ka mea akamai kelepona, e like me ka ka papa lalo iho noi o ka PCB i loko o ka hala, ua loa'aʻia nui no ka ulu ana o PCB i loko o ka nui kumukuai palena.
Over ka elua a ekolu makahiki i hala o akamai kelepona? Acaeoey au, fingerprint iaia, 3D Lumia, nui pale, pālua pahupaʻiwikiō a me nā ana HOU i ka pukaʻana, akā, i hoʻomau i ka hoʻoulu hope upgrade.
Ma ka pōʻaiapili o ka lawe lima kaul komo i ka makahiki o ke kumukuai, o ka nui ka leo kumu hoʻoholo i ka pili ka ulu ana, kena ae la ia e ka HOU o kuai kumu e nō e alakaʻi i ka nui mahuahua i loko o nā aliʻi e kāpae nui o demand.Stock o ka HOU kekahi e loli ai global PCB, ina wā e hiki mai Phone HOU upgrade ma ka PCB, e noonoo pono i ka kanawai lawe lima kelepona Hookah kaʻenaʻena ukana nui a me nā pane-i, e, HOU upgrade e hōʻeleu i anal, pela ikeia like i ka'ōnohi, acoustic, etc.
6. hoʻomālama ma ka PCB hana, ka outbreak o FPC a me kekahi, ahu iho o ka interconnection HDI,ʻo nā Manufacturers e hahai mai, a me ka wahi Pāhawewe i ka ili, e lilo i kumu hoʻohālike o kokololio anal:
FPC ua iʻikeʻia e like me "'ōlewa pcb", mea he'ōlewa polyimide a polyester ho film kumu lako e i o ka'ōlewa pai kaapuni papa, a me ka pa apŘ kiʻekiʻe o ka pilina, malamalama ke kaupaonaʻana, mānoanoa lahilahi,'ōlewa, kiʻekiʻe kohoʻia, hana hoʻomoʻa i ke au o ka ka lolouila huahana Lightweight,'ōlewa au.
Hoʻohana 'ia i loko o kona iPhone i ka 16 na apana o FPC, loaʻa o ke ao nei i ka nui loa FPC, ao ka lunaʻeono FPC Hookah ka papa kuhikuhiE nā mea kūʻai mai i Manufacturers e like me kii onohi, Samsung, huawei, OPPO ma lalo o ohia h ÷ ike i ka hōʻoi' kona FPC oAaEeIeIAaIAeO o Phone.
Phone like me ka iniiaiie holo ikaika, i ka ulu ana o FPC mea mai ka ohia a me kona h ÷ ike kanawai pomaikai, FPC hoʻomaka koke permeate, 09 ke malama i ulu kiʻekiʻe, i kela makahiki mai 15 makahiki e like me ka mea wale nō kahi lilelile i loko o PCB hana, lilo iho la ka mea wale maikaʻi ulu waeʻano .
7. kūpapakū-Like PCB (haawiia i like SLP) ma HDI enehana ka, ma muli o ka M-SAP kaʻina, hiki no hoi hoʻoheheʻe au i ka laina, o ka hou hanauna o ke olonā i laina pai puni papa.
Ka papa papa (SLP) o ka aʻe hanauna PCB hardboard, i hiki ke hoopokole mai 40/40 microns o HDI i 30/30 microns.From kaʻina wahi o ka hoomaopopo, papa hoʻouka papa kokoke e hoʻohana 'ia i loko o ka mea uholo uila'ōpala IC papa, akā, i aole nae e hiki i ka IC o na hoakaka o ka haawe papa, a me kona manao ua nō e hali ana me ka dukima OE eiiiiiaiou, ua no e pili ana i ka papa kuhikuhiE? acoeueoao a hiki i ka mahele o ka PCB.For kēia hou ke olonā i laina pai pā waeʻano, ua makemake ano o na ana ekolu o kona hoouku kāʻei kua, manufacturing kaʻina a me ka Loaʻaʻia suppliers.Why hana oe e makemake ana i ka papa e haawe papa: loa maemae laina superposition e hō mai noʻu'ōpala koi, kiʻekiʻe nuʻa mea no ka papa kuhikuhiE laina, akamai kaul, na papa, a me ka wearable manaʻo, a nā lolouila huahana e hoʻomōhala i loko o ke kauoha o ka miniaturization a me ka muti_function loli, e lawe i ka helu o eiiiiiaiou ua nui mahuahua no ka huakai kaapuni a papa la,, oi a me ka nui nae i kaupalena '.
Ma kēia pōʻaiapili, PCB uea laula, spacing, ke anawaena o ka anakahi iki panel, a me ka puka oaio loihi, a me ke alakaʻi mele, ahu iho, a me ka mānoanoa o ka hō'īpale, ahu iho e haule, a e ka PCB e ho'ēmi i nui, ke kaupaonaʻana a me ka leo o ka hihia, ia hiki lawa hou components.As Moore ka kānāwai mea i semiconductors, kiʻekiʻe nuʻa mea he paakiki alualu o pai ia huakai kaapuni papa:
Loa piha kaapuni koi, uaʻoi kona kiʻekiʻe ma mua o HDI.High nuʻa kipaku ka PCB, e hoomaemae i ka laina, a me ke kukulu ana o ka poepoe (BGA) ua hoopokole.
I kekahi mau makahiki aku nei, i ka 0,6 mm o ia 0,8 mm o kēpau enehana i ua hoʻohana ma o ka handheld manaʻo, i kēia hanauna o akamai kaul, no ka mea, o ka nui o ka I / O ke keʻena, a huahana miniaturization, PCB kaiāulu hoʻohana i ka 'ike loea hou a 0,4 mm o kona nui. kēia au ua ulu i 0.3mm. I mea, o ka hooulu ana o 0.3mm nahā i ka 'enehana no ka lawe lima maʻi ua begun.At mua ka ia manawa, o ka nui o ka micropore a me ke anawaena o ka ai pili aku iwi kuamoʻo i ua hoemi ia i ka 75 mm o a me ka 200 mm o kekahi me kekahi.
Ka hana ka pahuhopu mea e papa micropores a me nā iwi kuamoʻo i 50mm a me 150mm niioaaonoaaiii ma ka hope kakaikahi years.The 0.3mm spacing mea i manao ai hoakaka pono ia ka laina laula laina o 30 / 30μm.
ia papa papa fits e hō mai noʻu'ōpala hoakaka more.SIP'ōnaehana pae'ōpala enehana ka, ma muli o ka mana o ka lahui mea uholo uila laina hui (ITRS): e hō mai noʻu no ka mau hana lolouila eiiiiiaiou me kekahi mau oihana, a koho OE eiiiiiaiou, a me nā manaʻo e like me MEMS a 'ōnohi ka manaʻo makakoho pu, e hoʻokō i kekahi hana o hookahi maʻamau'ōpala,'ōpala 'ike loea i ka hana i ka'ōnaehana a subsystem.
Aia nō IeAUPIIe, IAa IO mau aoao elua, e hoʻomaopopo i ka hana o ka lolouila nenoaiu, kekahi mea SOC, a me ka lolouila nenoaia ua hoʻomaopopo loa ma luna o ka mea hookahi? Inoaia me kiʻekiʻe integration.Another mea e hō mai noʻu, a integrates CMOS a me nā noniakahi wahi i puhi ai a me ka lolouila eiiiiiaiou i loko o ka AEeAaOA hoʻohana oʻo ana ai 'ole interconnection enehana, a hiki kū i ka mīkini hana a pau ma ka laua uhi o kela ooieoeiiaeuiuo? inoaia.
Ka papa papa no e PCB hardboard, a me kona kaʻina mea ma waena o kiʻekiʻe aoao HDI a me IC papa, a me ke kiʻekiʻe-hope HDI Manufacturers a me IC papa Manufacturers i ka manawa e komo.
HDI Manufacturers i oi hōʻeuʻeu, hua e e key.Compared me IC papa, HDI ua lilo hoʻokūkū nui, a ua lilo ia i kai market ulaula, me ka pono margins declining.Face ka papa hoʻouka papa, i ka manawa o HDI Manufacturers hiki ke kiʻi i ka hou kauoha, ma kekahi lima, ma ka kekahi lima ke hoʻomaopopo huahana upgrade, optimizing i ka huina hoonui Aloha a me ka nui o ka loaʻa kālā, no laila, ke makemake nei oukou i ka ikaika, nui mana keʻia mua.
Aie i ke kaʻina hana ma luna papa hoʻouka papa, HDI Manufacturers e kālele 'ai hou manufacturing? Ieaoa hoʻololi', a me MSAP kaʻina 'ike loea hou no HDI Manufacturers hoi pono ke aʻo' manawa, mai ka subtraction ano i loko o MSAP, huahana hua e e kī.
8. alakai kokololio ulu o kiʻekiʻe thermal conductivity CCL lilo i ka wela spot.The uuku spacing LED i na pono o unspelt, maikaʻi 'ia ai a me ka lōʻihi hana ola. Ma nā makahiki, ka mea, ua hoomaka e permeate, a me ka mea, ua ulu hikiwawe loa. Alaila, ke koi 'ia kiʻekiʻe thermal conductivity CCL Ua lilo i ka wela ke kina ole.
Kaa PCB ma ka huina hoonui ka pono a me ka pono koi i loa ikaika, a me ka oi ana o ka kūikawā hana lako CCL.Automotive uila no mea he nui PCB lalo iho noi. Kaʻa lolouila huahana pono mua halawai me ke kaʻa me ke kumu o ke amo pono i na ano o ka mahana, aniau, anakahi uila fluctuations, electromagnetic a 'ākeʻakeʻa, kamakawiwo ole a me ka' ē aʻe adaptive hiki i kiekie ae olelo no kaʻa PCB lako i aku kiekie ae e pono ai, ke hoʻohana 'o hou Special hana lako (e like me kiʻekiʻe Tg kumuhana, Anati-CAF ('opihia asbestos puluniu) kumuhana, ao ke keleawe a me ka mea pālolo mea, etc.) CCL.