Ainihin manufar PCB surface jiyya ne don tabbatar da kyau weldability ko lantarki performance.Because da na halitta jan a cikin iska o ƙarin tabbatar da zama a cikin nau'i na oxides, abu ne mai wuya ga zama tagulla na dogon lokaci, don haka jan ake bukata ga sauran jiyya .
1.Hot Air leveling (Hal / HASL)
Hot iska leveling, kuma aka sani da zafi iska solder leveling (fiye da aka sani a matsayin Hal / HASL), wanda aka mai rufi a kan PCB surface dumama zubi tin solder (gubar) da kuma amfani da matsa iska da dukan (duka) lebur fasaha, yin halittarsa a Layer na jan karfe hadawan abu da iskar shaka da juriya, da kuma iya samar da kyau weldability na shafi layer.The solder da kuma jan aka kafa a cikin hadin gwiwa ta samar da wata compound.The PCB ya kamata a nutsa cikin zurfin zubi solder a lokacin zafi iska conditioning.The iska wuka flushes ruwa solder kafin solder solidifies.The iska wuka iya rage girman lankwasawa na solder a kan jan surface da kuma hana waldi gada.
2.Organic Weldable kariya Agent (OSP)
OSP aka buga kewaye hukumar (PCB) jan tsare surface lura da wani irin fasahar saduwa da bukatun na RoHS directive.OSP ne wani raguwa na Organic Solderability hana aifuwa na maza. Haka kuma an sani a matsayin Organic soldering film, kuma aka sani da jan karfe m, kuma ma da aka sani da Preflux a English.In a dunƙule, da OSP ne chemically modified Layer na Organic fata a farfajiya na da tsabta, danda copper.This film yana da anti-hadawan abu da iskar shaka, thermal buga da kuma danshi juriya, wanda za a iya kare jan surface daga tsatsa (hadawan abu da iskar shaka ko vulcanization) a al'ada environment.But a cikin m waldi zafi, m film da kuma dole ne sauri cire ta juyi da sauƙi, sai kawai zai iya yi tsabta da jan surface na nuna shi ne a cikin wani dan kankanin lokaci da zubi solder nan da nan zama m solder gidajen abinci.
3.Full farantin nickel / Gold
Plate nickel / Gold ne plated a farfajiya na PCB sa'an nan dalaye su da wani Layer na zinariya. A nickel plating ne yafi su hana yadawa na zinariya, kuma copper.Now akwai iri biyu electroplating nickel zinariya: taushi zinariya plating (zinariya, zinariya surface dubi ba mai haske) da wuya zinariya plating (surface ne m, kuma m, sa-kãfira , dauke da wasu abubuwa kamar cobalt, zinariya ya dubi karin haske) .Soft zinariya ne, yafi amfani ga guntu marufi zinariya waya; The wuya zinariya ne, yafi amfani ga lantarki ta musayar in ba waldi yankunan.
4.Immersion Gold
nutsewa zinariya aka rufi da wani lokacin farin ciki, electrically kyau nickel-zinariya gami a kan jan surface, wanda zai iya kare PCB na dogon time.In Bugu da kari, shi yana da ha} uri na sauran surface jiyya technologies.In Bugu da kari, nitsewa zinariya kuma iya hana rushe na jan karfe, wanda zai zama da amfani ga kai-free taro.
5.Immersion Tin
Tun da dukan solders su ne bisa tin, da kuza Layer iya daidaita da kowane irin solder.Tin tsari tsakanin lebur jan tin mahadi za a iya kafa, wannan alama da ke sa nauyi tin yana da kamar zafi iska leveling na da kyau weldability kuma babu zafi iska leveling flatness na ciwon kai matsala. nutsewa tin ba za a iya adana for yi tsawo da yawa dole a taru bisa ga tsari na magance tin.
6.Immersion Azurfa
The azurfa tsari ne tsakanin kwayoyin shafi da kuma electroless nickel plating. A tsari ne mai sauki kuma fast.Even lokacin da fallasa su zafi, zafi da kuma gurbatawa, da azurfa iya kula da kyau weldability amma zai rasa luster.The azurfa ba shi da da mai kyau jiki ƙarfi daga cikin sinadaran plating nickel / nitsewa zinariya domin babu nickel karkashin azurfa Layer.
7.ENEPIG (Electroless nickel Electroless palladium nutsewa Gold)
Idan aka kwatanta da ENEPIG da ENIG, akwai wani ƙarin Layer na palladium tsakanin nickel da zinariya. Palladium iya hana lalata sabon abu ya sa ta canzawa dauki, da kuma yin cikakken shiri domin nutsewa gold.Gold ne a hankali rufe palladium, samar da mai kyau dubawa.
8.Plating Hard Gold
Domin inganta lalacewa-kãfira dukiya daga cikin samfurin, kara sa yawan da plating wuya zinariya.
