1. Me ya sa yake da kewaye hukumar da ake bukata sosai lebur
A atomatik sa line, idan bugu kewaye hukumar ba lebur, shi zai sa wurin ya zama m, da aka gyara ba za a iya saka a cikin rami da kuma surface na farantin, kuma ko da na atomatik toshe loader.When da PCB jirgin wanda ya tattara bangaren da aka welded bayan soldering, da kuma kafa na kashi ne da wuya za a yanke neatly.The PCB jirgin ma ba za a iya shigar a cikin na'ura akwatin ko da soket a cikin na'ura, don haka, da PCB taron factory taron farantin warped ne ma troublesome.At halin yanzu, bugu kewaye hukumar ya shiga cikin zamanin surface shigarwa da kuma guntu da kafuwa, kuma da buga kewaye hukumar taro shuka dole ne mafi kuma mafi m tare da umurni na farantin warped.
2. Standard da gwajin hanyoyin domin warp
cewar Amurka IPC-6012 (1996 edition) << m buga kewaye hukumar ganewa da kuma yi bayani dalla-dalla >>, da canja iyakar warping da murdiya na surface hawa farantin ne 0.75%, da kuma duk sauran PCB allon an yarda 1.5% .Wannan ya karu da bukatun ga surface hawa farantin kwamitin da IPC-RB-276 (1992 version) .A halin yanzu, warp digiri na lasisi daga kowane lantarki PCB taron shuka, wani al'amari biyu ko Multi-Layer PCB, 1.6mm kauri, yawanci 0,70 ~ 0.75%, da yawa SMT, BGA farantin, da ake bukata shi ne 0.5% .Wasu lantarki masana'antu suna neman wani 0.3 kashi karuwa a warping matsayin, da kuma gwajin warping matakan bi gb4677. 5-84 ko IPC-TM-650.2.4.22b.Put PCB jirgin a kan wani tabbatar dandali, da gwajin allura zuwa warp digiri na most gida, don gwada diamita da allura, raba da kwana tsawon PCB jirgin, warp digiri na buga kewaye hukumar za a iya lasafta.
3. Warping a lokacin masana'antu tsari
1. Engineering zane: zane na bugu kewaye hukumar za a lura:
A. A tsari na prepreg tsakanin yadudduka ya zama tsakaitã, kamar shida laminates PCB Board , da kauri daga 1 ~ 2 da kuma 5 ~ 6 yadudduka ya zama daidai da yawan Semi-ƙarfafa guda, in ba haka ba da Layer matsa lamba zai zama da sauki warp.
B. Multi-laminated core PCB da kuma Semi-warke Allunan za a yi amfani a cikin wannan maroki ta kayayyakin.
C. The yankin na matsanancin A da B Lines kasance kusa yadda possible.If A fuska ne A manyan jan surface, da kuma B ne kawai A 'yan Lines, farantin ne sauki warp bayan etching.If bangarorin biyu na line yanki bambanci ne ma manyan, za ka iya ƙara wasu sha'aninsu dabam Grid a kan ramammu gefe, domin daidaita.
2, Baking jirgin kafin yankan:
CCL yin burodi PCB jirgin kafin yankan (150 darajõji, 8 ± 2 hours) ga manufar ne a cire danshi a ciki jirgin, da kuma sa guduro warke cikin farantin, kara kashewa saura danniya a farantin, wanda ne da taimako ga hana jirgin warping.At ba, da yawa biyu mai gefe PCB, Multi-Layer PCB allon har yanzu bi da pre-blanking ko post-yin burodi step.But akwai kuma wasu PCB hukumar masana'antu factory, yanzu da PCB kewaye hukumar factory yin burodi kwamitin lokaci dokoki kuma saba, jere daga 4 zuwa 10 hours, da shawarar cewa aji bisa ga samar da buga kewaye hukumarda kuma abokin ciniki bukatar warp digiri decide.Cut cikin guda ko bayan dukan yanki na gasa gasa tanda, yanka da abu, da hanyoyi guda biyu ne m, shi ne shawarar yankan katako bayan yankan. A ciki hukumar kamata kuma ya kasance bushewa jirgin.
3. A warp da weft na prepreg:
Bayan da prepreg lamination, da shrinkage a warp da weft kwatance ne daban-daban, da kuma warp da weft kwatance dole ne a iya bambanta a lokacin da blanking da stacking.Otherwise, shi ne mai sauki warp ƙãre farantin bayan laminating, ko idan yana da wuya a gyara. Multi-Layer PCB warping dalilai, da yawa daga cikin lamination na prepreg lokacin da warp da weft bai bambanta tsakanin, tare da la'akari kwafi sa ta.
Yadda za a rarrabe tsakanin latitud da longitude? Roll prepreg birgima up shugabanci ne warp, da kuma fadin shugabanci ne weft. jan tsare jirgin ga dogon gefen latitudinal, short gefe ne warp, idan ba ka tabbatar da duba da manufacturer ko maroki.
4. Danniya bayan laminating:
multilayer PCB jirgin, bayan an cika da zafi-latsa sanyi-manema yanke ko milling burrs, sa'an nan lebur a kan yin burodi a cikin tanda 150 digiri Celsius for 4 hours, don haka da cewa intraplate danniya hankali saki da kuma sa guduro warke , wannan mataki da aka tsallake.
5. Bukatar daidaita da bakin ciki farantin yayin plating:
0.4 ~ 0.6mm bakin ciki Multi-Layer PCB kwamitin domin kewaye hukumar plating kuma mai hoto plating ya kamata a yi na musamman Nip yi, atomatik plating layi a kan Feiba clip a kan takardar, da zagaye mashaya ga dukan clip a kan Fiba The kirtani ne strung tare domin daidaita dukan buga kewaye allon a kan abin nadi haka cewa plated faranti ba zai deform. Ba tare da wannan ma'auni, bayan annabcin ashirin ko talatin microns na jan Layer, da takardar za a iya lankwasa, kuma da wuya a magani.
6. Board sanyaya bayan zafi iska leveling:
A zafi iska na buga kewaye hukumar aka shafi cikin high zafin jiki na solder ƙullunku (game da 250 digiri Celsius). Bayan an cire, ya kamata a sa a cikin lebur marmara ko karfe farantin su kwantar da sauƙi, sa'an nan da post-aiki inji shi ne cleaned.This ne mai kyau ga warping na boards.Some factory don bunkasa kwarjinin da surface gubar , da kuza, da jirgin a cikin ruwan sanyi, nan da nan bayan zafi iska leveling fitar bayan 'yan dakikoki a reprocessing, irin wannan zazzabi mai sanyi tura, domin wasu iri allon ne wata ila don samar da warping, hanyõyi, ko blister.In bugu da kari, da iska iyo gado za a iya kara kwantar da kayan aiki.
7. warping kwamitin aiki:
A wata rijiya-gudanar factory, kwamitin zai yi a 100% flatness rajistan shiga a karshe dubawa. All unacceptable PCB allon za a tsince daga, sanya shi a cikin wani tanda, gasa a 150 digiri Celsius da kuma nauyi matsa lamba ga 3 zuwa 6 hours, kuma a karkashin matsin lamba na halitta sanyaya. Sa'an nan sauke da farantin karfe kuma cire PCB jirgin, a cikin flatness rajistan shiga, don haka da wani ɓangare na jirgin za a iya ceto, da kuma wasu buga kewaye allon bukatar zama biyu zuwa sau uku da gasa domin level.If da muka ambata a sama anti -warping aiwatar da matakan ba su aiwatar, wasu kwamitin yin burodi ne m, kawai tarwatsa.